According to a recent report by Nikkei Asia, citing data from the Japanese research firm Global Net, Chinese companies will historically occupy five spots in the 2025 ranking of the world's top 30 chip equipment manufacturers: Naura Technology Group jumped from eighth to fifth globally in 2022; AMEC and Shanghai Microelectronics successfully entered the top 20; and ACM Research and Huahai Technology entered the top 30. Data from the Japanese research firm Techno Systems Research shows that China's domestic manufacturing rate for semiconductor equipment has reached 20%-30%, more than doubling from 10% three years ago.
Huahai Qingke is a high-end semiconductor equipment manufacturer with core independent intellectual property rights. The company's main products include CMP equipment, thinning equipment, dicing equipment, wet processing equipment, ion implantation equipment, edge polishing equipment, wafer regeneration, key consumables, and maintenance services, creating a platform-based strategic layout of "equipment + services." The company's main products and services are widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon wafers, third-generation semiconductors, MEMS, and Micro LED. In 2024, the company achieved a 35.82% year-on-year increase in operating revenue to RMB 3.406 billion, a 41.40% year-on-year increase in net profit attributable to the parent company to RMB 1.023 billion, and a 40.79% year-on-year increase in net profit attributable to the parent company excluding non-recurring items to RMB 856 million.
The global CMP equipment market was once highly monopolized, with Applied Materials (USA) and Ebara (Japan) dominating the majority of the market share. Huahai Qingke, a domestic 12-inch CMP equipment manufacturer with independent intellectual property rights, has steadily increased its market share in the domestic CMP equipment field thanks to its technological and product strength. It has essentially covered all 12-inch advanced integrated circuit production lines in China, placing it in a leading position domestically.
Furthermore, Huahai Qingke's CMP equipment can synergize with the company's thinning equipment, dicing equipment, and edge polishing equipment, providing complete cutting, grinding, and polishing solutions for advanced packaging and chip stacking. The application scenarios for these products will continue to expand, further opening up market growth potential. Simultaneously, as the company's CMP equipment inventory continues to rise, the synergistic effects of its "equipment + service" platform strategy will be significantly released, and the volume of key consumables and maintenance services will also increase rapidly, contributing a sustained and stable profit growth point for the company.
In December 2025, Huahai Qingke issued an announcement stating that its chemical mechanical polishing (CMP) equipment had been shipped to a cumulative total of over 800 units, covering multiple main models and the latest models of the company, including Universal-H300 and Universal-S300. It not only fully covers mainstream product lines such as logic, 3D NAND memory, and DRAM memory, but has also successfully entered the supply chains of leading customers in the fields of large silicon wafers, third-generation semiconductors, CIS, MEMS, MicroLED, and advanced packaging, achieving full coverage and mass application of mainstream integrated circuit manufacturing production lines in China.
View attachment 170335
