Chinese semiconductor thread II

tokenanalyst

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HiMachines successfully develops 12-inch silicon carbide single crystal ingot​


Against the backdrop of the rapid development of the silicon carbide industry, Hymuchip has continued to promote technological innovation. Following the achievement of controlling the defect rate below a stable value in the 8-inch silicon carbide crystal growth process, it has recently made another major breakthrough - successfully developing a 12-inch diameter silicon carbide single crystal ingot , marking that the company has achieved full independent control over the 6, 8 and 12-inch full-size crystal growth technology chain.
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After achieving stable and controllable 8-inch crystal growth technology, Hymchip Microelectronics significantly reduced crystal growth costs by improving thermal field lifetime and reducing power consumption . Increasing substrate size is a key factor in driving industrial scaling and cost control. Simultaneously, the company rapidly focused on the research and development of larger-size crystal growth technologies, successfully overcoming the bottleneck of 12-inch growth technology through technological iterations in key areas such as thermal field design, voltage division, temperature control, and growth processes .

The growth of 12-inch silicon carbide crystals presents more complex thermal gradients and radial temperature fields within the crystal, and the increased stress severely restricts the fabrication of large-size, high-quality SiC single crystals. Haimu Microelectronics, relying on its independently developed resistive crystal growth equipment and continuously iterating process technology, has effectively ensured the stable growth of large-size crystals through innovative temperature field design and iterative control of crystal integrity. The ingots prepared this time exhibit excellent crystal quality and complete structure, fully demonstrating the company's dual breakthroughs in core technologies and processes.
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This technological breakthrough is a testament to Hymchip's continuous investment in the silicon carbide field, demonstrating the company's firm commitment to technological innovation and industrialization. Hymchip will address key challenges such as crystal growth and substrate processing, overcoming technological barriers to build core competitiveness through continuous technological innovation and drive the company's sustainable development.

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def333

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Hardwired-Neurons Language Processing Units as General-Purpose Cognitive Substrates​

1.State Key Lab of Processors, Institute of Computing Technology, CAS, China,
2.University of Chinese Academy of Sciences, China,
3.University of Science and Technology of China, China,
4. Institute of Software, CAS, China, and
5.Cambricon Technologies, China

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huemens

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Nvidia's statement regarding status of H200 sales to China. So far approved only from US side.

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Semiconductor company Nvidia Corp says it has secured a license from Washington to ship a small number of its less advanced H200 chips to customers in China. However, the United States firm has also stated that it is not including any China data-center revenue in its first-quarter sales outlook due to regulatory uncertainty.
During a post-earnings call on Thursday, Colette Kress, Nvidia's executive vice-president and chief financial officer, said that "while small amounts of H200 products for China-based customers were approved by the US government, we have yet to generate any revenue, and we do not know whether any imports will be allowed into China".
 

tokenanalyst

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Guangzhou adds two more semiconductor projects worth over 10 billion yuan each, focusing on the AI field.​

On February 25, Guangzhou held a citywide high-quality development conference, announcing a list of major signed projects via video. A total of 57 projects were signed, with a total investment of 130.5 billion yuan, covering 21 industrial fields including intelligent equipment and robotics, artificial intelligence, new energy and new energy storage, biomedicine and health, low-altitude economy and aviation, modern finance, cells and genes, intelligent connected and new energy vehicles, semiconductors and integrated circuits, androids, and shipbuilding and marine engineering.

According to Guangzhou Daily, among the 57 major signed projects, four are manufacturing projects with investments exceeding 10 billion yuan, demonstrating Guangzhou's determination and ambition to prioritize industry, establish the city on manufacturing, promote the integration of industry and industrialization and the transformation of industrialization and informatization, facilitate industrial transformation, solidify the foundation, optimize the structure, and strengthen the city as a national advanced manufacturing base.

