Taiwan is "world's largest semiconductor equipment market"
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SEMICON Taiwan marks 15th anniversary
Updated Tuesday, September 7, 2010 11:17 pm TWN, By Alan Fong, The China Post
In the important exhibition's 15th year being held in Taiwan, the 2010 SEMICON will highlight eight themes pivotal to the future of the industry:
LEDs (light-emitting diodes),
MEMS (micro-electro-mechanical systems),
3D ICs (three-dimensional integrated circuits) &
Advanced Packaging/Testing,
green management,
compound semiconductors,
CMP (chemical mechanical planarization),
AOI (automated optical inspection) and
secondary markets for capital equipment. Specific pavilions are allocated to each of these themes with three additional region-themed pavilions: Cross-Strait Pavilion, Korea Pavilion and France Pavilion, said Terry Tsao, president of SEMI (Semiconductor Equipment and Materials International) Taiwan and Southeast Asia at a pre-show press conference yesterday.
From left: Huang Kae, Christopher Wargo, Dr. Tong Ho-ming, Dr. Burn Lin, Dr. Ching Hu, Giuseppe Izzo, and Terry Tsao pose for photos during a news conference for the SEMICON Taiwan 2010, held yesterday. (Courtesy of SEMICON Taiwan)
A total of 560 exhibitors from 17 countries will participate in the exhibition, occupying 1,150 booths, in which over 163 exhibitors will be showcasing their new products.
The host country has been the center of the semiconductor industry in 2010.
According to the 2010 mid-year edition of the SEMI Capital Equipment Forecast, Taiwan accounted for the lion's share of the global semiconductor equipment market; experiencing rapid growth in all regions in 2010.
The island is home to the world's largest semiconductor equipment market, occupying US$9.18 billion of the US$32.5 billion in global sales forecasted.
In the highlight of yesterday's press conference, a panel of executives from some of the industry's main players discussed how innovative collaboration can be the key of for technology advancement. Giuseppe Izzo, STMicroelectronics' regional vice president of greater China and South Asia, pointed out that mobility will be an important trend for the semiconductor industry, leading to the need for ever-smaller CPUs, GPUs and APs in mobile devices such as smartphones and tablet computers, more powerful telecommunication networks, power supply with higher sufficiency, etc. Innovations in semiconductor applications in other fields such as cloud computing, LEDs, bio-medical devices and data security will also be important to the industry, Izzo said.
As the exponential advancement of miniaturization technology predicted by the once seemingly infallible Moore's Law, which states that the amount of transistors on a chip will double roughly every two years, is questioned by its creator, Intel co-founder Gordon Moore, himself, the industry is looking for cutting-edge technologies to sustain its growth. One such emerging technology is MEMS; the groundbreaking mix of nanoelectromechanical systems (NEMS) and nanotechnology that has the potential to change the future for every silicon-related product.
Dr. Ching Hu, president of Touch Micro-system Technology Corp., pointed out that while wide application of MEMS is at its early stage and mass production of such technologies is still a challenge, the micro-system can revolutionize products such as mobile devices, game consoles, 3-dimensional projectors, pico-projectors, etc. One of the challenges facing Taiwanese manufacturers is their lack of know-how in developing a humanized interface, Hu said.
Another way around Moore's Law is the 3D IC and packaging technologies, said Dr. Tong Ho-ming, general manager and chief technology officer of the ASE Group. Despite tremendous progress in recent years, 3D IC with through silicon vias (TSVs) still presents significant challenges in cost, design, manufacturing, test and supply chain readiness and the technology is still three to five years away from mass production, Tong said.
Innovation and cooperation are also needed in green semiconductor manufacturing, said Hsu Fang-ming, deputy-director of the Taiwan Semiconductor Manufacturing Company (TSMC). He called for the industry to work at both global and local levels to tackle the challenge.
Other executives at the panel included Dr. Burn Lin, senior director at TSMC's Nano Patterning Technology Division."