Chinese semiconductor thread II

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tokenanalyst

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def333 said:
The webpage states that the article was generated by AI.
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I know the company and have seem the patents. they have been working in this light source for years.

Extreme ultraviolet semiconductor provides a capillary discharge electrode ultraviolet lithography dual vacuum light source device​

  • China Lighting Network
    2024/5/13
    21376
Suzhou Extreme Ultraviolet Semiconductor Co., Ltd. provides a capillary discharge electrode ultraviolet lithography dual vacuum light source device, which relates to the field of extreme ultraviolet lithography light source technology. It aims to solve the problem of light noise caused by the generation of electrode debris and tube wall debris during ceramic capillary discharge. The technical solution includes a capillary and electrodes. Electrodes are also provided at both ends of the capillary. A discharge chamber is also provided on the outside of the capillary. The discharge chamber is provided with a collection hole and an observation hole. The capillary is connected to a gas supply system.
This improved the output power of extreme ultraviolet light, allowing for a lower discharge repetition frequency to meet the requirements of extreme ultraviolet lithography production; it significantly reduced electrode debris, tube wall debris, and light source impurities, which is beneficial for the output of extreme ultraviolet light; the use of a pneumatic system for air supply improved the purity of the extreme ultraviolet light; and the extension of the capillary length and the adoption of a side collection method greatly increased the collection surface compared to traditional end-face collection, thus increasing the collection efficiency of extreme ultraviolet light.
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tokenanalyst

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Wafer-level integration of nanomaterials and MEMS sensing chips facilitates the industrialization of high-performance gas sensors.​


Professor Guotao Duan’s team at the School of Integrated Circuits, HUST, has pioneered a groundbreaking wafer-level manufacturing process that seamlessly integrates nanomaterials with 3D MEMS sensing structures overcoming a decades-old industrial bottleneck in high-performance gas sensor development.

The team’s novel “film-first, cantilever-later” approach decouples nanomaterial synthesis and patterning from MEMS fabrication, enabling liquid-surface self-assembly of nanoparticles (e.g., Pd/SnO₂) onto 8-inch wafers with uniform, dense monolayers without damaging pre-fabricated microstructures. Key innovations include:​
  • MEMS-compatible self-assembly platform for wafer-scale nanoparticle deposition​
  • HfO₂ interface passivation layer to prevent etchant-induced failure during cantilever release​
  • Precise nanofilm patterning that preserves sensing performance while ensuring wafer-level consistency​
The resulting Pd/SnO₂-based MEMS hydrogen sensor combines the miniaturization and low-power advantages of MEMS with the high sensitivity and rapid response of nanomaterials, demonstrating exceptional uniformity across an entire 8-inch wafer.
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Published in Nano-Micro Letters (first author: Zheng Zhang, 2025 PhD graduate), this work provides the first complete, scalable manufacturing pathway for nanomaterial-enhanced MEMS gas sensors paving the way for mass production and industrial deployment in IoT, safety monitoring, and environmental sensing applications.

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