Chinese semiconductor thread II

[tokenanalyst]

Shanghai Institute of Microsystem and Information Technology has made progress in the field of graphene-based chip heat dissipation.​

Preparation strategy of high heat-load graphene membrane based on optimized construction of gas escape channels

In traditional graphene film preparation technology, the high temperature process removes the functional groups of the GO raw material and releases a large amount of gas (such as CO, CO2). The accumulation of gas causes the film to expand and increase structural defects, which seriously reduces the thermal conductivity. The research team proposed to pre-construct ordered flat channels inside the GO membrane to guide the directional escape of gas during high-temperature treatment and reduce structural damage, thereby constructing a highly oriented thick film structure and achieving a breakthrough improvement in thermal conductivity. Based on this strategy and related parameter optimization, a graphene film with a thickness of more than 110 microns and a thermal conductivity of up to 1781 W·m⁻¹·K⁻¹ was successfully prepared, which is 16.2% higher than the traditional method and shows great potential in reducing the hot spot temperature of the chip. This work effectively solves the problem of the sharp drop in thermal conductivity of graphene film when the thickness increases, and provides a new solution for thermal management of high-power density electronic devices. The related paper titled “Achieving Ultra-High Heat Flux Transfer in Graphene Films via Tunable Gas Escape Channels” was published in Advanced Science 2025, 12, 2410913. (

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). The first author of the paper is Zheng Haolong, a doctoral student at the Shanghai Institute of Microsystem and Information Technology, and the corresponding authors are Associate Researcher He Peng, Researcher Ding Guqiao and Professor Wang Gang from Ningbo University.​

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[tokenanalyst]

Maxsun Technology: MLED complete line solution​

Maxsun Technology Co., Ltd. was founded in 2010 and listed on the Shenzhen Stock Exchange in 2018. It is a pan-semiconductor equipment manufacturer integrating mechanical design, electrical research and development, software development, and precision manufacturing. The company's business is aimed at the three major industries of solar photovoltaics, displays, and semiconductors, covering three key technology platforms: vacuum, laser, and precision equipment. The main products include: fully automatic solar cell screen printing production line, heterojunction high-efficiency battery manufacturing overall solution; MLED full-line automation equipment solutions , OLED flexible screen laser equipment; semiconductor wafer packaging equipment, etc. As an industry-leading pan-semiconductor high-end equipment manufacturer, in the field of new display, Maxsun Technology has independently developed a full set of equipment for Mini LED , including wafer hidden cutting, splitting, crystal giant rotation, laser bonding, etc., and a full set of equipment for Micro LED, including wafer bonding, laser peeling, laser giant rotation, laser bonding, laser repair, laser cutting, D2D bonding, hybrid bonding, etc., providing the MLED industry with high-efficiency and high-yield whole-line process solutions, and is committed to creating outstanding value for customers.

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[JPaladin32]

Electronmicroscope analysis on Kirin 9020

This actually marks a big departure from ARM (I mean the company, not the instruction set) memory hierarchy designs. No L2 cache on mid cores. Shared L2 on little cores which then is connected directly to System Level Cache without going via L3. This is a wild configuration and shows HiSilicon really has the ability to explore the design space instead of following ARM designs.

By the way the battery life of my Mate 70 Pro is quite impressive. I get 12 - 15 hours of screen-on time per charge.

 

[tokenanalyst]

Changdian Technology (JCET) has cracked the code of thermal management technology for power devices​

Under the wave of large-scale AI deployment, large-scale applications such as high-computing power servers and digital infrastructure require a large number of kilowatt-level or even megawatt-level power devices. The increase in the penetration rate of end-side products such as AI mobile phones and AI PCs has put forward higher requirements for miniaturized power devices.

Similarly, in scenarios such as new energy vehicles, 5G base stations, and industrial power supplies, power devices are the "heart" of power conversion, and their performance directly determines system efficiency. However, as device power density soars, heat dissipation has become one of the core bottlenecks restricting the development of the industry.

Data shows that for every 10°C increase in power device temperature, its lifespan may be shortened by more than 50%, and in extreme cases, it may even cause system failure. At the same time, in electronic devices, device failures caused by overheating account for more than 50% of all failure causes. In the field of electric vehicles, the heat dissipation efficiency of the power module directly affects the endurance of the entire vehicle; in data centers, the heat dissipation capacity of the server power supply is related to operating costs and stability.

