Chinese semiconductor thread II
- Thread starter vincent
- Start date
so this collaborates what I tweeted earlier. Although differing from digitimes, there is no reason imo for fab to stop at 40-50k wpm. I think the remaining capacity will just be all domestic lines and same with fab 3. There is no reason for them to wait for fab 3 to do all domestic lines. That makes no sense.
my further take on Nexperia China situation
basically, I think Wingsky semi in Shanghai is fully capable of supplying the dies needed by Dongguan facility so Chinese automakers will get the chips they need. Whereas non Chinese automakers are in trouble, including Japanese and American ones. This is blowing up spectacularly on Trump admin.
Eagle Semiconductor secures over RMB 700 million in Series B+ funding, becoming a global leader in VCSEL technology.
Recently, Zhejiang Eagle Semiconductor Technology Co., Ltd. (hereinafter referred to as "Eagle Semiconductor") completed a B+ round of financing of over 700 million yuan, led by CITIC Jinshi and Guoxing Fund, and participated by many leading institutions such as Anxin Investment, Shenzhen Capital Group, Zhejiang Science and Technology Innovation Fund III, Guoke Jiahe, Lingang Digital Technology, and Xichen Capital. Old shareholders SAIC Financial Holdings (SAIC Group's strategic direct investment fund), Hengxu Capital, Nova Nebula, Excellence Capital, and Dingqing Investment continued to add investment.
It is reported that the scale of Eagle Semiconductor's single-round financing has set a record for the highest single-round financing for a startup company in the domestic VCSEL (vertical-cavity surface-emitting laser) field.
Eagle Semiconductor specializes in the research and development and manufacturing of VCSEL chips. Its founding team, comprised entirely of industry veterans, includes leading experts and experienced engineers from the global VCSEL industry. Its core technical team is led by a core team of former listed optoelectronics companies, who are now secondary founders. Over 50% of the company's personnel are R&D professionals, embodying a strong R&D, precision manufacturing, and operational excellence model. After five years of dedicated development in Zhejiang, the R&D team has developed the world's only cutting-edge VCSEL platform, integrating five core technologies: high-speed, multi-junction, polarization, two-dimensional addressable, and flip-chip. The team has launched a comprehensive VCSEL product line, marking China's entry into the global VCSEL leadership.
Zhichun Technology: The company has cooperation with Yangtze Memory Technologies and Changxin Technology
Zhichun Technology announced on its investor engagement platform that it maintains partnerships with major domestic semiconductor companies, including Yangtze Memory Technologies and Changxin Technology. The company's core business focuses on providing wafer fabs with products and services throughout their lifecycle, from initial construction to stable operations.
Zhipure Technology explains that its product portfolio primarily includes process equipment, high-purity process equipment and systems, electronic materials, components, and professional services, meeting the needs of wafer fab construction and production at different stages. The company's customer base includes major domestic integrated circuit manufacturers, including SMIC, Huahong Semiconductor, Shanghai Huali, Yangtze Memory Technologies, Changxin Technology, Yandong Microelectronics, Silan Microelectronics, Runpeng Semiconductor, and H-series companies.
The company noted that with the rapid development of the domestic semiconductor industry chain, wafer manufacturing is continuing to expand, and demand for high-purity process equipment and system products is increasing. The company will continue to deepen strategic cooperation with leading wafer fabs to enhance its technical service capabilities and market share.
Zhipure Technology explains that its product portfolio primarily includes process equipment, high-purity process equipment and systems, electronic materials, components, and professional services, meeting the needs of wafer fab construction and production at different stages. The company's customer base includes major domestic integrated circuit manufacturers, including SMIC, Huahong Semiconductor, Shanghai Huali, Yangtze Memory Technologies, Changxin Technology, Yandong Microelectronics, Silan Microelectronics, Runpeng Semiconductor, and H-series companies.
The company noted that with the rapid development of the domestic semiconductor industry chain, wafer manufacturing is continuing to expand, and demand for high-purity process equipment and system products is increasing. The company will continue to deepen strategic cooperation with leading wafer fabs to enhance its technical service capabilities and market share.
I guess the UHAR etching tool is for YMTC and the metal etch tool for SMIC.
