Don't know specifically about HBM. But earlier this year there were reports that they were trying to upgrade the Chinese plants to their 1a process, which they use for DDR5. It is either an EUV-free 1a process or a partial 1a process. US gave them permission to import everything except for EUV. Their 1a process in Korea uses EUV. Reports at the time said that the 1a process in China would be a partial. They would do part of the process in China, then move the wafers to Korea for EUV layers and then bring them back to China again for finishing it.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
The Ministry of Industry and Information Technology has published the "Guidelines for the Promotion and Application of the First Major Technical Equipment (2024 Edition)", which includes the Argon Fluoride Lithography Machine. According to the above information, this lithography machine has a light source of 193 nanometers, a resolution of ≤65nm, and an overlay accuracy of ≤8nm.
This is a DUV lithography machine, ArF dry type, and is a mature product.
The more advanced DUVi wet lithography machine is still in online testing and has not been included in the promotion and application catalog, but it will be soon.
EUV lithography equipment is being developed at a high speed, with the goal of being put into production by the end of 2025.
This was already posted and discussed here like 3 days ago.
Hefei Economic and Technological Development Zone’s semiconductor industry has added a new force!
On the afternoon of September 11, the signing ceremony of the Tongchao Precision Semiconductor Core Components Project was held in Hefei Economic Development Zone. Zhang Lu, deputy director of the District Management Committee, and Si Qifeng, chairman of Tongchao Precision Machinery Co., Ltd. attended the ceremony. Relevant persons in charge of the District Investment Promotion Bureau and Hefei Haiheng Holding Group Co., Ltd. also attended the ceremony. Tongchao Precision Machinery Co., Ltd. was established in 2016. It is committed to the research and development and production of key equipment components in the pan-semiconductor industry. Its products are mainly used in key process links such as pan-semiconductor thin film technology and etching technology. It is also the first domestic company to localize electrode components of CVD equipment and dry etching equipment in the panel field.
The integrated circuit industry in Hefei Economic Development Zone has a complete upstream and downstream industrial chain, with obvious advantages in industrial clusters and strong R&D capabilities of Tongchao Precision. The successful signing of the project will further improve the integrated circuit industry chain in Hefei Economic Development Zone and accelerate the pace of domestic substitution. In the next step , Hefei Economic Development Zone will do a good job in various guarantee services and fully assist the project construction and operation.As the core area of Hefei's national strategic emerging industry cluster, Hefei Economic and Technological Development Zone has made remarkable achievements in the field of integrated circuits, and the new generation of information technology industry is booming at an unprecedented speed. According to statistics, in 2023, the new generation of information technology industry chain in Hefei Economic and Technological Development Zone will achieve an output value of 119.16 billion yuan, of which the output value of the integrated circuit industry chain will reach 16.5 billion yuan, an increase of 8.5 times in the past four years, achieving fission from nothing to something, from small to large, and from weak to strong.Up to now, Hefei Economic and Technological Development Zone has attracted more than 100 integrated circuit industry chain enterprises to settle in the zone, and has built a complete industrial chain from semiconductor equipment and material manufacturing, chip design, chip manufacturing to packaging and testing.
520 million! Tianke Heda increases investment in silicon carbide equipment
This leading domestic silicon carbide substrate manufacturer is entering the silicon carbide equipment segment.On September 10, according to the official WeChat account of "Shenyang Hi-Tech Zone", Tianke Heda recently won the first industrial land in the new construction area of Northern Core Valley and will invest 520 million yuan to build a semiconductor equipment industrialization base project.source: Tianke HedaIt is reported that Liaoning Province Integrated Circuit Equipment and Components Industrial Park, namely Northern Core Valley, is located in Hunnan District, Shenyang City, with a total area of 5.1 square kilometers, including the Wusan District in the built-up area and the Zhangshabu District in the new district. It is planned to build an industrial cluster integrating complete equipment, components, and system integration.
The land that Tianke Heda has delisted this time is located in the new construction area of Northern Core Valley. It plans to build a research and development and manufacturing base for equipment such as silicon carbide single crystal growth furnaces and high-temperature CVD vacuum furnaces, and a terminal product production base such as carbide coatings for high-temperature components of semiconductor equipment. The project is expected to start construction early next year and be put into use before the end of the year.
The second phase of the project is used to expand Tianke Heda's silicon carbide crystal and wafer production capacity, and at the same time build a research and development center to continuously optimize and improve production processes and parameters. After production, it will achieve an annual output of approximately 371,000 conductive silicon carbide substrates, including 236,000 6-inch conductive silicon carbide substrates and 135,000 8-inch conductive silicon carbide substrates.
Dual machines launched simultaneously, ushering in a new era of semiconductor measurement.
On September 6, Meijie Optoelectronics shipped two sets of engraving machines at the same time, which demonstrated Meijie Optoelectronics' leading position in the field of semiconductor measurement equipment.
The two sets of overlay machines shipped this time are high-end testing equipment carefully developed by Meijie Optoelectronics in response to the high-precision requirements of current semiconductor manufacturing processes. They integrate the most advanced optical, mechanical, electronic and computer technologies, providing strong technical support for the production of semiconductor equipment. The feat of launching two machines simultaneously is not only the best proof of the company's technical strength, but also a vivid manifestation of its accurate grasp of market demand.
At present, the progress of domestic lithography machines is estimated to be released
According to Havok, various experts and financial markets, China is developing at least four lithography machines: dry DUV for 65nm process, first-generation DUV for 28nm, second-generation DUV for 2000i/2050i and first-generation EUV.
According to Havok, the first prototype will be delivered in 2020, and it will be officially released this year and can be mass-produced commercially. The second one will be released in 2020 at the earliest. Havok said that the prototype will be delivered in 2021, and according to his meaning of 2025, it is estimated that it will not be difficult to release it in 2025 and promote it on a large scale. The third-generation lithography machine will be first rumored in late 2022 and early 2023. The 7nm overlay equipment released by Shanghai Microelectronics last year is a proof. However, considering that the second-generation DUVI is an upgraded version of the first-generation DUVI, it is estimated that there will be no problem in completing the running-in in 2026. As for EUV, according to descriptions from all sides, the engineering prototype is likely to enter the general assembly stage, and it is unknown when it will be completed.
According to Havok, various experts and financial markets, China is developing at least four lithography machines: dry DUV for 65nm process, first-generation DUV for 28nm, second-generation DUV for 2000i/2050i and first-generation EUV.
According to Havok, the first prototype will be delivered in 2020, and it will be officially released this year and can be mass-produced commercially. The second one will be released in 2020 at the earliest. Havok said that the prototype will be delivered in 2021, and according to his meaning of 2025, it is estimated that it will not be difficult to release it in 2025 and promote it on a large scale. The third-generation lithography machine will be first rumored in late 2022 and early 2023. The 7nm overlay equipment released by Shanghai Microelectronics last year is a proof. However, considering that the second-generation DUVI is an upgraded version of the first-generation DUVI, it is estimated that there will be no problem in completing the running-in in 2026. As for EUV, according to descriptions from all sides, the engineering prototype is likely to enter the general assembly stage, and it is unknown when it will be completed.
Regarding the second generation DUV, we have to thank @WTAN, from the onset I remember during the darkest hour in 2019 he had given us hope and info regarding the lithography development inside China especially of the mythical 22nm DUV machine.
overlay accuracy of ≤8nm means with multipatterning it can do 8nm .
its being ambiguous which model it is. i think this range of spec include both DUV and DUVi family, it's not referring to a particular model.
I think this thread is just fine. But there should be a thread just for lithography machine only since that's the only major bottleneck