The "Invisible Engine" of Smartphones: JCET's RF Module Packaging Technology Helps Enhance User Experience
A smartphone's radio frequency front-end module ( RFFEM ) is the "core engine" of its communication capabilities, responsible for signal transmission, reception, processing, and optimization. It is one of the most critical components of the mobile chip. The new generation of high-end smartphones, equipped with powerful chips as the hardware foundation, integrates intelligent applications into every aspect of the user experience. Its RFFEM, through fully integrated design, cutting-edge materials, and system-level packaging optimization, is more suitable for the application needs of the intelligent era and better supports the user experience .
As a leading chip packaging and testing company in the industry, Changdian Technology has one-stop RF application packaging and testing solutions, and has deeply deployed high-density DsmBGA , 3D SiP , cavity shielding and packaged antenna (AiP) technology and production capacity. It cooperates with international and domestic customers to upgrade 5G , WiFi RF module packaging and millimeter wave radar products, and continuously strengthens its leading position in the field of RF chip packaging.
The RF front-end module (RFFEM) sits between a smartphone's antenna and baseband chip. It primarily includes signal transmission and reception links, integrates a duplexer / multiplexer, synchronizes transmit and receive signals, and uses dynamic tuning to reduce power consumption and extend battery life. High-end smartphone RFFEMs utilize a highly customized solution, packaging the power amplifier, switch, and filter into a single module to minimize footprint. A shielding layer is also embedded within the module to minimize inter-chip interference.
JCET has been deeply engaged in the System-in-Package ( SiP ) field for nearly 20 years. Its high-density, heterogeneous SiP solutions for the next generation of high-end smartphone RF modules offer significant advantages, including high-density integration and high yield. These solutions integrate heterogeneous chips such as filters, power amplifiers, and switches within RF front-end modules into a single package, supporting the complex multi-band requirements of 5G . High-density mounting technology achieves an accuracy of 15 microns, supporting mounting of components as small as 008004. Combined with double-sided SiP packaging, these solutions significantly reduce module footprint.
Changdian Technology uses a sputtering shielding process to achieve cavity-based or selective electromagnetic shielding to reduce signal interference. This cavity protection solution supports bare-die packaging for filters and other components, improving high-frequency stability and reducing packaging costs. Furthermore, the company's verification and testing platform covers RF microwave, millimeter-wave, 5G cellular, and wireless communications, supporting collaborative verification from chips, packaging, modules, to final products, ensuring quality assurance for finished modules.