AMEC: Six major platform launches accelerate platformization
The company launched six new semiconductor equipment products, accelerating its move toward high-end equipment platform development. With the continuous advancement of semiconductor technology, demand for technologies such as plasma etching, atomic layer deposition, and epitaxy continues to rise. The company recently launched six new semiconductor equipment products covering key processes such as plasma etching, atomic layer deposition, and epitaxy.
In terms of etching technology, the company's two new products provide customers with leading and efficient solutions in the areas of ultra-high aspect ratio etching and metal etching, respectively. In terms of thin film deposition technology, the company released four new products, including three atomic layer deposition products and one epitaxial product. The company's 12-inch atomic layer deposition product meets the metal gate application requirements of advanced logic and memory devices. With its excellent process adaptability and compatibility, the epitaxial equipment can meet the epitaxial process requirements of various fields, from mature to advanced nodes, including logic, memory, and power devices. These six new semiconductor equipment products will further meet customer needs, expand the company's product portfolio, and inject new momentum into its transformation into a high-end equipment platform company.
In terms of etching technology, the company's two new products provide customers with leading and efficient solutions in the areas of ultra-high aspect ratio etching and metal etching, respectively. In terms of thin film deposition technology, the company released four new products, including three atomic layer deposition products and one epitaxial product. The company's 12-inch atomic layer deposition product meets the metal gate application requirements of advanced logic and memory devices. With its excellent process adaptability and compatibility, the epitaxial equipment can meet the epitaxial process requirements of various fields, from mature to advanced nodes, including logic, memory, and power devices. These six new semiconductor equipment products will further meet customer needs, expand the company's product portfolio, and inject new momentum into its transformation into a high-end equipment platform company.
Jingce Electronics releases the third-generation power semiconductor dynamic reliability test system
Recently, Jingce Electronics independently developed and launched the JHP560 series third-generation power semiconductor dynamic reliability test system.
Jingce Electronics explains that this system simulates high-temperature, dynamic, and high-frequency AC switching conditions found in real-world applications. Through high-capacity, high-performance testing (wide voltage, high frequency, and high dv/dt), it accurately captures early failure risks caused by gate oxide defects, interface state degradation, and intrinsic material defects. This enables efficient device reliability assessment and screening, effectively improving device yield and long-term stability. It can be widely used in reliability lab R&D verification and mass production quality control, helping customers achieve reliable mass production with "early detection, high efficiency, and high cost-effectiveness."
With their core advantages such as high voltage resistance, high temperature resistance, high-frequency switching and low power consumption, silicon carbide and gallium nitride are rapidly replacing traditional silicon devices, becoming the key cornerstone of the next generation of power electronics systems, and their applications are growing explosively.
At the same time, these characteristics also place more stringent requirements on the reliability verification and characteristic testing of SiC power devices, especially in high-end application fields such as automotive-grade. As a core evaluation tool, dynamic reliability testing not only provides key dynamic parameters, but also reveals the potential risks and optimization directions of the device by simulating actual working conditions.
Previously, the new version of the AQG324 automotive module reliability standard, led by the European Center for Power Electronics (ECPE), was officially implemented, incorporating QL-08 to QL-11 dynamic reliability tests into mandatory certification requirements, indicating that dynamic reliability testing has become a "must-answer question" in the research and development and industrialization process of SiC power devices.
Fein Microelectronics cumulative delivery of automotive pressure sensors exceeds 30 million!
Recently, MEMS Consulting learned from the official WeChat public account of Wuhan Fein Microelectronics Co., Ltd. (abbreviated as Fein Microelectronics), a leading Chinese MEMS manufacturer , that the cumulative delivery volume of Fein Microelectronics' automotive pressure sensors has exceeded 30 million!
Feon Microelectronics said: " This is not only a leap in numbers, but also an important testimony to Feon Microelectronics' ability to achieve scale, high quality control and stable delivery in the field of MEMS pressure sensor manufacturing. Every delivery carries trust; every breakthrough is a forge ahead. Thank you for the trust of the market and customers. Feon Microelectronics will firmly move forward on the journey of domestic sensor independence to higher standards!"
Fein Microelectronics is a high-tech enterprise dedicated to providing MEMS sensors and system products for the automotive, Internet of Things, smart home, and industrial control industries. Leveraging process stress model packaging technology and efficient batch calibration and testing algorithms, the company has established several world-leading, single-piece flow, fully automated production lines, and its products cover all pressure sensor applications across the entire vehicle.