Chinese semiconductor thread II
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AMEC to showcase 4 new product in SMEICON China 2026 including
next gen ICP Primo Angnova, high-selectivity etcher Primo Domingo, Smart RF Match intelligent RF matcher and Micro LED MOCVD equipment Preciomo Udx
first 2 are for high aspect ratio etching and 3D semi modules, sounds like 3D NAND allowing for more layers on YMTC.
CETC showcasing all the product it has at China's SEMICON 2026.
this includes 4-12 inch substrate to epitaxy for different semi material types
SiC coating, 12-inch ingot thinning, substrate thinning and laser lift off equipment + CMP
Newly developed medium-energy, high-current hydrogen ion implantation using new software platform that's 4x faster.
From the "impossible triangle" to atomic-level deposition: Li Jianheng of Andecom interprets the breakthrough path of thin film materials under advanced processes.
At the inaugural International Forum on Advanced Materials during SEMICON China 2026, Dr. Jianheng Li of Andecom highlighted how the semiconductor industry is facing a critical bottleneck as it scales toward a projected $1 trillion market by 2027. Driven by surges in AI, autonomous driving, and quantum computing, technology nodes are shrinking to atomic-level precision, making material properties rather than just structural design the primary determinant of success. With device architectures evolving from FinFETs to complex three-dimensional structures like GAA logic and multi-layer 3D memory, the reliance on selective deposition and conformal thin-film processes has become paramount, demanding materials that can maintain performance under extreme miniaturization constraints.
To address the historical challenges of precursor development, Dr. Li identified a conflict between volatility, thermal stability, and reactivity as an "impossible triangle" that traditional trial-and-error methods could no longer resolve. He proposed a paradigm shift toward AI-driven innovation, leveraging tools like Density Functional Theory (DFT) simulations and high-throughput data models to predict adsorption behaviors and optimize growth parameters before physical experimentation. This approach significantly accelerates the timeline from molecular design to mass production, allowing companies like Andecom to rapidly iterate solutions that meet the rigorous demands of next-generation lithography and etching processes.
The presentation outlined three specific frontiers where breakthroughs are essential: High-K dielectrics, metallic interconnects, and atomic-scale selective deposition (ASD). For High-K films, the focus is on developing precursors with superior thermal stability to reduce leakage currents while maintaining excellent step coverage at high temperatures. In metal interconnects, Ruthenium is emerging as a critical solution for nodes below 5nm due to its anti-electromigration properties, though Molybdenum offers a cost-effective alternative with lower resistivity and improved grain size; notably, Andec is pioneering fluorine-free molybdenum precursors to prevent damage to surrounding dielectric layers. Additionally, ASD technologies utilize intrinsic molecular differences or surface activation to enable self-aligned patterning, simplifying complex manufacturing flows.
Finally, Dr. Li emphasized Andecom's "whole-chain" capability as a strategic response to these global challenges. Since establishing its R&D and production bases in Hefei and Tongling in 2018, the company has integrated molecular design, small-batch synthesis, process verification, and large-scale domestic manufacturing into a cohesive solution. By partnering closely with leading Chinese foundries, Andecom is actively helping to overcome specific process bottlenecks through high-purity materials like Ruthenium and advanced delivery systems. Ultimately, Dr. Li concluded that the future of semiconductor advancement depends on efficiently bridging the gap between theoretical calculations and industrial reality through innovative, end-to-end material solutions.
Shengmei Shanghai launches "Shengmei Chip Drive," showcasing a brand-new product architecture.
ACM Research Shanghai announces a restructuring of its product portfolio and a brand refresh, officially launching the new product portfolio architecture, "ACM Chip Panel." Under the new "ACM Chip Panel" architecture, ACM Research Shanghai's products are divided into eight independent product series, named after the eight planets of the solar system, each corresponding to a core process in the semiconductor manufacturing process.
Earth Series: As the foundation of Shengmei's journey (starting in 2009), this series focuses on cleaning equipment; leveraging original technologies like SAPS/TEBO and supercritical CO₂ processes, it achieves near-total coverage of chip manufacturing cleaning to improve yield.
Jupiter Series: Dedicated to advanced wafer-level packaging since 2012, this line includes various wet process tools (etching, stripping, coating) that have enabled the step-by-step leapfrog development of 3D integrated packaging technology.
Venus Series: Symbolizing stability and reliability, this electroplating series has secured market presence since 2016 and now offers full-process coverage from front-end damascus plating to back-end TSV using unique multi-anode technology for both round and square wafers.
Mars Series: Representing breakthroughs in the dry process equipment market (launched with its first vertical furnace order in 2020), this series covers critical steps from LPCVD and tempering to atomic-level ALD deposition, driven by resilience and strength.
