On January 30, 2026, Tianjin launched its first early-stage integrated circuit (IC) venture fund — the
Tianjin Chipfire Integrated Circuit Venture Capital Fund at the 2025 Tianjin IC Industry Association Re-election and Innovation Conference. Managed by Shenzhen Jinghu Capital, the fund has a target size of
200 million yuan and focuses on early-stage investments of
1–10 million yuan in critical IC sectors: semiconductor equipment, EDA tools, high-end chip design, advanced materials, and intelligent sensors.
Co-established by the Tianjin Angel Investment Guidance Fund, Tianjin Binhai High-tech Industry Investment Fund, and private capital, the fund completed registration with the Asset Management Association of China in June 2025 and is now actively investing. At the launch, it signed agreements with five startups for
30 million yuan in commitments.
As Tianjin’s first dedicated early-stage IC fund, it aims to solve startup financing bottlenecks, support domestic substitution in key technologies, and leverage the
Tianjin National Chip Spark Innovation and Entrepreneurship Platform to provide integrated “investment + incubation + acceleration” services. This initiative is expected to strengthen Tianjin’s IC ecosystem and boost the broader Beijing-Tianjin-Hebei hard technology cluster.
Simultaneously, the Chip Spark Platform unveiled the
“Chip Collaboration Venture Capitalist” program, designed to connect IC scientists with investors and partners through matchmaking events, further nurturing high-potential startups and enhancing regional innovation.
