Chinese semiconductor thread II

[gotodistance]

How China’s award-winning EUV breakthrough sidesteps US chip ban​

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The research team took a completely different technological approach from Western methods to generate EUV laser light.

According to the institute’s website, the “discharge plasma extreme ultraviolet lithography light source” project, led by Professor Zhao Yongpeng from the school of aerospace engineering, “boasts high energy conversion efficiency, low cost, compact size and relatively low technical difficulty”. “It can produce extreme ultraviolet light with a central wavelength of 13.5 nanometres, meeting the urgent demand for EUV light sources in the photolithography market,” an official report said.

Zhao’s team, on the other hand, uses the laser-induced discharge plasma (LDP) method, where a laser first vaporises a small amount of tin into a cloud between two electrodes. A high voltage is then applied across the electrodes to inject energy, converting the tin cloud into plasma.

The resulting electrons and high-valence tin ions frequently collide and radiate, generating EUV light.

Compared with LPP technology, the LDP method is simpler, more cost-effective and directly converts electrical energy into plasma with higher energy utilisation efficiency.

 

[meedicx]

The recent news of SMIC dropping the cost of 28nm wafer by 40% is huge! Therefore it's much cheaper than TMSC, and UMC.
What enabled that? Is it because domestic tools fully in production for 28nm wafer and tools maintenance cost is big part of wafer cost. 28nm DUVi could be used in production of wafer by SMIC.
From what I heard, and comments read that 28nm DUVi already in production, 14nm DUVi already certified last year and 7nm DUVi patent filed and its prototype probably in testing stage.



what's the domestic supplier for FIB (focus ion beam) and XRD (X ray diffraction)

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So according to this influencer who has internal contacts at chinese semiconductor companies, fully domestic wafer manufacturing equipment is 1/3rd the cost and fully domestic materials is 1/5th the cost of the existing global supply chain.

It's not just SMIC cutting prices, due to the price advantage, other chinese fabs including Huahong will also begin to cut prices.

Not sure on the credibility, take it with grain of salt.

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[LanceD23]

So according to this influencer who has internal contacts at chinese semiconductor companies, fully domestic wafer manufacturing equipment is 1/3rd the cost and fully domestic materials is 1/5th the cost of the existing global supply chain.

It's not just SMIC cutting prices, due to the price advantage, other chinese fabs including Huahong will also begin to cut prices.

Not sure on the credibility, take it with grain of salt.

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The recent announcement of EU chipmakers switching to chinese domestic fabs is more than coincidence? I think price reduction is at least part factor.

US chip makers haven't moved due to political pressure but Chinese government probing them for price dumping because receiving subsidies from CHIP act.

 

[LanceD23]

How China’s award-winning EUV breakthrough sidesteps US chip ban​

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The research team took a completely different technological approach from Western methods to generate EUV laser light.

According to the institute’s website, the “discharge plasma extreme ultraviolet lithography light source” project, led by Professor Zhao Yongpeng from the school of aerospace engineering, “boasts high energy conversion efficiency, low cost, compact size and relatively low technical difficulty”. “It can produce extreme ultraviolet light with a central wavelength of 13.5 nanometres, meeting the urgent demand for EUV light sources in the photolithography market,” an official report said.

Zhao’s team, on the other hand, uses the laser-induced discharge plasma (LDP) method, where a laser first vaporises a small amount of tin into a cloud between two electrodes. A high voltage is then applied across the electrodes to inject energy, converting the tin cloud into plasma.

The resulting electrons and high-valence tin ions frequently collide and radiate, generating EUV light.

Compared with LPP technology, the LDP method is simpler, more cost-effective and directly converts electrical energy into plasma with higher energy utilisation efficiency.

Originally HIT used the DPP method but the EUV output watts is low. maybe around 50 watts.

So, this new LDP approach what's the output waltage? 250watts is the initial goal for commercial one.

 

[sunnymaxi]

Originally HIT used the DPP method but the EUV output watts is low. maybe around 50 watts.

that was DPP-EUV light source from HIT. though they didn't mention power output but it is around 150-200 watts.. team mentioned this light source, meeting the urgent demand for EUV light sources in the photolithography market.

