Zhuhai Tiancheng’s advanced 12-inch wafer-level TSV three-dimensional integration project equipment moved in
March 30, the brand launch conference and equipment move-in ceremony of Zhuhai Tiancheng Advanced Semiconductor Technology Co., Ltd. (hereinafter referred to as: Tiancheng Advanced) was successfully held in Zhuhai, Guangdong.
Tiancheng Advanced was established in April 2023 and is located in Zhuhai High-tech Zone with a registered capital of 950 million yuan. It is committed to the research, development and innovation of semiconductor three-dimensional integration technology, focusing on providing 12-inch 3D/2.5D-TSV, 2.5D-Fanout, UHD- FCBGA system integration and wafer-level advanced packaging solutions.
It is reported that Zhuhai Tiancheng's advanced 12-inch wafer-level TSV three-dimensional integration project is a pillar project promoted by Zhuhai City. A groundbreaking ceremony was held in Zhuhai High-tech Zone on March 30, 2023. During the ceremony, Xi'an Microelectronics Technology Research Institute and Zhuhai Gexin Construction and Development Co., Ltd. jointly signed the "12-inch TSV three-dimensional integration project industrial park lease agreement." News at the time showed that the project was jointly invested and established by Xi'an Microelectronics Technology Research Institute, China Times Yuanwang Technology Co., Ltd., Zhongxing New Communications Co., Ltd., Shenzhen Innovation Investment Group Co., Ltd., and Zhuhai Gejin No. 6 Equity Investment Fund.
Gree Group news shows that the project took 210 days to cap the main body of the project, and the equipment was successfully brought into the site, laying a solid foundation for the project to be fully put into production within this year. In August 2022, Gree Group used the self-managed Gejin No. 6 Fund as the main investor to participate in the establishment of Tiancheng Advanced and became a shareholder of the company. "Investment promotion" promoted its implementation of 12-inch wafer-level TSV three-dimensional in Zhuhai High-tech Zone Integrate projects and cooperate with high-tech investment to build customized factories. After the completion of the first phase of construction, it will have the annual production capacity of 240,000 pieces of TSV three-dimensional integrated products, and after the completion of the second phase, it will have the annual production capacity of 600,000 pieces of TSV products.