Chinese semiconductor thread II

[tokenanalyst]

The Zonghui Xingguang high-end optical communication chip project with a total investment of 550 million yuan was completed and put into production​

According to the official Weibo of Wujin today, on the morning of September 10, the Zonghui Xingguang high-end optical communication chip project with a total investment of 550 million yuan was completed and put into production in Wujin National High-tech Zone. The project is dedicated to the research and development and manufacturing of high-end compound semiconductor chips.

The newly-commissioned project covers an area of 40 mu and has a construction area of 28,000 square meters. After reaching full production capacity, it will form large-scale production capacity for gallium arsenide and indium phosphide chips.
Founded in 2015, Zonghui Xingguang is an optoelectronic semiconductor company dedicated to providing customers with high-performance vertical-cavity surface-emitting laser (VCSEL) chips and modules, optical communication laser chips, and radio frequency epitaxial wafers. The company primarily develops and produces VCSEL chips, high-speed optical communication chips, devices, and modules, with applications in consumer electronics, 3D sensing, virtual reality, augmented reality, autonomous driving, biomedical sensors, and high-speed optical communications.

The application scenarios of VCSEL laser chips are rapidly expanding with the development of 3D perception, autonomous driving, artificial intelligence and other fields, and the market demand for high-performance, high-reliability, and high-speed high-end VCSEL laser chips has increased dramatically.

In 2019, Zonghui Xingguang achieved breakthroughs in epitaxial growth technology for key semiconductor materials, becoming the first company in China to achieve mass production of VCSELs. By August 2023, the company had shipped 100 million VCSEL chips and expanded into the automotive electronics and optical communications sectors. To date, Zonghui Xingguang has completed 11 rounds of financing, backed by over 20 renowned VC/PE and industrial investors, including Huawei, Xiaomi, BYD, DJI, Hesai Technology, RoboSense, Wuyuefeng Capital, Gaorong Capital, and Glory Ventures, raising over 2 billion yuan in total.

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[jx191]

The post you reference says that picture was from July 2024. The problem is despite all the rumors and such in the past years there still hasn't been any actual production. I understand that tight OPSEC means we probably won't get official notice of anything but if these systems were ready then we should see it in the actual output of wafers. Right now it seems they are still not ready for production and given tight OPSEC it's just really hard to tell how far along they actually are. That's the part that I think frustrates me and a lot of other people, there's just no way to know how far along DUV and EUV are and when actual production will happen.


I don't really see why they would make it public. I'm very doubtful that USA response to China getting their own machines would be to say "well I guess sanctions didn't work, we give up." Rather the predictable result would be even more sanctions from USA. So in that context it's much more likely they keep everything quiet as there's no real benefit to openly announcing it.

Well let's wait until production starts ramping up for advanced nodes during next year. Then we can talk about "actual production." At least for DUV.

But like tphuang said, it's best if we leave the speculation and move on for now.

 

[tokenanalyst]

Big Fund Phase III Tuojing Technology Industrial Project.​

The announcement shows that Tuojing Technology plans to issue shares to specific objects to raise a total amount of no more than RMB 4.6 billion, which will be used for the construction of a high-end semiconductor equipment industrialization base and a cutting-edge technology R&D center, of which RMB 1.1 billion will be invested to supplement working capital.

Among them, the high-end semiconductor equipment industrialization base construction project focuses on the expansion of thin film deposition equipment. It is planned to build a new industrialization base in Hunnan District, Shenyang, Liaoning Province, including production clean rooms, three-dimensional warehouses, testing laboratories, etc. It will introduce advanced production supporting software and hardware to create a large-scale, intelligent and digital high-end semiconductor equipment industrialization base.

According to reports, the project plans to invest 1.768 billion yuan, with a construction period of five years. Tuojing Technology claims that the implementation of this project will significantly increase the company's high-end semiconductor equipment production capacity, supporting the industrialization of its thin-film deposition equipment series, including PECVD, SACVD, and HDPCVD. Through the construction of intelligent supporting facilities, it will improve production efficiency, fully meet the needs of downstream markets and customers, expand the company's business scale, and further enhance the company's competitiveness and market position.



The construction project of Tuojing Technology's cutting-edge technology research and development center focuses on the development of advanced process equipment and plans to invest 2 billion yuan.

Tuojing Technology stated that through the implementation of this project, the company plans to carry out research and development of a number of advanced thin film deposition equipment, including PECVD, ALD, trench filling CVD and other process equipment, and gradually break through the cutting-edge core technologies, thereby forming a series of products with independent intellectual property rights; at the same time, it will continue to optimize and upgrade PECVD, ALD, trench filling CVD and other products to meet the iterative needs of advanced processes.

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[tokenanalyst]

Sunking Technology and Sanan Semiconductor have reached a strategic cooperation​

On September 12, 2025, Sunking Technology announced that its wholly-owned subsidiary, Sunking Asia Pacific Semiconductor Technology (Zhejiang) Co., Ltd., and Hunan San'an Semiconductor Co., Ltd., have signed a strategic cooperation framework agreement, establishing a comprehensive strategic partnership. This collaboration aims to leverage both parties' technological and industrial strengths in semiconductors, particularly power devices, to promote collaborative development and achieve mutual benefit.

Sunking Semiconductor specializes in the R&D and manufacturing of power semiconductor devices. San'an Semiconductor, a wholly-owned subsidiary of San'an Optoelectronics, boasts a vertically integrated manufacturing platform covering the entire silicon carbide (SiC) industry chain. Its 8-inch SiC chip production line has already achieved mass production and is now online. In this partnership, San'an Semiconductor will ensure a stable and timely supply of Sunking products based on Sunking Semiconductor's needs, and will grant Sunking Semiconductor priority supply in its production plans.

Both parties expressed their intention to jointly assess future market growth potential, develop capacity expansion plans, and engage in resource sharing and technology exchange to further enhance their market competitiveness. Sunking Technology hopes that this strategic partnership will strengthen its competitive advantage in the global semiconductor industry, particularly in the power device market.

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[tphuang]

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Huawei's 9000X CPU has been unveiled. It has receive highest level security certification along side Loongson's 3B6000M CPU.