SCMP basically published old information with new date.

 

[tokenanalyst]

TuoJing Technology's revenue in 2024 is expected to increase by 47.88% to 55.27%, and it will ship more than 1,000 equipment reaction chambers​

Tuojing Technology recently released its 2024 annual financial report, with an expected operating income of 4 to 4.2 billion yuan in 2024 , an increase of 1.3 billion to 1.5 billion yuan from the annual operating income of 2.7 billion yuan in 2023, a year-on-year increase of 47.88% to 55.27%.

Tuojing Technology pointed out that the main reasons for the growth include, on the one hand, facing the opportunities brought by the rapid development of the domestic integrated circuit industry, the company, as a leading enterprise in the field of domestic high-end semiconductor equipment, continues to focus on the independent research and development and industrialization of thin film deposition equipment and hybrid bonding equipment, relying on its core competitive advantages in product technology innovation, customer resources, after-sales service, etc., PECVD, ALD, SACVD, HDPCVD, ultra-high aspect ratio trench filling CVD (Flowable CVD) and hybrid bonding equipment and other series of products have been continuously expanded in mass production, and customer orders have been continuously obtained, and the company's business scale has shown a rapid growth trend. In 2024, the company shipped more than 1,000 equipment reaction chambers, setting a new annual record in the company's history.

On the other hand, in 2024, the company continued to maintain high-intensity R&D investment, insisted on independent innovation, and achieved important results in promoting new product research and development, product industrialization and iterative upgrading of various product series, including Flowable CVD equipment, PECVD Bianca process equipment, PE-ALD SiN process equipment, HDPCVD FSG, HDPCVD STI process equipment, bonding registration accuracy measurement equipment and other new products and new processes have been verified and introduced by downstream users and achieved industrialization. At the same time, new equipment platforms PF-300M, PF-300T Plus and new reaction chambers Supra-D ACHM, ONO Stack and other process equipment have successfully passed customer verification, obtained repeat orders from customers, and achieved large-scale shipments, further enhancing the company's product performance and core competitiveness, and helping the company's revenue to grow steadily.

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[tokenanalyst]

Yangzhou Chip Integrated Wafer-Level Advanced Packaging Base Project Capped​

Recently, Xinde Technology announced that the main structure of the Yangzhou Wafer-Level Chip Advanced Packaging Base project has been successfully topped out, adding a 2.5D/3D project to the active East China market.

According to Future Semiconductor's "2024 China Advanced Packaging Third-Party Market Research" report, the main body of the first phase of the project is Yangzhou Core Grain Integrated Circuit Co., Ltd., which was established in February 2023 and is a subsidiary of Xinde Technology. The total investment of the project is 500 million yuan. A new wafer-level core grain packaging production line will be built, covering an area of 105 acres and a plant of about 70,000 square meters. It can produce 48,000 pieces of ultra-large-size wafer-level core grain packaging products annually, and is expected to be completed and put into operation by the end of 2024 or early 2025. The second phase of the project is scheduled to start in the second half of 2025.

Xinde Technology has a "CAPiC chip and advanced packaging technology platform" covering QFN, WLCSP, BGA, LGA, SiP, WLCSP, POP, FANOUT and 2.5D/3D, chiplet, Bumping and FC. Its planned total investment of 6 billion yuan in semiconductor chip packaging and testing production lines (1.5 billion yuan for the first phase and 4.5 billion yuan for the second phase) will produce about 20 billion packaging and testing chips annually, and about 3.5 million pieces of advanced bumping technology annually. The third phase will start construction in February 2024. In 2024, it plans to invest 100 million yuan to build a production workshop for Xinde Technology's advanced packaging and testing base to realize high-integration hybrid chip integrated circuit packaging and testing solutions such as Hybrid BGA and Hybrid LGA.

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[tokenanalyst]

More from this company building commercial DPP Light Sources

 

[tokenanalyst]

 

[tokenanalyst]

Interesting concept of an amplifier.


TRUMPF use like 4 of those for ASML