In the case of Loongson's X86 emulation from what I understand it is partly done with software emulation. The biggest obstacle to independently implementing a X86 compatible processor is Intel's patents on ways to implement X86 directly in hardware.
Chinese semiconductor thread II
- Thread starter vincent
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"glass wafers to replace traditional silicon wafers"
What does it mean in technically? Can anyone please explain?
for now Huawei has ARM license but they are planning to develop its own instruction set..
Huawei has registered an instruction set trademark called LinxiISA.. This means Huawei is aiming for complete independence from ARM. Huawei is not just abandoning the ARM architecture but also the ARM instruction set.
Huawei isn't utilizing RISC-V, which is currently the most widely used general instruction set, balancing instruction count and simplification of instruction types.. Huawei has a broader vision
from this year onward, HarmoneyOS completely abandoned the Android base. Mate 70 later this yr will use pure blood Harmony OS HW is looking to have native Harmony OS app for all the apps that Chinese users spend time on.
so in near future i can see Loongson might use Huawei's architecture design if ARM revoke license.
Loongson doesn't use x86, it has it's own ISA called LoongArch
Glass is used as an interposer in advanced packaging rather than silicon.
Onto the HBM situation, it appears that CXMT has a HBM2 production line according to this article. I suppose the question would be when Chinese chipmakers (be that CXMT or Huawei's Swaysure) can set up a HBM3 line.
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Right now chips are basically wires on silicon boards. Think about a motherboard or sound card. It's a bunch of wires printed onto a green board right? That green board is silicon. Chips are basically mini-versions of this with tiny nanometer wires printed on silicon and then packaged into a chip.
What the article is saying is they can print it onto glass now. This isn't too surprising as glass and silicon both do not conduct electricity much. This is why we use silicon, to keep the electricity in the wires separate. The question actually isn't can you do this, but can you do this at an atomic level required for modern chips. It's not going to be too useful if you can only etch 400nm chips in glass for example.
If China was desperate enough, they would ignore Intel patents. I expect the new cold war to get so intense in the future that all patents will be ignored. I expect US to first ignore Chinese patents citing "national security" and then China will follow suit.
With a total investment of approximately 2.8 billion yuan, Xinhua Semiconductor’s annual 10,000-ton electronic-grade polysilicon project was completed.
On April 18, Mengyuan Sixth Construction announced that Inner Mongolia Xinhua Semiconductor Technology Co., Ltd.’s 10,000 tons per year high-purity electronic grade polysilicon industrial cluster project was successfully completed. The project is located in Zhonghuan Industrial Park, Jinhe Town, Saihan District, Hohhot City, Inner Mongolia. The project covers an area of 216,450 square meters, with a total construction area of 153,000 square meters, and a total investment of approximately 2.8 billion yuan.
It is reported that after the project is completed and reaches production, it can achieve long-term and stable supply to global customers with an annual production capacity of 10,000 tons of high-purity electronic grade polysilicon, 500 tons of electronic grade dichlorodihydrogen silicon, 3,000 tons of electronic grade trichlorosilane and electronic grade tetrahydrogen silicon. Silicon chloride has a production capacity of 3,000 tons to meet the global semiconductor market demand.
The project started on September 1, 2022. The Inner Mongolia Branch's construction scope includes: post-processing (including three-dimensional storage, desalted water, high-purity water, silicon core drawing, laboratories, etc.), reduction (water-containing system and corridor), precision Distillation (including intermediate tank area), exhaust gas recovery, electronic special gas, zone melting workshop, construction and installation engineering of all devices, and pipes, cables and instrument cables between each device are based on the feeding system. Currently, it has entered the trial production stage.
Wow! Very nice explanation. Thanks.