Huawei's almost fully domestic PC getting shown.
Aside from CPU, the cool part is that all the PMICs are also domestic. Unclear with GPU & memory chips.
Part of China's domestic PC drive
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Huawei's almost fully domestic PC getting shown.
Aside from CPU, the cool part is that all the PMICs are also domestic. Unclear with GPU & memory chips.
Part of China's domestic PC drive
Professor Zhang Jincheng of Xidian University and others have made important progress in the field of diamond high-voltage power devices
The research group of Professor Zhang Jincheng and Professor Zhang Jinfeng of the team led by Academician Hao Yue of Xidian University has made important progress in the field of ultra-wide bandgap semiconductor diamond power devices. The latest research results entitled "Integration of Oxidized Silicon- and Hydrogen-terminated Diamond p-channels for Normally-off High-voltage Diamond Power Devices" were published in the internationally renowned journal "IEEE Electron Device Letters".
Xidian University is the first completion unit, and the team's postdoctoral fellow Fu Yu is the first author of this article. This study combines the advantages of silicon-terminated and hydrogen-terminated diamonds, and proposes a new structure of enhanced diamond high-voltage field-effect transistors using silicon/hydrogen-terminated diamond composite conductive channels. The device achieves excellent performance of high threshold voltage (-8.6 V) and high breakdown voltage (-1376 V), providing an important technical path for the next generation of high-voltage and high-efficiency power electronic systems.
The research group of Professor Zhang Jincheng and Professor Zhang Jinfeng of the team led by Academician Hao Yue of Xidian University has made important progress in the field of ultra-wide bandgap semiconductor diamond power devices. The latest research results entitled "Integration of Oxidized Silicon- and Hydrogen-terminated Diamond p-channels for Normally-off High-voltage Diamond Power Devices" were published in the internationally renowned journal "IEEE Electron Device Letters".
Xidian University is the first completion unit, and the team's postdoctoral fellow Fu Yu is the first author of this article. This study combines the advantages of silicon-terminated and hydrogen-terminated diamonds, and proposes a new structure of enhanced diamond high-voltage field-effect transistors using silicon/hydrogen-terminated diamond composite conductive channels. The device achieves excellent performance of high threshold voltage (-8.6 V) and high breakdown voltage (-1376 V), providing an important technical path for the next generation of high-voltage and high-efficiency power electronic systems.
Domestic manufacturing EDA project settled in Optics Valley!
All-core Intelligent Manufacturing Technology Co., Ltd. signed a contract with East Lake High-tech Zone to carry out the construction of domestic manufacturing EDA projects in Optics Valley.
All-core Intelligent Manufacturing was established in 2019. As a leading domestic manufacturing EDA company, it has applied for 182 related patents, and has domestic computational lithography platforms, design and manufacturing collaborative optimization platforms, intelligent manufacturing platforms and full-process process device simulation design platforms, serving Wuhan integrated circuit companies.
The signed project is located in Wuhan Future Science and Technology City, and will carry out domestic manufacturing EDA research and development, application and technical support, etc., to promote the development of the integrated circuit industry in Optics Valley.
All-core Intelligent Manufacturing Technology Co., Ltd. signed a contract with East Lake High-tech Zone to carry out the construction of domestic manufacturing EDA projects in Optics Valley.
All-core Intelligent Manufacturing was established in 2019. As a leading domestic manufacturing EDA company, it has applied for 182 related patents, and has domestic computational lithography platforms, design and manufacturing collaborative optimization platforms, intelligent manufacturing platforms and full-process process device simulation design platforms, serving Wuhan integrated circuit companies.
The signed project is located in Wuhan Future Science and Technology City, and will carry out domestic manufacturing EDA research and development, application and technical support, etc., to promote the development of the integrated circuit industry in Optics Valley.
The world's first independently developed C2W&W2W dual-mode hybrid bonding equipment SAB 82CWW series made a stunning debut!
