Chinese semiconductor thread II

tokenanalyst

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Jingchi Electromechanical completed the first round of financing of tens of millions of yuan, focusing on the third-generation and fourth-generation semiconductor equipment fields​


Hangzhou Jingchi Electromechanical Technology Co., Ltd. (hereinafter referred to as "Jingchi Electromechanical") officially announced that it had recently completed a first round of financing of tens of millions of yuan, led by Hebei Zhengmao Industrial Investment Co., Ltd. (Zhengding County Government Industrial Investment Fund). This financing will help promote the company's research and development and market promotion of third-generation and fourth-generation semiconductor material equipment, further maintain its technological leadership, and enhance the company's competitiveness in my country's third-generation and fourth-generation semiconductor equipment industry.

Jingchi Mechanical and Electrical pointed out that on this basis, the company will continue to improve its organizational structure and improve product quality, and is committed to providing customers with better quality products and personalized solutions to meet customer needs.

Hangzhou Jingchi Electromechanical Technology Co., Ltd. was established in July 2021. Its headquarters and R&D center are located in Hangzhou International Science and Technology Innovation Center of Zhejiang University, Hangzhou. The company focuses on the research and development, production, sales and application promotion of third- and fourth-generation semiconductor material equipment such as silicon carbide, diamond, and aluminum nitride. Its main products are: six-inch and eight-inch silicon carbide epitaxial equipment (LPCVD method), diamond single crystal growth and epitaxial equipment (MPCVD method), aluminum nitride crystal growth equipment (PVT method), silicon carbide powder synthesis equipment, silicon carbide ingot and wafer annealing equipment, and silicon carbide wafer oxidation equipment.​

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tokenanalyst

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Empyrean Products Receive ISO 26262 TCL3 and IEC 61508 T2 International Standard Certifications​


Empyrean is pleased to announce that six products - including the schematic and layout editing tool Empyrean Aether™, the SPICE simulation tool Empyrean ALPS®, the physical verification tool Empyrean Argus™ (DRC/LVS), the power device reliability analysis tool Empyrean Polas™, the transistor-level power integrity analysis tool Empyrean Patron™, and the standard cell library and IP validation tool Empyrean Qualib®—have all received ISO 26262 TCL3 and IEC 61508 T2 international standard certifications. The certifications demonstrate that these products from Empyrean support the highest ASIL D level of automotive safety integrity standards for chip design. Empyrean has developed a comprehensive automotive electronic domestic EDA solution that includes automotive-grade analog EDA tools, automotive-grade digital EDA tools, and automotive-grade flat-panel display EDA tools.

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tphuang

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Samsung is also struggling to narrow the gap with Taiwan Semiconductor Manufacturing Co in contract chipmaking, where it is expected to suffer billions of dollars in losses this year. The Macquarie analysts warned of a possibility that Samsung’s $17 billion foundry in the city of Taylor, Texas, could be a “big stranded asset” due to a lack of major clients.

Samsung has said the Taylor fab would begin production in 2026 for leading-edge chips at 4 nm and below to meet growing customer demand for advanced nodes amid the AI boom.
some obvious things I have been talking about for a while now. There is only demand out there for leading edge chip production from TSMC and SMIC. TSMC gets it all now due to its product being superior. SMIC gets all the China demand. Samsung and Intel is stranded.

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looks like Samsung also has to lower its Nand price due to YMTC price pressure.

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China Rivals Pressure​

Earnings declined in the company’s memory chip business as Chinese rivals increased supplies of “legacy” products and some mobile customers adjusted inventories, offsetting solid demand for HBM and other chips used in servers, Samsung added.
Samsung admitting that its legacy chip products face significant China pressure. Something we've discussed for a while now.
 

tokenanalyst

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some obvious things I have been talking about for a while now. There is only demand out there for leading edge chip production from TSMC and SMIC. TSMC gets it all now due to its product being superior. SMIC gets all the China demand. Samsung and Intel is stranded.

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looks like Samsung also has to lower its Nand price due to YMTC price pressure.

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Samsung admitting that its legacy chip products face significant China pressure. Something we've discussed for a while now.
Interesting to think the Chinese AI and Smartphones companies would had flooded Samsung and maybe Intel with orders if wasn't for this stooge instigated semiconductor-trade war given the high prices that TSMC is charging.
 

gotodistance

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What do you think? Is it possible to mass produce silicon photonics? Can it replace Nvidia chips?

重大突破!中国成功研发出硅光子芯片,可突破EUV封锁?深入探讨硅光技术的前景与未来​

 

gelgoog

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No way. Right now it is only good for certain niche applications. Maybe telecoms and networking. Things like that.
To properly exploit optical systems for computing will likely require novel architectures more similar to analog computers than digital ones. But you won't see it in mass use this decade, and probably not next decade either.
 

GulfLander

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While TSMC is making advancements on its 2nm at full throttle, an unexpected risk may be emerging, which might be more severe than most could imagine: power supply. Citing a report by S&P, a report by
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highlights that compared with 2023, the foundry giant’s electricity consumption could nearly triple by 2030, accounting for about 24% of the island’s total electricity usage."
Did they consider that by 2030, there maybe competition from mainland companies?
 

gelgoog

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The sanctions actually helped make Huawei more competitive in cellphone telecoms edge equipment. Because of the US banning Huawei from buying FPGAs they ended up developing ASICs to replace them. Which have both lower cost per unit produced, and consume less power. Since Huawei's competitors suck at chip design they cannot compete here by themselves by making their own ASICs.
 
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