Among them, the People's Government of Nansha District of Guangzhou, China Shipbuilding Huangpu Wenchong Shipbuilding Co., Ltd., and Guangzhou Shipyard International Co., Ltd. plan to invest in a series of projects of China Shipbuilding Group, with a total planned investment of 10 billion yuan, to consolidate the advantages of Guangzhou's shipbuilding and marine engineering industry; the Huangpu AI chip high-end integrated circuit substrate project and the Huangpu AI computing power high-end printed circuit board project have a total planned investment of 10 billion yuan each, which will be located in Huangpu District and drive the semiconductor and integrated circuit industry to a new level ; the Zengcheng high-end textile intelligent manufacturing industrial park project will further promote the transformation of the fashion consumer goods industry towards "digital intelligence".

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tokenanalyst

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China is moving to dominate the power electronics industry with multiple companies launching 12in SiC products. Now some are moving to 12in GaN products.

Suzhou Hanhua Semiconductor Launches 12-Inch Silicon-Based GaN Epitaxial Products​

Suzhou Hanhua Semiconductor Co., Ltd. officially announced on February 26, 2026, that it has successfully developed and released its 12-inch silicon-based gallium nitride (GaN) power epitaxial products. This milestone marks a significant advancement in China's third-generation semiconductor industry and was accompanied by a strategic cooperation agreement with a leading downstream power device manufacturer. The two parties will collaborate on developing next-generation semiconductor power devices and exploring their applications in robotics and high-end equipment sectors, working together to strengthen China's domestic power semiconductor supply chain.

The newly launched 12-inch wafer platform offers substantial improvements over traditional 6-inch or 8-inch production lines, significantly increasing output per unit area while effectively reducing manufacturing costs. Technically, the product achieves high breakdown voltage, low on-resistance, and high-speed switching characteristics, which reduce system energy loss and improve power supply efficiency. Through stress control, defect suppression, and interface engineering optimization, the material also demonstrates low defect density and excellent inter-wafer consistency, making it suitable for automotive and industrial applications requiring high stability.

These GaN epitaxial products target critical application areas including high-performance power supplies, motor drives, industrial control systems, and robotics. The technology is particularly well-suited for improving energy efficiency in industrial robot servo drives, mobile robot power management, and intelligent factory automation systems. By leveraging the compatibility advantages of the silicon-based platform with existing mature silicon processes, manufacturers can quickly deploy these materials on current production lines, accelerating the transition from research and development verification to mass production.

This strategic initiative aligns closely with China's national "15th Five-Year Plan" priorities emphasizing third-generation semiconductors, power electronics, and intelligent manufacturing development. Through material innovation and industrial collaboration, Suzhou Hanhua Semiconductor aims to build a complete ecosystem covering epitaxy, device design, manufacturing, packaging, testing, and system applications. This forward-looking layout will promote the deepening application of GaN power devices in high-end manufacturing while driving equipment toward miniaturization, lightweighting, and higher responsiveness ultimately supporting the upgrading of China's power semiconductor and intelligent manufacturing systems toward independent control and high-quality development.​

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gaussgun

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Geekerwan came out with a recent video alleging that Xiaomi, Vivo and IQOO have been sending out "Golden" chips for media reviews, which has been leading to differences between reviewer benchmarks and actual performance.
  1. Sending specially selected review units which contain "Golden" chips to reviewers. These chips are able to achieve higher gaming performance (6-8%) and lower power usage than the average retail unit, usually a watt lower (20%).
  2. Certain review models from Xiaomi force VRS (Variable Rate Shading) on out-of-box to boost gaming benchmarks with no option to turn it off.
  3. iPhones are one of the few models with no observable cheating. iPhone retail units in fact performed better than review units in gaming due to operating system updates.
Videos were uploaded to both Bilibili and Youtube, but the Bilibili version was then taken down for unknown reasons.
In response, Geekerwan made the video open-source and uploaded to Quark. However, the Bilibili post with the Quark version, the Quark links, and backups of the video by other users have all been deleted
Now Geekerwan's YT video has also been set to private.

This seems to be more than just one or 2 manufacturers applying pressure

Luckily, we still have backups from other users on YouTube

Backup video:

Bilibili users are currently pissed as hell and rightfully so.
 
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