Chinese semiconductor thread II
- Thread starter vincent
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Xinyide Integrated Circuit Packaging and Testing Industrial Park Project Started
the Xinyide Integrated Circuit Packaging and Testing Industrial Park project started construction in Wangcheng Economic Development Zone.
It is reported that the Hunan Xinyide Integrated Circuit Packaging and Testing Industrial Park, which has started construction this time, has a planned land area of 30 mu, a total construction area of 39,139 square meters, and a total investment of 500 million yuan. The project will create a professional park with one-stop chip packaging and testing solutions based on advanced packaging technology, while also having "integrated circuit testing", "module processing", "system integration" and other functions. The main products include "MEMS sensors", "biomedical chips", etc.
Hunan Xinyide Technology Co., Ltd. is a chip design company that integrates perception, calculation, control, and transmission into a full intelligent measurement and control process, focusing on the research and development of sensors, ADCs, various control and transmission chips, and related application solutions. Its parent company, Shenzhen Xinyide, is a national-level small giant enterprise with rich experience in the field of chip design.
I'm a bit confused as I'm not an expert in DRAM. What's so significant about DDR5 this time? Didn't LPDDR5 from CXMT already come out late last year? Is there something significant about DDR5 but not LPDDR5? Those articles make it sound like the competitors start to panic a bit, but why now and not last year?
China's first TFT-based Micro-LED mass production line lights up
On December 19, the 2024 World Display Industry Innovation and Development Conference was held in Chengdu. During the conference, Chengdu Hi-tech Zone enterprise Chengdu Chenxian Optoelectronics Co., Ltd. (hereinafter referred to as "Chenxian Optoelectronics") held the lighting ceremony of the first TFT-based Micro-LED mass production line in mainland China and the lighting ceremony of the first mass-produced product , which marked an important breakthrough in China's Micro-LED display technology.
Micro-LED technology is known as the "next generation display technology" for its excellent performance, ultra-long service life and extremely high energy efficiency ratio. The mass production of the TFT-based Micro-LED mass production line of Chenxian Optoelectronics, which was lit up this time, is located in the Guangxian Rougu Industrial Park in Chengdu Hi-tech Zone. The total investment exceeds 3 billion yuan. The production line is fully independently designed and uses a number of "first-of-its-kind" Micro-LED mass production equipment, including the transfer process, backplane process and module process. The fully automated intelligent production line represents a major progress in the commercialization of Micro-LED technology.
TuoJing Technology: Steady Progress and Deep Development of Semiconductor Equipment
The company's PECVD, ALD, ultra-high aspect ratio trench filling CVD, hybrid bonding and other equipment products have passed customer verification , and entered the customer's mass production line and continuously expanded the scale of mass production. At present, Tuojing Technology has R&D and industrialization bases in Shenyang, Shanghai and Haining. The annual production capacity of the Shenyang Plant 1 R&D and production base is about 300-350 sets. At this stage, Tuojing Technology is planning the construction of the Shenyang Plant 2 industrialization base to provide production capacity support for the company's subsequent development. Has mastered a series of core technologies with independent intellectual property rights and has reached the international advanced level. In terms of thin film equipment , the company's core technology is widely used in its main business products, solving key problems such as uniformity of nano-thickness thin films in semiconductor manufacturing, small number of particles on the film surface, rapid film formation, stable and high equipment production capacity, etc. While ensuring the realization of thin film process performance, it improves the production capacity of customer production lines and reduces the production costs of customer production lines. In terms of Hybrid bonding equipment, the company has formed high-speed and high-precision wafer alignment technology and hybrid bonding real-time alignment technology to achieve higher wafer bonding accuracy and improve equipment production capacity.
The effect of target material concentration on EUV near 6.7 nm and out-of-band radiation of laser-produced Gd plasma.
Abstract
We have prepared various low-density Gd targets to investigate the effect of concentration on the extreme ultraviolet (EUV) radiation near 6.7 nm and out-of-band emission from laser-produced plasma source. Results show that an increased EUV radiation intensity and narrow-band spectra from the low-density target was obtained. Comparing with the original solid Gd target, the intensity and spectral purity of the 6.7 nm EUV radiation from the 40 % mass concentration Gd target are enhanced 45 % and 74.5 %, respectively. And the FWHM of the spectra are decreased to one-half of that from the solid target. The measurements of the plasma electron density for various concentration targets shown that the low-density target exhibited lower plasma electron density, which reduced the self-absorption effect and the yield of the low-charge ions in the plasma, resulting in the enhancement of EUV radiation intensity as well as narrower band spectra output. Finally, the out-of-band radiation in the range of 325–385 nm from the 40 % concentration Gd target is decreased to approximately 60 % of the solid target case, while the angular distribution profile was significantly uniform. Our findings are beneficial to the Gd target as a new promising source candidate for the EUV nanolithography in the future.
LPDDR5 is generally used in laptops and phones, while it does uses less power, it doesn’t perform as well on the high end. DDR5 is for desktop workstations/servers/HPC clusters and supports dual channel and higher memory capacity per channel, etc.
It’s a bit different from the memory boards of 5-10 years ago where laptop memory is just a scaled down version of the desktop DIMM modules.
interesting part here about CETC chip products.
they are used in 5G base station RF equipment and hundred Watt class GaN power tubes. It's mobile end point SAW filter is top in domestic market share.
it's Guobo subsidiary is top in China in supply AESA TR modules and RF MMIC. It is the largest supplier of domestic base station.
Again, they are up to 100W-letter GaN MMIC now.
This is very serious development. this will help Chinese Metrology and Lithography institutes to test critical components..
on December 19 that the First Academy of China Aerospace Science and Technology Corporation announced that it has successfully developed a high-precision integrated multi-degree-of-freedom laser interferometer measurement, testing and evaluation standard device.
Officials said that this is China's first batch of high-end instrument equipment metrology and evaluation devices, marking the first time that China has owned high-precision standard devices with completely independent intellectual property rights and up to international advanced levels. It has achieved accurate quantitative verification of key indicator items of high-precision integrated multi-degree-of-freedom laser interferometers, filled the gap in the metrology, testing and evaluation system, and will greatly accelerate the localization process of core equipment in China's aerospace, high-end manufacturing and other fields..
China's first high-precision integrated multi-degree-of-freedom laser interferometer measurement, testing and evaluation standard device.
on December 19 that the First Academy of China Aerospace Science and Technology Corporation announced that it has successfully developed a high-precision integrated multi-degree-of-freedom laser interferometer measurement, testing and evaluation standard device.
Officials said that this is China's first batch of high-end instrument equipment metrology and evaluation devices, marking the first time that China has owned high-precision standard devices with completely independent intellectual property rights and up to international advanced levels. It has achieved accurate quantitative verification of key indicator items of high-precision integrated multi-degree-of-freedom laser interferometers, filled the gap in the metrology, testing and evaluation system, and will greatly accelerate the localization process of core equipment in China's aerospace, high-end manufacturing and other fields..