The SAB 82CWW series equipment adopts the world's most advanced integrated equipment architecture, changing the two technical routes of C2W and W2W from "either this or that" to "co-evolution". This innovative design not only improves the versatility and flexibility of the equipment, but also provides customers with more choices and meets the needs of different application scenarios.
The SAB 82CWW series hybrid bonding equipment has many technical highlights:Dual-mode process integration: The equipment adopts a highly flexible modular design and supports C2W and W2W dual-mode hybrid bonding, achieving seamless adaptation to R&D and production needs and improving equipment utilization.Multi-size compatibility: The equipment is compatible with 8-inch and 12-inch wafers, and can be quickly switched by replacing parts, providing greater flexibility to meet the bonding needs of wafers of different sizes.Super chip processing capability: The equipment can process ultra-thin chips as thin as 35μm , and has full-size compatibility, from 0.5×0.5mm to 50×50mm chips, ensuring production yield and reliability.Compatible with different alignment methods: It provides two alignment methods: coaxial and infrared penetration between chips. The alignment accuracy is better than ±300nm (coaxial) and ±100nm (infrared), which can cope with chips of different sizes and materials.Innovative bonding method: Through innovative bonding methods, the risk of particle contamination is minimized and high-yield bonding is achieved.High precision and high efficiency: C2W and W2W bonding technologies achieve an alignment accuracy of ±30nm and a bonding accuracy of ±100nm. The UPH of a C2W single bonding head can reach up to 1,000 pieces/hour.Intelligent offset compensation: Equipped with high-precision high-throughput detection module and built-in algorithm to achieve negative feedback offset compensation to ensure the stability and consistency of bonding accuracy.
StarCent Technology's intelligent robot chip business is growing rapidly, and it is expanding into the outdoor robot field
StarStar Technology responded to investors on the interactive platform and stated that intelligent robot chips have become one of the company's core business lines, and the business volume continues to maintain a rapid growth trend.At present, the company has formed a product matrix of main control chips covering high, medium and low levels in the field of cleaning robot chips, and has established cooperative relationships with many global leading brand customers. Looking forward to the future, StarCenter Technology will increase its R&D investment in the field of outdoor robots and strive to develop outdoor high-end robot chip products suitable for a variety of scenarios such as mowing, snow removal, and pool cleaning.
Wireless powered Maglev Wafer Stage motor for EUV.
Honestly it's all weak rumours for now. I'd say a Chinese publications from mainland would be much credible.
Design of control system for automated semiconductor etching equipment
Abstract
In the semiconductor manufacturing process, the etching process is crucial for the accuracy and performance of the device, but the PID (Proportional Integral Derivative) control method has significant shortcomings in control accuracy, reaction rate, and stability, and cannot meet the increasingly stringent requirements of modern chip manufacturing. To solve this problem, this paper designs a control system for automated semiconductor etching equipment. First, this paper builds a multi-parameter real-time monitoring system based on advanced sensor networks and embedded control units to accurately obtain key data during the etching process. Next, an adaptive control algorithm is designed to adjust the etching parameters through feedback control strategy to ensure the stability and accuracy of the etching process. Finally, an expert system based on fuzzy logic is used to optimize the process control to cope with the nonlinear characteristics in complex environments. The experimental results show that the maximum etching error of the adaptive control systemis4 nm, and the average error is 1.7 nm, while the maximum error of the traditional PID control system is 9 nm and the average error is 5.3 nm. In addition, the adaptive control system has a recovery time of 5 seconds when dealing with process disturbances, while the PID control system needs 8 seconds to recover. Compared with traditional PID control systems, adaptive control systems have shown significant advantages in etching accuracy, system stability, and response speed, successfully solving the problem of process fluctuations in the etching process and improving the consistency and process stability of etching depth. |
That source didn't even name the Twitter account correctly; it should be @Ma_WuKong, not @MaWooKong, so they're just copying badly from WCCFtech