Chinese semiconductor thread II

[tokenanalyst]

JCET Group is aggressively expanding its high-end packaging capabilities, driven by surging demand for high-performance computing and high-density storage applications.​

This strategic focus has yielded significant financial results, with the company’s advanced packaging revenue reaching a record high of RMB 27 billion in 2025. By transitioning from mere technology leadership to a model of large-scale, platform-based, one-stop delivery, JCET has systematically built comprehensive solutions covering computing, storage, connectivity, and power management, thereby securing strong recognition from customers in intelligent computing centers.

To maintain its competitive edge, JCET has intensified investments in key technological breakthroughs and mass production, resulting in the launch of the XDFOI® series of high-end advanced packaging platforms. These platforms offer diverse solutions such as silicon interposers and organic RDL interposers to meet varying interconnect densities and cost requirements. Additionally, the company is advancing co-packaged optoelectronics (CPO) through heterogeneous integration and has successfully innovated SiP-based 2.5D vertical VCORE power module packaging, while also strengthening engineering capabilities in thermal management and reliability verification for system-level integration.

The company’s operational success is reflected in its record-breaking overall operating revenue of RMB 38.87 billion in 2025, supported by sustained capacity expansion and manufacturing upgrades. Wafer-level packaging and other advanced packaging facilities maintained high-load operations throughout the year, facilitated by substantial progress in capacity release at JCET Microelectronics. This continuous optimization allows highly complex processes to mature and iterate efficiently within large-scale operations, ensuring that scale and performance remain robust market tests for the company’s growing capabilities.

Underpinning this industrial growth is a strong commitment to research and development, with R&D investment rising to RMB 2.086 billion in 2025, representing a compound annual growth rate of approximately 15.1% since 2021. As of the end of 2025, JCET held over 3,100 patents, including more than 2,600 invention patents, which support its diversified solutions for 2.5D technologies and beyond. Looking ahead, JCET aims to leverage these clustering effects to further drive industry chain collaboration, focusing on improving the efficiency of high-end capacity to serve the large-scale development of the computing and storage sectors.​

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[tokenanalyst]

Silicon Microelectronics' Chengdu plant officially commences production, becoming the fastest wafer fabrication facility to go into operation in China.​

On April 22, the Chengdu base project of Sichuan Silicon Microelectronics Technology Co., Ltd. (hereinafter referred to as "Silicon Microelectronics") recently achieved the successful processing and production of its first 8-inch wafer and successfully completed small-batch trial production, becoming the fastest wafer fab in China to be put into production.

Founded in 2015, Silicon Microelectronics is a CXO company specializing in advanced semiconductor packaging. The company's core team possesses extensive experience in advanced semiconductor packaging process development and mass production. It primarily provides customers with comprehensive solutions encompassing core processes such as UBM (Under-Bump Metallization), RDL (Redistribution Layer), Bumping, temporary bonding thinning, and copper-copper bonding, as well as customized development (CDO), foundry (CDMO), and material and equipment (CMO) solutions.

The company's current business mainly covers power semiconductors (IGBT/SiC MOS/power ICs, etc.) and radio frequency microwave fields, with products widely used in new energy, artificial intelligence, automation, consumer electronics and other industries. In 2019, the company obtained automotive-grade IATF16949 certification, and its first self-developed import-substituting automotive-grade product has processed and delivered more than 40,000 wafers. In recent years, the company has completed process development, verification and mass production of dozens of products for downstream customers, and many products (processes) have filled the gap in domestic high-end packaging.

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[tokenanalyst]

Integrated multi-wavelength interferometer using waveguide holograms for nanometer precision sensing.​

We present a tri-wavelength integrated photonic interferometer for nanometer-resolution displacement sensing in semiconductor metrology. The device integrates large-area waveguide hologram couplers optimized for 635 nm, 780 nm, and 850 nm to illuminate and receive light from a reflective target, forming a Mach–Zehnder interferometer. A novel design method enables scalable intensity control, achieving an average focusing efficiency of , the highest reported for tri-wavelength couplers, to our knowledge. Interferometric operation was verified at 633 nm and 775 nm. Displacement measurements were demonstrated down to 16 nm, currently limited by the resolution of the external translation stages. Picometer-scale resolution is feasible using commercially available signal processing systems. These results demonstrate a path toward compact, solid-state, high-resolution optical metrology systems.

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[tokenanalyst]

Zhengzhou Hejing's 12-inch silicon wafer production line has been fully operational and is expected to begin production in June.​

According to Dahe Finance Cube, on the afternoon of April 21, during an on-site visit to Zhengzhou Hejing Silicon Materials Co., Ltd. (tentative abbreviation: Zhengzhou Hejing) located in Zhengzhou Airport Economic Zone, Chairman Zhong Yousheng shared good news about the second phase of the project—the 12-inch large silicon wafer production line is basically fully operational, and the testing and certification docking work with potential customers is also underway. It is expected to be put into production in June.