Mercury Series: Launching in 2022 as a symbol of speed and precision, this coating and developing equipment line complements photolithography; it recently achieved leapfrog development with the launch of high-output KrF machines.
Saturn Series: Introduce triple-stack plasma chamber design and RF control technology, this CVD equipment series embodies enduring reliability while building a solid structural foundation for chip manufacturing through advanced process engineering.
Uranus Series: Responding to the demand for large-scale AI chip packaging in 2024, this line represents innovation and breakthroughs with panel-level tools (electroplating, cleaning, etching), facilitating the industry's shift toward panel-based transformation.
Neptune Series: Symbolizing profundity and foresight, this stress-free polishing equipment pushes planarization technology to atomic levels for on-chip and within-grain applications, serving as a key strategic step for future high-performance AI chip production.
This reorganization of the new product line clearly reflects the company's development trajectory since its establishment in 2005—from a single cleaning product line to a diversified product matrix with complete categories and complementary synergies. By incorporating the entire product range into a clear and unified architectural system, we will further strengthen our long-term development strategy of "technological differentiation, product platformization, and global customer service."
China's first 8-inch silicon photonics chip mass production line has begun construction, with an initial investment of 1.2 billion yuan.
According to the Suzhou Integrated Circuit Innovation Center, on March 24, the silicon photonics platform of Suzhou Xingyue Photonics Technology Co., Ltd. broke ground in Suzhou High-tech Zone and is expected to be operational by the end of this year. This is also the first 8-inch mass production line in China focusing on silicon-based photonic chips.
The StarKey Photonics Silicon Photonics Platform is jointly built by industry leaders such as Changguang Huaxin, Hengtong Optic-Electric, and Donghui Optics. It will construct the first 8-inch 90nm process silicon photonics production line and heterogeneous integration platform in China, build an independent and controllable silicon-based optoelectronic integrated chip manufacturing ecosystem, and build a collaborative innovation and full-industry chain support platform for domestic laser, silicon photonic chip, and electronic chip companies. Its products are widely used in cutting-edge fields such as optical communication, optical interconnection, optical sensing, optical display, optical computing, artificial intelligence, 6G communication, and autonomous driving.
It is reported that the first phase of Xingyao Photonics' silicon photonics platform has a total investment of 1.2 billion yuan , which will build an 8-inch 90-nanometer process node production line to meet the market demand for 1.6T and 3.2T silicon photonics modules and build an independent and controllable silicon-based optoelectronic integrated chip manufacturing ecosystem.
The photonics industry is a strategic emerging industry that Suzhou High-tech Zone is focusing on developing. In recent years, guided by the goal of building a world-class Taihu Photonics Center, Suzhou High-tech Zone has continuously gathered innovative resources and improved its industrial ecosystem, initially forming a complete industrial chain from basic research and technological breakthroughs to industrial applications.
The StarKey Photonics Silicon Photonics Platform is jointly built by industry leaders such as Changguang Huaxin, Hengtong Optic-Electric, and Donghui Optics. It will construct the first 8-inch 90nm process silicon photonics production line and heterogeneous integration platform in China, build an independent and controllable silicon-based optoelectronic integrated chip manufacturing ecosystem, and build a collaborative innovation and full-industry chain support platform for domestic laser, silicon photonic chip, and electronic chip companies. Its products are widely used in cutting-edge fields such as optical communication, optical interconnection, optical sensing, optical display, optical computing, artificial intelligence, 6G communication, and autonomous driving.
It is reported that the first phase of Xingyao Photonics' silicon photonics platform has a total investment of 1.2 billion yuan , which will build an 8-inch 90-nanometer process node production line to meet the market demand for 1.6T and 3.2T silicon photonics modules and build an independent and controllable silicon-based optoelectronic integrated chip manufacturing ecosystem.
The photonics industry is a strategic emerging industry that Suzhou High-tech Zone is focusing on developing. In recent years, guided by the goal of building a world-class Taihu Photonics Center, Suzhou High-tech Zone has continuously gathered innovative resources and improved its industrial ecosystem, initially forming a complete industrial chain from basic research and technological breakthroughs to industrial applications.
Andecom launched its independently developed new LDS equipment.
the ADC500 model with solvent cleaning capabilities. The machine is divided into two parts: the upper part houses the controller, which includes a built-in PLC control module and electrical control components; the lower cabinet is the mechanical structure, containing a dense network of pipes, pneumatic valves, pressure gauges, and other components. Five cylinders are located at the bottom of the cabinet: a precursor source bottle, buffer bottle A, buffer bottle B, solvent source bottle, and solvent recovery bottle. Furthermore, safety detection components are installed at the top and bottom of the equipment, which can promptly alarm and activate interlocking protection devices in case of chemical leaks, fires, or other abnormalities.
