Chinese semiconductor thread II

tokenanalyst

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Update on Commercial sub nanometer precision interferometers.

Conventional Dual Frequency Interferometers and Fiber Optic Dual frequency Interferometers.

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Objective Lens alignment with wafer stage
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Motion Stage controller.
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UPrecision, SMEE and Harbin are developing grating types interferometers with picometer precision for immersion and EUV machines but theses could definitely be used for dry ArF KrF scanners, EBL, Ion Beam Etching tools, Metrology tools and NIL.

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tokenanalyst

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Biwin unveils ultra-compact mini SSD, delivering powerful performance for edge intelligence devices​


The accelerating global digital transformation has positioned storage devices as no longer merely tools for data storage but as critical cornerstones for facilitating information security, promoting computational efficiency, and shoring up business innovation. In response to the industry trends, BIWIN has unveiled a brand-new generation of storage solution - Mini SSD, a revolutionizing version that breaks through the volume limitations of traditional SSD. The breakout product is a masterpiece that combines all aspects of powerful performance, compact size, and high reliability, redefining new benchmarks for storage peripherals, breaking the boundaries between storage and application, and immersing users with efficient and secure data management experiences anytime, anywhere.

Redefining Storage Form Factor: Balance Between Small Size and High Performance

The Mini SSD crystallizes BIWIN's years of technological accumulation in storage solutions and packaging and testing fields. The application of LGA (Land Grid Array) packaging technology contributes to high integration of controller and NAND flash modules, resulting in the integral dimensions of just 15mm×17mm×1.4mm which is almost equivalent to a microSD card or just half the size of a coin, yet realizing a leapfrog in performance and capacity enhancement. Its design meets both the needs of terminal devices for slim portability and provides greater design flexibility for device manufacturers.​

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latenlazy

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View attachment 143708
So they are apparently reporting on this on cctv.
For know is more for material science than litho but still interesting, you literally can see electrons move with this lasers.

The construction of the Advanced Attosecond Laser Facility, a major national scientific and technological infrastructure, officially started in Dongguan, Guangdong on January 10. After completion, the facility will provide strong support for multidisciplinary frontier basic research and industrial applications in physics, chemistry, materials, information, biomedicine, etc.

Attoseconds are the shortest time scale that humans can currently master, with 1 attosecond being only one billionth of a second. Using attosecond laser pulses, scientists can track, measure, and manipulate the movement of electrons, just like using an "ultra-high-speed camera" to capture the "dynamic image" of electrons.

Just to fill in some details here attosecond lasers aren’t tied to lithography but an EUV attosecond laser is probably related to research for EUV processes. One of the main uses of an attosecond laser is that it allows you to study light matter interactions with high time discrete precision. Can see this being particularly useful for resist and mask development and also maybe to help develop metrology techniques.
 
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tokenanalyst

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Towards Large Scale Atomic Manufacturing: Heterodyne Grating Interferometer with Zero Dead-Zone.​

Abstract​

This paper presents a novel heterodyne grating interferometer designed to meet the precise measurement requirements of next-generation lithography systems and large-scale atomic-level manufacturing. Utilizing a dual-frequency light source, the interferometer enables simultaneous measurement of three degrees of freedom. Key advancements include a compact zero Dead-Zone optical path configuration, significantly enhancing measurement reliability by mitigating the impact of light source fluctuations and air refractive index variations. A comprehensive crosstalk error analysis was conducted, resulting in a robust correction algorithm that reduces errors to below 5%. Performance testing of the prototype, size of 90×90×40mm3, demonstrated exceptional resolution (0.25 nm in the XY-axis and 0.3 nm in the Z-axis), superior linearity (6.9e-5, 8.1e-5 and 16.2e-5 for the X, Y, and Z axes, respectively), high repeatability (0.8 nm/1000 nm for the three axes) and stability (20 nm for the XY-axis and 60 nm for the Z-axis over 1000 seconds). Comparative analysis with existing measurement sensors highlights the proposed method’s significant advantages in integration, multidimensional capabilities, and is expected to be widely used in fields such as integrated circuits, atomic-level manufacturing and aerospace technology.

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tokenanalyst

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Construction of China's first through-glass CPO optoelectronic co-packaging production line started, with an annual production target of 1 million optical devices.​


Shenzhen Optics Valley Technology's annual production of 1 million high-speed optical communication devices project has officially started construction. The first phase of the construction will be the first glass-based CPO optoelectronic co-packaging production line in China, which will package and produce CPO-based optical engine products and is expected to be completed in May 2025.According to reports, Shenzhen Optics Valley Technology, the leader of China's first co-packaged optics (CPO) based on through-glass via (TGV) chips, announced that its annual production of 1 million high-speed optical communication devices project has officially started factory decoration construction in Wenling Economic Development Zone, Zhejiang Province on December 24, 2024.Shenzhen Optics Valley Technology is a national high-tech enterprise focusing on the research and development, production and sales of high-density optical communication chips and devices. In September 2024, Shenzhen Optics Valley Technology announced the completion of tens of millions of RMB in equity financing. The company said that TGV-based advanced packaging technology is the key to promoting the upgrading of the optical communication industry. TGV has natural optical properties and high aspect ratio through-hole processing technology. TGV technology helps Shenzhen Optics Valley Technology gain an advantage in high-speed optical communications and emerging technology applications, meeting the needs of data centers and computing clusters for high bandwidth and high density.

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LanceD23

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The recent news of SMIC dropping the cost of 28nm wafer by 40% is huge! Therefore it's much cheaper than TMSC, and UMC.
What enabled that? Is it because domestic tools fully in production for 28nm wafer and tools maintenance cost is big part of wafer cost. 28nm DUVi could be used in production of wafer by SMIC.
From what I heard, and comments read that 28nm DUVi already in production, 14nm DUVi already certified last year and 7nm DUVi patent filed and its prototype probably in testing stage.



what's the domestic supplier for FIB (focus ion beam) and XRD (X ray diffraction)

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tonyget

Senior Member
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The recent news of SMIC dropping the cost of 28nm wafer by 40% is huge! Therefore it's much cheaper than TMSC, and UMC.
What enabled that? Is it because domestic tools fully in production for 28nm wafer and tools maintenance cost is big part of wafer cost. 28nm DUVi could be used in production of wafer by SMIC.
From what I heard, and comments read that 28nm DUVi already in production, 14nm DUVi already certified last year and 7nm DUVi patent filed and its prototype probably in testing stage.

I think you have miss interpreted the news. The news says that SMIC lower the price by 1500 dollars, thats SMIC trying to attract customer by lowering the price. The news did not say that the COST lowered by 40%,it is price that SMIC quoting to customer lowered by 40%. SMIC could very well be selling 28nm at a loss or very thin margin,in order to gain market share
 
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