Changdian Technology: Three major technologies provide heat dissipation solutions
With decades of experience in the semiconductor packaging field, Changdian Technology has built a multi-dimensional heat dissipation solution through material innovation, structural optimization and process upgrade:​

• Intelligent Thermal Simulation Design Platform​

The integrated AI algorithm combined with system-level collaborative simulation can predict the hotspot distribution, and optimize the packaging structure design and material combination based on the multi-physics field simulation results, thus shortening the R&D cycle and providing the best design solution.

​

• High thermal conductivity packaging material matrix​

In response to different customer needs, we have corresponding material libraries and corresponding mature processes to choose from in chip mounting, chip interconnection and structural encapsulation. Among them, the chip mounting part has high thermal conductivity pressure/pressure-free sintering materials, lead-free diffusion solder and other materials; chip interconnection can provide wire bonding, bumps, substrate RDL and copper clip solutions; structural encapsulation materials can provide molded encapsulation materials with a junction temperature of up to 200°C and a thermal conductivity greater than 3W/mK.​

• Multi-sided heat dissipation structure​

Compared with the traditional bottom heat dissipation solution, the top heat dissipation surface exposed direct connection solution provided by Changdian Technology can greatly shorten the heat dissipation path; at the same time, on this basis, Changdian Technology can also provide a double-sided heat dissipation structure for multi-chip integration solutions.

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[tokenanalyst]

AENI RF MATCHING NETWORK for Semiconductor Plasma Equipment, like ICP Etching, CCP Etching, PECVD and so on.

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[tphuang]

Compared with Kirin 9020, the main frequency of the super core of Kirin 9020A is reduced by 100Mhz, and the main frequency of the small core is also reduced by about 150Mhz. The overall performance gap is about 5%. For ordinary consumers, there is no obvious difference in daily use. Of course, there may be other versions of Kirin 9020 in the future...

View attachment 146986

btw, this is another sign that 7nm process is really maturing. Not only are they fabbing larger die but the binned dies are also showing less issues than before. Such that they can keep it to oct core with only reductions in frequency.

 

[Hyper]

This actually marks a big departure from ARM (I mean the company, not the instruction set) memory hierarchy designs. No L2 cache on mid cores. Shared L2 on little cores which then is connected directly to System Level Cache without going via L3. This is a wild configuration and shows HiSilicon really has the ability to explore the design space instead of following ARM designs.

By the way the battery life of my Mate 70 Pro is quite impressive. I get 12 - 15 hours of screen-on time per charge.

Actually the recent Arm v Qualcomm case made it clear that companies don't really need to rely on ARM. Qualcomm licensed arm cores but it's products mostly had it's own cores.

 

[OptimusLion]

 

[tokenanalyst]

Shanhu Town Zhongdao Xinli Etching Process Special Equipment Parts Manufacturing Project​

Zhongdao Xinli Semiconductor Technology Co., Ltd. obtained a construction permit for its etching process special equipment parts manufacturing project through the "multi-certificate issuance" method. The total investment of the project is 570 million yuan. It is a "three-to-one improvement" project in Taizhou City and is included in the tracking service of the pilot project of the overtime default system of the Municipal Data Bureau.

The project is located on the south side of Xiangyuan Road and the east side of Yanhe Road in Shanhu Bahu Village, Shanhu Town. The newly added land is about15,839 square meters. Standard factory buildings, office buildings and R&D centers are built with a total construction area of 35,666.16 square meters .New equipment and facilities such as SIC chemical vapor deposition, SIC localization and exhaust gas treatment, CNC machining, as well as cooling plate series, cavity rotation mechanism, sorting and cutting machine, particle jet cleaning, oven, high-speed wet grinding, cavity rotation mechanism ultrasonic cleaning machine, laser marking machine, pre-cleaning, oxidation furnace, final cleaning and other ancillary equipment will be added.After the project is completed, it can produce 60,000 parts of semiconductor etching process special equipment annually.
​

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[gelgoog]

Actually the recent Arm v Qualcomm case made it clear that companies don't really need to rely on ARM. Qualcomm licensed arm cores but it's products mostly had it's own cores.

You still need to license the ARM ISA. And in the case of Qualcomm only recently with that Nuvia acquisition did they get their own ground up core design. The Krait and other such prior Qualcomm cores were customized ARM cores which used a lot of ARM IP.