As advanced manufacturing processes place higher demands on precursor materials, the adaptability of delivery systems becomes increasingly critical. Andecom's unique strength lies in its extensive data accumulated in precursor material development, enabling it to establish a joint development team encompassing materials, containers, and equipment. By incorporating key parameters such as material viscosity and volatility into the core functional testing of the LDS (Liquidity Detection System), equipment development transcends the mechanical level, achieving holistic optimization based on material properties. This integrated approach allows them to provide customers with collaborative "materials + equipment" solutions, improving process stability while reducing the costs associated with adapting to multiple suppliers.
adchem-tech.com
AMEC launched four new products simultaneously to accelerate platform development through deep innovation.
On March 25, 2026, AMEC (Advanced Micro-Fabrication Equipment Inc.) announced the simultaneous launch of four major new products designed to accelerate platform development and advance deep innovation in semiconductor manufacturing. The releases covered critical processes for both silicon-based and compound semiconductors, strengthening AMEC's capabilities in etching equipment, thin-film deposition (MOCVD), and core intelligent components.
The lineup includes:
- Primo Angnova™: Next-generation ICP plasma etcher for advanced logic/memory nodes.
- Primo Domingo™: High-selectivity etcher for 3D architectures like GAA and DRAM.
- Smart RF Match: An intelligent radio frequency matching device featuring proactive prediction capabilities.
- Preciomo Udx® MOCVD: Specialized equipment for mass-producing blue-green Micro LEDs.
Primo Angnova™ (Next-Generation ICP Plasma Etcher)
For Advanced logic chips (5nm and below) and advanced memory chips with high aspect ratio requirements.- Center-Extraction Design Equipped with an industry-leading symmetrical airflow control valve to expand pressure control ranges.
- Advanced Plasma Source Integrates a second-generation LCC RF coil and a DC magnetic field auxiliary coil (MFTR) technology featuring four-segment pulse control for precise ion concentration and energy management. Notably uses ultra-low frequency RF plasma for high ion energy.
- Precision Temperature Control Utilizes the Durga III ESC electrostatic chuck with over 200 independently temperature-controlled zones, combined with a continuous Active Edge Impedance Adjustment (AEIT) design at the wafer edge for excellent on-chip uniformity.
- High Efficiency Configurable Primo C6V3 transfer platform supporting up to 6 main etching chambers and 2 LL Strip removal chambers.
- Solves challenges in accuracy, uniformity, and aspect ratio, enabling customers to increase capacity for sub-5nm nodes while reducing costs.
Primo Domingo™ (High-Selectivity Etcher)
Next-generation 3D semiconductor devices, including GAA (Gate-All-Around), 3D NAND, and 3D DRAM.- Optimized Structure fully symmetrical cavity design with an optimized flow field to ensure high uniformity and repeatability in wafer surface etching.
- Advanced Gas Management unique integrated gas holder design shortens injection distance for faster, precise pulse gas control; uses corrosion-resistant materials for handling reactive gases.
- The Dual-Stage Thermal Control features a dual-cooling/dual-heating wafer pedestal for wide-range precise temperature stability.
- With Flexible Integration Compatible with the mass-produced Primo C6V3 transfer system, allowing flexible combination of main and auxiliary annealing chambers.
- Fills domestic gaps in highly selective etching equipment, providing crucial assurance for manufacturing higher-performance, smaller-sized 3D devices.
3. Smart RF Match (Intelligent Radio Frequency Matching Device)
Semiconductor front-end processes (dielectric/Si/Metal etching), advanced packaging, MEMS, and compound semiconductors.- "Proactive Prediction" Logic that Moves beyond traditional "reactive response" by using EtherCAT networks for real-time RF status transmission between the power supply and matcher. The matcher acts as an active device issuing control commands simultaneously with adjustments.
- The Proprietary Algorithm utilizes independent IP-based intelligent control algorithms that automatically select frequency ranges and matching modes based on plasma conditions.
- Speed & Efficiency That achieves microsecond-level response; switching speeds are over 100 times faster than traditional matchers.
- In high-end logic testing, improved RF signal matching speed by 225% and overall etching efficiency by 15%, leading to higher throughput and more stable process consistency.
4. Preciomo Udx® MOCVD (Mass Production Equipment)
Mass production of blue-green Micro LEDs using high-performance gallium nitride wafers.- Horizontal Dual-Rotation Structure that breaks away from traditional vertical airflow designs; features a novel horizontal dual-rotation reaction chamber with simulated temperature/flow fields for superior uniformity.
- High Throughput, can process up to two chambers simultaneously, handling 18 × 6-inch or 12 × 8-inch wafers per run. Each chamber is independently controllable.
