MLOptic Large Aperture Interferometer. The company make lithography optics components.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
surprisingly today i was looking for domestic alternative of DUV/DUVi photomask. so we have up to 28nm in verification stage soon and second phase which started this year will focus on 14nm in logic but also cover memory sector and display sector.
there is also one more Shenzhen based Qingyi company to invested 3.5 Billion Yuan in high precision flat panel display and logic IC. last year production has started.
Japan had near monopoly in Photomask category but it is now gradually losing the market share.
interesting patent.
Large Aperture Deep Ultraviolet (DUV) Interferometer is a high-precision optical metrology tool used primarily Measuring the surface form and transmitted wavefront quality of lenses and wafers used in DUV lithography. so they are now making their tool as well.
I think their monopoly is in photomask blanks rather than the photomask itself.
A major semiconductor materials project in Hefei has officially started production.
On April 17, Weimai Semiconductor Co., Ltd., located in Hefei New Station High-tech Zone, officially started production.
Located at the intersection of Longzihu Road and Yingzhou Road in Hefei New Station High-tech Zone, the project represents a total investment of 300 million yuan, covering an area of approximately 50 mu (about 3.3 hectares). With a planned annual production capacity of 100 tons, it aims to create the largest mass production base in China for core materials of high-end semiconductor DUV-level (ArFi/ ArF / KrF ) photoresists . Mass-produced products include photoacid generators (PAG), resins , and photoinitiators ( PI ) . The successful commencement of production will further enhance the localization of key raw materials and inject significant new momentum into Hefei's semiconductor industry.
Located at the intersection of Longzihu Road and Yingzhou Road in Hefei New Station High-tech Zone, the project represents a total investment of 300 million yuan, covering an area of approximately 50 mu (about 3.3 hectares). With a planned annual production capacity of 100 tons, it aims to create the largest mass production base in China for core materials of high-end semiconductor DUV-level (ArFi/ ArF / KrF ) photoresists . Mass-produced products include photoacid generators (PAG), resins , and photoinitiators ( PI ) . The successful commencement of production will further enhance the localization of key raw materials and inject significant new momentum into Hefei's semiconductor industry.
Weimai Core Materials is headquartered in Suzhou, with two mass production plants in South Korea. The company has long been deeply involved in the core material field of photoresist, and has achieved a breakthrough in the mass production of 7/14 nanometer processes (ArFi/ArF). It has successfully developed and delivered hundreds of products, and has basically completed the introduction and full coverage of the leading domestic semiconductor photoresist companies.
The groundbreaking ceremony for the Gaomei Semiconductor Equipment Components Project was held in Zhongkai.
On April 17, the groundbreaking ceremony for the R&D and manufacturing project of core components for semiconductor equipment of Gaomeike Semiconductor was held in Zhongkai Area of China-Korea (Huizhou) Industrial Park.
It is reported that the project has a planned total investment of approximately 150 million yuan, and is expected to achieve an annual output value of approximately 300 million yuan after it goes into operation. The project is invested and constructed by KoMiCo Group, a globally renowned semiconductor cleaning and coating company from South Korea. The group has core technological advantages in the field of semiconductor equipment cleaning and professional coating, and has overcome the "hidden difficulties" of stringent precision and cleanliness requirements in semiconductor and display manufacturing. It has a complete technology system, and its customers include leading global companies such as Samsung, Intel, BOE, CSOT, and AMEC.
The newly launched Gaomike project will fully inherit the advanced process technologies of the group headquarters. Building upon its existing cleaning and coating businesses, it will add new production lines, focusing on providing high-corrosion-resistant and high-hardness surface treatment solutions for dry etching and thin-film deposition processes. In the future, the project will focus on strategic clients in the surrounding area, such as LG Display and CSOT, establishing an immediate response service system and striving to become the most competitive precision component recycling and processing center in South China.
It is reported that the project has a planned total investment of approximately 150 million yuan, and is expected to achieve an annual output value of approximately 300 million yuan after it goes into operation. The project is invested and constructed by KoMiCo Group, a globally renowned semiconductor cleaning and coating company from South Korea. The group has core technological advantages in the field of semiconductor equipment cleaning and professional coating, and has overcome the "hidden difficulties" of stringent precision and cleanliness requirements in semiconductor and display manufacturing. It has a complete technology system, and its customers include leading global companies such as Samsung, Intel, BOE, CSOT, and AMEC.
The newly launched Gaomike project will fully inherit the advanced process technologies of the group headquarters. Building upon its existing cleaning and coating businesses, it will add new production lines, focusing on providing high-corrosion-resistant and high-hardness surface treatment solutions for dry etching and thin-film deposition processes. In the future, the project will focus on strategic clients in the surrounding area, such as LG Display and CSOT, establishing an immediate response service system and striving to become the most competitive precision component recycling and processing center in South China.
