Chinese semiconductor thread II

tphuang

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This is an great video, 20 mins long, must watch, as it's non-biased, China-friendly, truth telling.

Finally, a Trump admin official (
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) has commented extensively on the Reuter's EUV breakthrough article on the "All-in" podcast.

As you may know,
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, is the Top #1 AI official
in Trump admin (nickname: "AI and Crypto Czar") who formulates the entire AI strategy for the Trump administration. He is the #1 advocate for selling H200 chips to China, to get China addicted to Western tech stack before it's too late, and was originally against selling Nvidia chips to China.

I highly recommend watching this from 1:00:00 to 1:19:50, it's 20 mins long, but very very good:

(It starts at 1:00:00, but David Sacks talks later on around 1:06:06)

Personal highlights that I noticed:
  • David Sacks acknowledges that EUV breakthrough would completely cripple the West export controls regime against China, as it was the most powerful chokepoint West had over China. That's now gone!!
  • David Sacks admits that DUV SAQP allowed China to breakthrough into 7nm and 5nm nodes (!!!!!) First ever acknowledgement by Trump admin official that China has achieved the 5nm node.
  • David Sacks agrees that it's inevitable that EUV breakthrough will happen, it's a matter of when, not if. The timeline where China closes the gap in semiconductors is rapidly approaching, they are catching up quick. US must reduce regulatory barriers.
  • Friedberg brings up that Taiwan TSMC's strategic importance will be diminished in China EUV scenario, less likely for US to want to defend Taiwan.
  • Friedberg brings up prolific Chinese EUV research papers, including one paper using AI to get around mirror imperfection diffusion issues, and another making optical lens mirror breakthrough.
  • Friedberg brings up future advanced Chinese EUV systems that can reach parity and even leapfrog ASML outright (he is likely alluding to SSMB synchro under development, but never says it)
  • Frieberg already knew of EUV breakthrough as early as April 2025, he was saying China already had an EUV machine, so he says Reuters is too narrow focused, too biased, and outdated info.
  • Chamath says in future AI is more memory-centric, so HBM memory is going to be more important. (Guess where CXMT is coming in hot!!)
This was an amazing video, you rarely see Westerners talking about China semiconductor in a neutral non-biased fashion. P.S., I love Friedberg man, you can tell this guy knows his stuff, he knew of China's EUV prototype as early as April 2025, and reads a lot of Chinese EUV research publications by Tsinghua university, etc.... He knows his stuff clearly if he knows about SSMB synchron dev.
All in guys are generally pretty good in terms of not smoking on copium. A lot of this info honestly is out there if people were really looking for it.

but it’s important to point out again that China has to develop the full euv process, not just the scanner itself.
 

jx191

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All in guys are generally pretty good in terms of not smoking on copium. A lot of this info honestly is out there if people were really looking for it.

but it’s important to point out again that China has to develop the full euv process, not just the scanner itself.
Most people probably have zero clue about China's full EUV process activity. The whole Reuters situation just proved it. I'd be surprised if those people could actually name other parts of the process, let alone what China has been up to recently.
 

tphuang

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Huawei Nova 15 series Ultra will be using Kirin 9010S SoC and have 18% performance improvement vs previous generation.

This kind of shows just how many 9010 and 9020 production and binned SoC they have that will make their way to non-flagship products. Since, Nova sales are higher volume thank Mate series
 

tphuang

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安凯微/Anyka won award in for its' RISC-V chips including AK1080, 5th generation low power bluetooth chips and 32-bit RISC-V core.
and AK1037 series low power lock for smart door SoC and 32-bit RISC-V CPU core.
AK1090 Bluetooth sound chip with 32-bit RISC-V core.
 

tphuang

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OnMicro displays its OM6629 bluetooth low power SoC. This is using Arm architecture. It is an upgrade over its old OM6626 product.

OnMicro is more known for its wifi and power amplifier modules, so I guess this will now provide the whole package.
 

tphuang

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United Nova also got awarded on China's 2026 IC wind cloud event. this is mostly for its SiC G2.0 platform using 8-inch SiC wafers that will supporting NEV OBC and AI data center power supply.
 

tphuang

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铭科思/MECS displays its MSR1001E ultra Wideband multifunctional chip. Its chipset includes high precision, high speed converter chips including ADC and DAC. Its ADC product has entered main supply chain. Its Silicon based RF chips is used in AESA T/R modules. Among leading position in China.

MSR1001E uses CMOS RF chip wide band and highly tintegrated. It operates 5-18GHz and achieves single chip integration of RF, analog, power modulation and digital waveform control. It overcomes system miniaturization & power supply issues.
 
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