Chinese semiconductor thread II

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New Storage Technology releases upgraded and larger capacity storage chip "NM102"​

On January 22, 2025 , the company announced the launch of its latest product, the non-volatile new memory "NM102". This new product not only has a single chip capacity of an astonishing 128Gb, but also has achieved a major breakthrough in performance, supporting 4K high-speed access and a read bandwidth of up to 3.2GB/s, setting a new benchmark in the industry.

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In actual application scenarios, "NM102" has demonstrated excellent performance. After rigorous testing, servers equipped with this chip can achieve ultra-fast response times in microseconds, ensuring that enterprises can maintain efficient and smooth operation when processing massive amounts of data. This significant improvement is undoubtedly a great boon for enterprise-level users who need to process large amounts of data, and can greatly improve work efficiency.

It is worth mentioning that while ensuring high performance, "NM102" also adopts a unique storage mechanism, which effectively extends the storage life and greatly reduces the customer's overall cost of ownership. This innovative design not only improves the product's cost performance, but also further enhances the competitiveness of Xinchuang Technology in the storage market.

The "NM102" released this time is not only another masterpiece of the company in the field of large-capacity new memory, but also a vivid embodiment of technological innovation and product upgrades. Compared with the "NM101", China's first new memory chip with the largest capacity, which was successfully released in September 2024, the "NM102" has doubled in capacity, marking a more solid step for Xinchuang Technology in large-capacity storage technology.

At present, the company has initially built a competitive new storage chip product portfolio, and actively provided "NM102" samples to core customers such as domestic cloud service providers, and conducted a series of rigorous performance tests and compatibility verification. The smooth implementation of this series of measures not only verified the excellent performance and stability of "NM102", but also laid a solid foundation for the wide application of new storage technology in the future market.

With the rapid development of big data applications, the market demand for high-performance storage products is increasing. The company's launch of "NM102" is timely and will help Xincun Technology quickly occupy the commanding heights of the market in the big data era, provide end users with more efficient and reliable storage solutions, and create greater value returns.

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With a total investment of 1 billion Kewei Lianchuang signed a contract with Huai'an for semiconductor packaging and testing project​


On the afternoon of February 20, the signing ceremony of the Kewei Lianchuang integrated circuit packaging and testing project was held in our district. District Party Secretary Zhu Haibo attended and spoke, District Mayor Zhao Hongtao hosted the event, and Huizhou Kewei Lianchuang Technology Co., Ltd. Chairman Luo Yi, Shanghai Dongxu Electronic Technology Co., Ltd. Chairman Xu Jingji, and district leaders Gao Jinfeng, Wang Lei, and Zhang Xiaoyu attended the event.

Zhu Haibo welcomed the official settlement of the project in Qingjiangpu. He said that in recent years, under the strong leadership of the municipal party committee and government, Qingjiangpu has insisted on focusing on industry and projects, taking the new generation of information technology industry as the main direction of the industry, vigorously carrying out precise investment promotion in the industrial chain and attracting businesses with businesses, Aoyang Shunchang has deepened its main business and grown stronger, and a number of industry-leading technology projects with a total investment of more than 1 billion yuan, such as Dongxu Electronics and Mingfang Semiconductor, have taken root and blossomed, and the 10 billion-level pilot projects have been successfully started and accelerated, achieving leapfrog development from single-point breakthroughs to clustering. The successful signing of the integrated circuit packaging and testing production base project with a total investment of 1 billion yuan by Huizhou Kewei Lianchuang Technology Co., Ltd. is not only another successful example of Qingjiangpu attracting businesses with businesses, but also marks another major achievement in extending, supplementing and strengthening the new generation of information technology industry in Qingjiangpu, which will surely inject stronger momentum into accelerating the high-quality leapfrog development of Qingjiangpu. As the project host, Qingjiangpu will firmly establish the concept of "doing better than saying, and providing services earlier than demand", and do everything possible to solve the difficulties and problems in project construction with the most complete element guarantee, the most considerate assistance service, and the most superior policy environment; at the same time, it will keep a close eye on the policy orientations and capital investment of "two heavy" and "two new", actively plan, strive upward, and fully serve to promote the early start, early production, and early effectiveness of the project. It is hoped that Kewei Lianchuang Technology Co., Ltd. will take this signing as a new starting point, promote the project construction with high standards, strict requirements, and rapid speed, and strive to make the project a benchmark demonstration project for the new generation of information technology industry in Qingjiangpu and even Huai'an.