Zhengzhou Hejing, established in 2017, primarily engages in the R&D, design, production, and sales of 8-inch and 12-inch monocrystalline silicon polished wafers and epitaxial wafers. It is a wholly-owned subsidiary of Shanghai Hejing Silicon Materials Co., Ltd. (hereinafter referred to as Shanghai Hejing). According to Shanghai Hejing's 2025 annual report, Zhengzhou Hejing's operating revenue and net profit were RMB 569 million and RMB 34.5421 million, respectively, representing year-on-year growth of 23.61% and 129%. Construction of the Zhengzhou Hejing project began in 2018, production commenced in 2019, and full production and sales were achieved in 2021, resulting in profitability.

It is understood that 8-inch epitaxial wafers are currently the main product of Zhengzhou Company, and the company has accumulated certain customer advantages, primarily used in power devices such as automotive chips. The company's 12-inch semiconductor silicon wafers are already in production and are mainly used in image sensors, logic chips, and other fields. Compared to 8-inch epitaxial wafers, 12-inch semiconductor silicon wafers not only have a larger size but also higher requirements for parameters such as surface quality, cleanliness, and flatness, thus requiring more stringent engineering processes.

Polished wafers, also known as "bare wafers," are a combination of a precision-polished semiconductor substrate and a high-quality epitaxial layer grown on its surface. They are crucial for manufacturing high-end chips, power devices, and other products. In a broader sense, wafers include both polished and epitaxial wafers. The textured wafers commonly seen are those that have undergone further processing at the wafer fab, with circuitry etched onto them. Wafers with complete circuit patterns are then diced, packaged, and tested to create individual chips that are ultimately used in various electronic devices.

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[tokenanalyst]

A major Jiangsu project worth 1 billion yuan! The Oudi Semiconductor Specialized Equipment Project has made significant progress.​

According to Wuzhong News, the No. 2 factory building of the Oudi Semiconductor Special Equipment Project, a major project in Jiangsu Province in 2026, has been capped. The project has a registered capital of 140 million yuan, a planned total investment of 1 billion yuan, covers an area of 53 mu (approximately 3.5 hectares), and has a planned building area of approximately 130,000 square meters (including factory buildings, R&D buildings, and living facilities). It will be built into a headquarters and R&D and production base for chip testing equipment.

Suzhou Oudi Semiconductor Technology Co., Ltd. is a wholly-owned subsidiary of Saiteng Co., Ltd., established in Wuzhong Economic Development Zone in 2022. It is primarily responsible for Saiteng's business in the semiconductor front-end inspection field and undertakes the transformation of Optima technology acquired by Saiteng, aiming to introduce advanced foreign semiconductor technologies to China and further expand its presence in the semiconductor industry. The company's main products include optical wafer defect inspection equipment, such as wafer edge inspection, wafer front and back side inspection, macroscopic inspection, and pinhole inspection . Its major clients include TSMC, Samsung, and Zhonghuan Semiconductor.

The Oudi Semiconductor Special Equipment Project plans to purchase more than 400 sets of equipment, including high-precision machining centers, gantry milling machines, welding robots, and CNC machining centers, which is expected to form an annual production capacity of 1,200 sets of semiconductor special equipment.

According to reports, the excavation of the deep foundation pit for Building No. 1 of the project is currently about 70% complete. In Block 1 south of the expansion joint, pile foundation testing has been completed, and concrete foundation pouring is underway. Building No. 2 has been topped out, and the main frame construction of the vehicle ramp is in progress.

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[tokenanalyst]

Wuhan's Q1 report: Integrated circuit wafer production surges 49.8%​

Wuhan’s economy demonstrated robust growth in the first quarter of 2026, with GDP reaching 504.299 billion yuan, marking a 5.7% year-on-year increase at constant prices. This expansion was primarily driven by the secondary industry, which saw an 8.2% rise in added value, significantly outpacing the primary and tertiary sectors, which grew by 4.3% and 4.4%, respectively. Industrial production was particularly strong, with enterprises above designated size increasing their added value by 11.6%. High-tech manufacturing emerged as a key growth engine, surging by 45.4% and accounting for over 30% of total industrial added value, while profits for these large-scale industrial enterprises skyrocketed by 129.0% from January to February.

