Chinese semiconductor thread II

T

tokenanalyst

Brigadier
Registered Member

Synergistic Enhancement Effects of Heterogeneous Isomorphism Clusters in Response to Irradiation: Sub-10 nm Nanolithography and Nanoscale Etching Transfer.​


Abstract​

The advancement of integrated circuit manufacturing has continuously relied on lithography technology as a fundamental driving force. However, the development of photoresists faces a resolution-line edge roughness-sensitivity (RLS) trade-off, hindering simultaneous optimization. To address this issue, we propose a collaborative strategy for heterogeneous isomorphism cluster photoresists with different radiation responses. The Ti4M4-oxo cluster platform [Ti4Zr4O6(OBu)4(OMc)16] (T4Z4), with higher sensitivity, was applied as a photosensitizer for a higher resolution photoresist of [Ti4Hf4O6(OBu)4(OMc)16] (T4H4), allowing the hybrid photoresist to effectively induce cluster cross-linking at low exposure doses, synergistically producing high-resolution patterns. This achieved an e-beam resolution enhancement from 16 to 7.5 nm, with successful fabrication of intricate patterns under 10 nm. The hybrid photoresist also exhibits the capability to etch transfer patterns below 20 nm onto silicon dioxide substrates, highlighting its potential for future device manufacturing. This work presents a new perspective on photoresist design to effectively tackle RLS trade-off limitations.

1746108662654.png

Please, Log in or Register to view URLs content!
 
T

tokenanalyst

Brigadier
Registered Member

Kunlun Core's patent for "task sending method, task execution method and device, equipment and medium" was published​



According to Tianyancha, Kunlun Core (Beijing) Technology Co., Ltd.'s patent for "task sending method, task execution method and device, equipment and medium" was announced. The application publication date is March 11, 2025, and the application publication number is CN119597410A.
The present disclosure provides a task sending method and device, equipment and medium, which relate to the field of computer technology, especially to the field of chip technology and data processing technology. The implementation scheme is: create multiple task queues including a first queue and a second queue; obtain a first data processing task for the first queue and a second data processing task for the second queue, the first data processing task and the second data processing task respectively include data to be processed, data processing instruction information and task dependency information; in response to determining that the second data processing task depends on the first data processing task, create a first monitoring task, the first monitoring task is to be terminated in response to determining that the first data processing task has been executed; store the first data processing task in the first queue; store the first monitoring task and the second data processing task in the second queue; and send the first queue and the second queue to the data processing device.

Please, Log in or Register to view URLs content!
 
T

tokenanalyst

Brigadier
Registered Member

Shanghai Silicon Industry: 300mm silicon wafer shipments will increase by more than 70% year-on-year in 2024, and the total production capacity will reach 650,000 pieces/month​



Shanghai Silicon Industry said at an investor relations event that since 2024, the global semiconductor market has shown a recovery trend, but the overall inventory level of downstream customers is high, resulting in the recovery of semiconductor silicon wafers slower than the overall market. In 2024 and the first quarter of 2025, the company's main product sales and overall revenue showed an upward trend. In terms of 300mm silicon wafers, Shanghai Lingang's new 300,000 pieces/month production capacity has been fully put into production, and the Taiyuan project has completed the construction of a 50,000 piece/month pilot line and entered the customer certification stage. The company's total 300mm silicon wafer production capacity has increased to 650,000 pieces/month. In 2024, shipments of 300mm silicon wafers increased by more than 70% year-on-year.

Please, Log in or Register to view URLs content!
 
T

tokenanalyst

Brigadier
Registered Member

Beijing releases key points to promote the development of the private economy, supports enterprises to purchase domestic GPU chips and build intelligent computing centers.​


Recently, the "Beijing 2025 Work Points for Promoting the Healthy and High-quality Development of the Private Economy" was officially released. The policy aims to promote the healthy and high-quality development of Beijing's private economy.
According to the work points, Beijing will support private enterprises in building intelligent computing centers, and will provide support to enterprises that purchase self-controlled GPU chips to provide intelligent computing services in accordance with a certain proportion of their investment amount. In addition, Beijing will also focus on supporting private enterprises in participating in the construction of green innovation platforms.
Analysts pointed out that the current US tariff policy on China is constantly changing, coupled with the increasingly stringent chip control, which makes the independent control in the field of high-end chips increasingly important. Against this background, the process of domestic substitution is accelerating, and the prospect of import substitution of domestic computing chips is promising. Against the background of domestic CSP Capex expansion, domestic chip technology continues to break through and market share continues to increase.

Please, Log in or Register to view URLs content!
 
T

tokenanalyst

Brigadier
Registered Member

Another masterpiece of domestic automotive SerDes chips! Shouchuan Microelectronics launched the world's first MIPI A-PHY and HSMT dual-protocol standard chip​


Shouchuan Microelectronics launched its new automotive SerDes chips - VL7717S, VL7722S, and VL7724S. "The new products have achieved a major breakthrough in technology, pioneering the integration of MIPI A-PHY and HSMT dual-protocol standards in the same product, becoming another milestone in the field of automotive SerDes. This is not only the first chip to support two different protocol types, but also because both protocols are public standard protocols, it further accelerates the standardization process of domestic SerDes." Zhang Chenguang said.

In terms of configuration, the new product is the only automotive SerDes chip product in China that uses PAM4 modulation technology. In terms of transmission rate, a single channel supports multiple transmission bandwidths such as 2G, 3.2G, 4G, 6.4G, and 8G, which can meet the needs of different scenarios. Regarding the advantages of PAM4 modulation technology, Zhang Chenguang pointed out, "At the same baud rate, the bit rate of PAM4 is twice that of traditional NRZ technology, which greatly improves data transmission efficiency and meets the needs of high-speed networks such as 6.4G and 8G for large bandwidth. In addition, in long-distance transmission, PAM4 can maintain more stable signal quality and reduce signal loss."

In terms of camera pixel support, the new products of Shouchuan Microelectronics cover a wide range from 1 million to 16 million, which is not only compatible with all mainstream camera pixel specifications on the market, but also reserves sufficient space for the upgrade and iteration of subsequent products. In addition, the new products support Coax/STP cables with a transmission distance of up to 20m, ensuring the timeliness and effectiveness of signal transmission.

As the first in-vehicle SerDes solution that supports dual public protocol standards, the mass production of this chipset has broken the technical monopoly of overseas manufacturers in the field of in-vehicle high-speed video transmission. Its innovative architecture provides intelligent driving systems with protocol selection flexibility and cost control advantages. This technological breakthrough confirms the deep accumulation of Shouchuan Microelectronics in the field of digital-analog hybrid chips. At present, the chipset has been verified by many leading Tier1 manufacturers and applied to scenarios such as smart cockpits and ADAS.


Please, Log in or Register to view URLs content!
 
You must log in or register to reply here.
Top