Chinese semiconductor thread II

[tokenanalyst]

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another ceramic 3D printer company demonstrating 3D printed wafer boat. 3D printing will revolutionise semi tool part manufacturing

Interesting, I have been following the idea of 3D printed components for semiconductor manufacturing equipment quite a while, it could allow more complex efficient devices and also reduce cost-time, the problem remains on how to deal with particle contamination or how to avoid that this part shed particles, maybe the reason because hasn't gained enough traction.

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[Rachmaninov]

Definitely not cost. And it would vary depending on the car and what level of computation is required. But byd also can get those chips from other domestic chipmakers. So a lot of these articles about domestic automakers needing to get to 25% using domestic supply is just nonsensical

Yes, so what I’m trying to get at is that it is possible the Nikkei article used cost as a measurement given most of the domestic chips cost next to nothing when compared to the non-domestic AI inference chips, main cockpit chip etc that you pointed out. Just to spin it as a failure in a misleading way, you know.

 

[tphuang]

Yes, so what I’m trying to get at is that it is possible the Nikkei article used cost as a measurement given most of the domestic chips cost next to nothing when compared to the non-domestic AI inference chips, main cockpit chip etc that you pointed out. Just to spin it as a failure in a misleading way, you know.

I honestly don't know what they use to measure it since Horizon Robotics will soon have a dominant market share in EV industry for AI inference chips

 

[Randomuser]

I honestly don't know what they use to measure it since Horizon Robotics will soon have a dominant market share in EV industry for AI inference chips

I know Horizon Robotics will be having an IPO to list in Hong Kong soon.

What makes it stand out compared to all the other chip companies that listed? A lot didn't really seem special after all.

 

[curiouscat]

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Looks like within the Chinese market sanctions have rendered Nvidia throughly uncompetitive.

 

[huemens]

ASML Is Hiring in China as Dutch Lithography Machine Giant Continues to Expand, Exec Says

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The Shanghai-based unit currently employs 1,700 people, up from 1,000 in 2019, which is a similar employment growth rate to its global operations.

More than half of ASML China’s employees are customer service engineers, and there are also about 400 technical developers

ASML’s customer support engineer team and technical development team have the most employees. The measurement division is based in Beijing, and its computational lithography business, including many software development and algorithm engineers, are mostly based in Wuhan and Shenzhen

 

[tphuang]

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Another Loongson 3A6000 equipped laptop using UOS has been unveiled for domestic market

 

[tokenanalyst]

Beijing CETC successfully delivered several domestically produced thinning machines​

According to the official WeChat account of Beijing Yizhuang, Beijing China Electronics Technology Group Corporation has successfully delivered several WG-1220 automatic thinning machines, the first of its kind in China.
According to relevant persons in charge, WG-1220 is one of the star models of thinning machines independently developed and launched by Beijing CETC after years of intensive cultivation and polishing. It is a domestic first-of-its-kind product with advantages such as small footprint, high integration and strong applicability. This product is a universal automatic thinning machine that can meet the latest processing requirements. It is widely used in the grinding of various hard and brittle materials such as silicon, epoxy resin, lithium tantalate, lithium niobate, ceramics, sapphire and electronic components. The single-spindle single-station structure only occupies an area of 1.47m2. According to the production line process requirements, it can support the axial feed (In-Feed) grinding principle and the deep cut creep feed (Creep-Feed) grinding principle to meet a variety of customized needs.

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[tokenanalyst]

Loongson 3C5000 CPU server won the bid for China Mobile's centralized procurement project​

On May 24, Loongson Technology announced through its official WeChat public account that China Mobile recently released the"Announcement of Candidates for the Centralized Procurement of PC Server Products in 2024 (Bid Package 21) of China Mobile", showing that Inspur Loongson 3C5000 CPU servers successfully won the bid for 2,400 units. Loongson Technology said that this is another breakthrough for Loongson to help the operator industry achieve independent control.
It is understood that Loongson 3C5000 is a general-purpose processor for the server field, using a completely independent Dragon architecture instruction system, a main frequency of 2.0-2.2GHz, 16 cores, 32MB shared on-chip cache and four 64-bit DDR4-3200 memory controllers.
In terms of performance, Loongson Technology said that the 16-core Loongson 3C5000 single-chip UnixBench score exceeded 9500 points, the double-precision computing power reached 560GFlops, and supports up to 16-way interconnection.
It is reported that the comprehensive performance of Loongson 3C5000 is close to the level of mainstream server CPU products on the market, and can meet the computing needs of general computing, large data centers, cloud computing centers, etc.
In terms of security, the processor can provide CPU-level intrinsic support for Information Security 2.0, trusted computing, national secret algorithm replacement, and network security vulnerability protection through chip-level security mechanisms.

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[tokenanalyst]

Leuven Instruments' patent for "an atomic layer etching method" was published

Tianyancha shows that Jiangsu Leuven Instrument Co., Ltd.'s patent for "A method for atomic layer etching" has been announced. The application publication date is May 14, 2024, and the application publication number is CN118039471A.

The present invention relates to the field of semiconductor devices, and specifically to an atomic layer etching method. The present invention provides an atomic layer etching method, comprising:
S1) subjecting a chlorine-based gas to plasma treatment to form a chloride layer on the surface atoms of a wafer; S2) subjecting a nitrogen-containing gas to plasma treatment to etch the chloride layer of the wafer in step S1). The method provided by the present invention can reduce the lattice damage and electrical damage to the wafer during atomic layer etching. Experiments show that after etching gallium nitride using the existing method, the N element content on the surface of the wafer is 51.4%; while after etching gallium nitride using the method described in the present invention, the N element content on the surface of the wafer is 47.8%; it can be seen that after modification with chlorine-based gas, the surface of the sample after etching with nitrogen-containing gas produces fewer N vacancies, which can effectively reduce the lattice damage and electrical damage caused by N vacancies.

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