- To Meet Industry Standards Compliance is equipped with EFEM and SMIF systems for fully automated wafer-to-wafer transfer, reducing the number of required epitaxial layers.
- Boasts excellent wavelength uniformity, low defect density, and high output stability, meeting stringent requirements for Micro LED commercialization.
Naura Technology Group releases new generation 12-inch NMC612H inductively coupled plasma (ICP) etching equipment
Naura Technology Group has officially launched its latest breakthrough, the NMC612H, a high-end 12-inch Inductively Coupled Plasma (ICP) etching machine designed to meet the rigorous demands of advanced logic and memory chip manufacturing. Released in March 2026, this equipment addresses critical industry challenges including ultra-high aspect ratios, extreme uniformity requirements, and precise topography control needed for smaller chip nodes.
The NMC612H represents a significant leap forward by overcoming technical hurdles through proprietary innovations in bias control, RF pulse management, and electrostatic chuck (ESC) temperature regulation. A standout feature is its ability to achieve aspect ratios of several hundred-to-one while controlling etching uniformity down to the scale of a single silicon atom. Furthermore, it integrates an AI-driven recipe optimization platform, moving process debugging from reliance on human experience to automated, data-driven solutions.
This launch aligns with the surging global demand for computing power and memory chips, where ICP etching holds a dominant market share (approx. $10.3 billion in 2026). By embedding itself into major domestic fabrication plants across logic, memory, power, and sensing sectors—leveraging over 8,000 cumulative cavity installations—Naura solidifies its position as a leader defining the future of semiconductor manufacturing in the AI era.
The NMC612H is engineered to support the most advanced lithography and etching processes, specifically targeting Critical Dimensions (CD) at the single-atom level. Its core specifications include four major technological advantages and one integrated software innovation.
Precision Bias Control System
- Next-generation Pulsed DC Voltage (PDV).
- Controls ion incident energy and orientation with nanometer-level precision (electron volt scale) and a narrow energy distribution.
- Enables the etching of structures with extremely small linewidths and ultra-high aspect ratios, preventing defects in advanced nodes.
High-Precision Electrostatic Chuck (ESC)
- Mass-produced ESC featuring over 100 independently controlled temperature zones.
- Achieves a temperature uniformity control better than ±0.3°C across the wafer surface.
- Ensures perfect thermal stability during etching, which is critical for maintaining pattern fidelity and reducing defects in small openings. The system utilizes fully domestic supply chain components with independent intellectual property rights.
Advanced RF Multi-State Pulse Control
- Mass-produced algorithm for Multiple Layer Pulse (MLP) and fast matching.
- Reduces the plasma matching time from seconds to milliseconds. Supports multiple modes including synchronous/asynchronous pulses and three-frequency simultaneous starts.
- Allows precise formulation of single-step process recipes, enabling independent control over plasma composition and energy for complex etching tasks.
In-Situ Atomic Layer Deposition (ALD) Module (This Is Good Stuff)
- Integrated ALD capability within the etching chamber.
- Performs alternating deposition and etching cycles in a single run without wafer transfer between chambers.
- Breaks functional limitations of traditional equipment, expanding application scenarios for hybrid processes that require simultaneous deposition and removal of materials.
AI-Enabled Process Optimization Platform
- AI + Recipe Diagnosing Function (RDF).
- Utilizes a proprietary massive process database to analyze machine data and etching history. Replaces or augments traditional "expert-based" debugging with automated, AI-assisted diagnostics.
- Accelerates problem identification, ensures long-term operational stability, and significantly boosts manufacturing efficiency (OEE).
Performance
- Capable of etching structures with aspect ratios up to several hundred-to-one on a small opening platform.
- Patterning CD uniformity controlled within the range of one silicon atom diameter.
- Backed by Naura's 25+ years of experience, serving over 8,000 cavity installations and handling mass production rates exceeding 5 million 12-inch wafers monthly.
- Covers advanced logic, DRAM/Flash memory, power devices, and sensors for AI-driven computing applications.
Anhai Semiconductor have achieved high-yield mass production of ultra-high voltage silicon carbide chips.
Hefei Anhai Semiconductor Co., Ltd. announced that its 6.5kV/40mΩ and 10kV/130mΩ series silicon carbide (SiC) MOSFET chips have passed the experimental testing of the School of Electrical Engineering of Zhejiang University and the on-site witnessed testing of the High Frequency Field Control Power Devices and Equipment Product Quality Inspection Center of the Institute of Electrical Engineering, Chinese Academy of Sciences, and have been put into mass production. The yield of both products has exceeded 80%, marking that Chinese companies have reached the world's leading level in the field of ultra-high voltage silicon carbide.