Basic Semiconductor launches three top-heat-dissipating package products: QDPAK, TOLT, and T2PAK-7.
Basic Semiconductor has officially launched a new series of high-performance power devices featuring the QDPAK, TOLT, and T2PAK-7 packages, all built upon its third-generation silicon carbide (SiC) MOSFET technology platform. Targeted primarily at industrial and automotive sectors, these products are engineered to solve critical challenges in modern power electronics by combining enhanced chip performance with innovative packaging designs that focus on maximizing heat dissipation while maintaining high efficiency and system compatibility.
The core of this launch lies in its advanced "top-heat" package design, which allows heat to flow directly from the device into an external heatsink rather than being limited by the PCB copper layer. This innovation significantly improves thermal management in space-constrained environments and supports both air-cooled and liquid-cooled applications without requiring complex system modifications. Additionally, leveraging the B3M series technology, these devices offer exceptional high-temperature stability with minimal resistance drift up to 175°C, ensuring reliable operation in harsh conditions through optimized voltage ranges (650V standard, extending to 1200V for QDPAK) and low on-resistance options.
Designed for seamless integration into existing designs, the new product series is pin-compatible with mainstream industry-standard devices, which greatly reduces customer costs associated with redesign and testing. By offering both industrial-grade and automotive-grade reliability levels simultaneously, Basic Semiconductor provides a versatile "one-stop" solution that meets diverse requirements across power supplies, energy storage, inverters, light electric vehicles, and on-board charging systems. This strategic release not only accelerates product development cycles but also delivers tangible benefits in cost reduction, system performance, and overall supply chain efficiency for its target markets.
NSI6911F series, the first domestically produced ASIL D-level isolated gate driver from Naxin Microelectronics, has been certified by TÜV Rheinland.
Naxin Microelectronics has officially launched the NSI6911F series of isolated gate drivers, marking a significant milestone as China's first domestically produced product based entirely on a fully domestic supply chain. Certified by TÜV Rheinland to meet ISO 26262 ASIL D standards, this breakthrough device addresses critical safety requirements in new energy vehicle (NEV) electric drive systems. Designed specifically for high-voltage applications such as main drive inverters, on-board chargers, and DC-DC converters, the NSI6911F series aims to enhance system reliability while supporting rapid domestic localization in the semiconductor industry.
To meet the escalating demands of 800V high-voltage platforms and Silicon Carbide (SiC) power devices, the NSI6911F features exceptional performance capabilities that prioritize anti-interference and drive precision. The series offers a peak drive capability of up to 19A and maintains a common-mode transient immunity (CMTI) of ±150kV/μs, ensuring robust operation under high dv/dt conditions typical of modern fast-switching architectures. Furthermore, the chip integrates an advanced 12-bit high-precision isolated sampling ADC and sophisticated diagnostic architecture, providing OEMs with higher safety margins and improved system integration for complex electric drive environments.
The strategic release of this product is driven by evolving national standards that mandate ASIL C or D functional safety levels for key NEV systems, such as those related to preventing unexpected torque and coordinated braking energy recovery. With the widespread adoption of standards like GB/T 43254-2023 and GB 21670-2025, gate drivers capable of directly supporting system design have become essential foundations for manufacturers aiming for mass production compliance. The NSI6911F series fills this gap by offering a hardware foundation that strictly adheres to the ISO 26262 V-Model development process, providing rigorous verification from initial safety assumption definitions through comprehensive functional safety analysis.
By passing TÜV Rheinland's authoritative certification and meeting the highest ASIL D requirements, the NSI6911F series serves as a critical enabler for domestic automotive supply chains. Naxin Microelectronics leverages its comprehensive functional safety documentation system and technical support capabilities to assist OEMs and Tier 1 suppliers in efficiently completing their own functional safety assessments. Ultimately, this certification not only shortens development cycles but also empowers Chinese manufacturers to achieve global safety compliance standards while accelerating the transition toward safer, higher-performance electric vehicles.
Kirin 9030S vs 9030 Pro.
1 fewer physical core. Large core downgraded from 2750 MHz to 2700. Medium core downgraded from 2270 MHz to 2150 and reduced to 3 physical core. Small core downgraded from 1720 MHz to 1620.
GPU downgraded from 935 to 935F
1 fewer physical core. Large core downgraded from 2750 MHz to 2700. Medium core downgraded from 2270 MHz to 2150 and reduced to 3 physical core. Small core downgraded from 1720 MHz to 1620.
GPU downgraded from 935 to 935F
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