Mingtai Microelectronics Advanced Packaging and Testing Project Tops Out with 500 Million Yuan Investment
On July 17, 2026, Sichuan Mingtai Microelectronics announced that the main structure of its Phase II advanced packaging and testing production project has been successfully topped out. This milestone marks a significant breakthrough in the company’s strategy to expand capacity and upgrade technology, injecting new momentum into the integrated circuit (IC) industry cluster in Neijiang, Sichuan.
The project involves a total investment of 500 million yuan (~$70 million USD), covers an area of 25 mu (approx. 1.67 hectares), and has a total construction area of 45,000 square meters. It is a key regional initiative aimed at strengthening high-end IC packaging and testing capabilities. Upon completion, the facility will feature high-standard cleanrooms and introduce advanced equipment, including fully automated packaging lines and high-precision intelligent testing devices. This will significantly enhance production accuracy, efficiency, and competitiveness in the high-end chip market.
Construction began in November 2025. The project is scheduled for full completion and delivery by February 2027. Once operational, the project will add an annual capacity of over 10 billion high-end IC packages, helping to fill the regional gap in advanced packaging capacity. It is expected to generate an annual output value exceeding 1.5 billion yuan and create more than 2,000 local jobs, further strengthening the regional semiconductor supply chain and talent pool.
Mingtai Microelectronics is a national high-tech enterprise engaged in the packaging and testing of integrated circuits and discrete devices . It is currently the largest independent third-party packaging and testing service provider in the Chengdu-Chongqing economic circle. Its main business is the packaging, testing, and sales of integrated circuits and power devices, and it is the largest independent third-party foundry in Southwest China. The company's existing packaging products mainly include DIP series, SOP series, TO series, SOT series, QFN/DFN, LQFP, LGA, PDF