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OptimusLion

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Nanjing University School of Artificial Intelligence team won the best paper at the top EDA conference DATE 2025


According to the School of Artificial Intelligence of Nanjing University, recently, the team of Professor Qian Chao of the LAMDA Group of the School of Artificial Intelligence published a paper titled "Timing-Driven Global Placement by Efficient Critical Path Extraction" at DATE 2025 and won the Best Paper Award. The first author of the paper, Shi Yunqi, the fourth author, Lin Xi, and the fifth author, Xue Ke, are respectively a master's student, an undergraduate student, and a doctoral student at the School of Artificial Intelligence of Nanjing University. Professor Qian Chao is the corresponding author, and the paper was completed in cooperation with Huawei Noah's Ark Lab

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Ultra Rapid Excimer Laser Annealing for next gen transistors.​


Shenzhen Shengfang Technology Co., Ltd

In the dynamic landscape of semiconductor device fabrication, continual advancements strive to enhance the process. As the density of transistors per unit area increases and chip components become progressively smaller, the challenges in chip production grow in both intricacy and difficulty. Traditional methods like furnace annealing are becoming inadequate for the evolving demands of chip manufacturing. To address the intricacies posed by shrinking device sizes, annealing techniques and process parameters undergo constant refinement. Pulsed laser annealing emerges as a noteworthy solution, capable of precisely irradiating specific material areas in extremely brief intervals. This technique, hamessed by absorbing laser energy, rapidly elevates the material surface temperature to induce melting. The consequential reconstruction of the melt layer's crystal structure, coupled with redistributed doping in the crystal, serves the crucial purpose of eliminating defect-activated doping. The excimer laser, operating as a nanosecond pulsed ultraviolet laser, holds distinctive attributes that render it particularly meaningful in semiconductor manufacturing annealing technology. Its short wavelength, narrow pulse width, and minimal material penetration depth, especially in semiconductor materials like silicon, contribute to high absorption rates. Moreover, excimer lasers boast high resolution in focusing or projection, coupled with substantial single-pulse energy. This inherent flexibility allows for shaping the energy distribution of the pulse spot, offering adaptability to diverse requirements. These defining characteristics underscore the significance of excimer laser research in advancing semiconductor manufacturing annealing technologies.

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TGV drilling equipment for glass substrates in China​

The key technology of glass substrate packaging is TGV. TGV (Through Glass Via) technology is to make tiny vertical through holes on the glass substrate and fill the through holes with conductive materials to achieve electrical connection between different layers.The pore-forming processes of TGV mainly include sandblasting, ultrasonic drilling, wet etching, deep reactive ion etching, photosensitive etching, laser etching, laser induced deep etching and focused discharge pore-forming.​

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Wuhan Deer Laser Technology Co., Ltd.
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Guangdong Han's Semiconductor Equipment Technology Co., Ltd.
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Suzhou Delong Laser Co., Ltd.
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Titanium Technology Co., Ltd.
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Wuhan Huagong Laser Engineering Co., Ltd.
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Shenzhen Guihua Intelligent Technology Co., Ltd.
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Maike Micro-Nano Semiconductor Technology (Kunshan) Co., Ltd.
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Wuhan Huari Precision Laser Co., Ltd.
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Chengdu Laipu Technology Co., Ltd.
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Shenzhen Yunteng Laser Technology Co., Ltd.
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Anhui Baiyi Laser Technology Co., Ltd.
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Jiyi Technology Co., Ltd.
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