The surge in industrial output was highlighted by explosive growth in high-tech products, including a 154.8% increase in civilian drones, a 49.8% jump in integrated circuit wafers, and a 48.3% rise in tablet computers. Simultaneously, the service sector maintained steady momentum with a 4.4% overall growth, characterized by improvements in quality and capacity within modern service industries. Key areas such as leasing and business services, scientific research, and information technology services experienced double-digit increases in operating income for large-scale enterprises, reflecting a diversified and strengthening economic foundation across both manufacturing and service domains.​

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[tokenanalyst]

Topway Technology: Launched new products increasing performance and enhancing core competitiveness in advanced manufacturing processes.​

On March 25, 2026, Piotech launched four new product series at SEMICON China 2026:

1) Two new ALD (Atomic Layer Deposition) products with advanced performance, meeting high throughput requirements while boasting excellent floor space efficiency and CoO (CoO).

2) New PECVD products with applications including low-dielectric thin films for advanced logic back-end layers, and compatible with low-dielectric thin films for logic ≤28nm back-end layers, achieving "low" dielectric constant and "high" mechanical strength of the dielectric film.
3) The Gap-fill series products can be used in pattern transfer modification, etching barrier layers, and pattern planarization processes in advanced memory and advanced logic processes, boasting the industry's highest floor space efficiency and lowest cost (CoO).

4) The 3D IC series of new products covers multiple new products such as fused bonding and laser lift-off, focusing on advanced logic chip chip heterogeneous integration, 3D stacking, and HBM-related applications.

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[tokenanalyst]

Nanochip Microelectronics introduces its new generation isolated CAN transceiver, the NSI1150, which supports ±70V bus protection voltage and higher communication rates.​

Nanochip today announced the launch of its new industrial-grade isolated CAN transceiver , the NSI1150 . Based on Nanochip's third-generation isolation technology, the new device provides a bus protection withstand voltage of ± 70V and a CMTI of up to ± 150kV/ μs (typical) . Reliability and noise immunity have been comprehensively improved compared to its predecessor ( NSI1050 ). The NSI1150 also integrates Nanochip's self-developed CAN FD transceiver, which can provide communication rates of up to 5Mbps .

The NSI1150 supports multiple packages such as SOW16 , SOW8 , SOP8 , SOWW8 , and DUB8 to meet diverse design needs. It can be widely used in high-voltage, high-interference, and multi-node applications such as industrial automation and control, energy and power, communication and servers.​

Reliability has been comprehensively upgraded to meet demanding application requirements.

The NSI1150 achieves industry-leading levels of reliability and immunity, easily handling the challenges of strong electromagnetic interference and ground potential differences in harsh scenarios with a high CMTI of ±150kV/μs (typical) and a bus protection withstand voltage of ±70V .
In addition, the NSI1150 supports ±6kV HBM ESD protection and 10kV isolation barrier surge withstand on all pins , ensuring stable communication in extreme environments; the isolation withstand voltage covers multiple options of 3kVRMS , 5kVRMS , and 7.5kVRMS , meeting the stringent safety requirements of various applications and building a solid safety barrier for key scenarios such as industrial automation and energy power.

Multiple packaging options are available to support diverse design needs.
The NSI1150 offers five mainstream package options: SOW16 , SOW8 , SOP8 , SOWW8 , and DUB8 , adapting to different design space and safety requirements. Among them, the newly launched SOWW8 ultra-wide package, with its up to 15mm creepage distance, can easily meet the mandatory creepage distance requirements in photovoltaic, charging pile, and industrial power supply fields, simplifying the safety certification process and providing more flexible layout space for high power density system designs. This multi-package matrix product family further supports diverse user design needs and improves system deployment efficiency.
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[tokenanalyst]

Naura is getting into high end vacuum systems and optics.

North China Microelectronics: Accelerating R&D of etching and thin film equipment; epitaxial growth through acquisitions of Sinyuan Microelectronics and Guotai Vacuum.　　​

North China Microelectronics acquired a 17.87% stake in Xinyuan Microelectronics and a 90% stake in Chengdu Guotai Vacuum, expanding into cleaning, coating and developing, and high-end optical equipment. In 2025, the company actively promoted its "external acquisition" strategy, completing the integration of excellent companies such as Xinyuan Microelectronics and Chengdu Guotai Vacuum, significantly enhancing its platform-based solution capabilities and collaborative innovation potential in key areas such as coating and developing and vacuum coating. Sinyuan Microelectronics is a leading domestic manufacturer of front-end coating and developing machines, whose main products include front-end coating and developing machines, back-end advanced packaging coating and developing machines, and compound small-size coating and developing machines. North China Microelectronics holds a 17.87% stake and has secured a majority of board seats, thus gaining control.
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[PopularScience]

China's domestically developed 6nm graphics card gains Microsoft's approval; Lisuan Technology resolves Windows compatibility issues.

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