Chinese semiconductor thread II
- Thread starter vincent
- Start date
Hubei 1.02 billion yuan high-purity quartz sand and silica powder project held groundbreaking ceremony
Recently, the groundbreaking ceremony of Enshi Zhongan Hengye New Materials Production Project of Yuselenium (Hubei) New Materials Technology Co., Ltd. was held in Baiyangping Industrial Park. Wang Yemin, Chairman of the CPPCC, attended the ceremony and announced the start of construction. It is understood that the project has a total investment of 1.02 billion yuan to build high-purity quartz sand and silica powder production lines, circulating water treatment systems and other ancillary facilities. The products are mainly used in glass manufacturing, optical fiber, semiconductor and other fields. The project will be implemented in three phases. The first phase covers an area of nearly 50 acres and will be completed and put into operation before October 30, 2024. It is expected to achieve a main business income of more than 100 million yuan.
I'm just going to post these comments from Novosense to show where China is in terms of chip supply from domestic EV industry. Rather than wasting time on wondering about where they are in terms of the fully supply chain based on tear downs of cars from 5 years ago. For the sake of not wasting people's time here, please read this
Novosense itself is on its way to product line that supplies 2000 RMB worth of chips and it specializes in all the power, analog, sensor and isolation chips that don't get the necessary focus.
According to Novosense, domestic chips have already did the 0 to 1, but performance & tech are still in the early stages. They can quickly ramp up to replace in a chip shortage, but are not good enough to fully replace foreign product in this still competitive stage
Light and matter co-confined multi-photon lithography
Abstract
Mask-free multi-photon lithography enables the fabrication of arbitrary nanostructures low cost and more accessible than conventional lithography. A major challenge for multi-photon lithography is to achieve ultra-high precision and desirable lateral resolution due to the inevitable optical diffraction barrier and proximity effect. Here, we show a strategy, light and matter co-confined multi-photon lithography, to overcome the issues via combining photo-inhibition and chemical quenchers. We deeply explore the quenching mechanism and photoinhibition mechanism for light and matter co-confined multiphoton lithography. Besides, mathematical modeling helps us better understand that the synergy of quencher and photo-inhibition can gain a narrowest distribution of free radicals. By using light and matter co-confined multiphoton lithography, we gain a 30 nm critical dimension and 100 nm lateral resolution, which further decreases the gap with conventional lithography
I talked about Sic Overcapacity in China at the moment which is leading to huge px difference between SiC substrate inside and outside of China
Microguide Nano: Signed a 520 million yuan sales contract for ALD passivation equipment and PE-Poly equipment
Microguide Nano announced that the company had recently signed an equipment sales contract with a leading photovoltaic company. According to the contract, the company plans to sell fully automatic ALD passivation equipment and PE-Poly equipment to the enterprise, with a total contract value of approximately 520 million yuan.
Microguide Nano pointed out that the signing of the contract marks that the company's equipment products have further been recognized by leading manufacturers in the field of photovoltaic cell production, effectively proving the technological advancement and market competitiveness of the company's equipment products, and will help improve the company's market influence. Make a positive impact.
It further stated that the company will recognize revenue in the corresponding accounting period in accordance with contract requirements and revenue recognition principles. The performance of the contract will help increase the company's production and sales scale, and there is still uncertainty about the impact on the company's profits.
Microguide Nano pointed out that the signing of the contract marks that the company's equipment products have further been recognized by leading manufacturers in the field of photovoltaic cell production, effectively proving the technological advancement and market competitiveness of the company's equipment products, and will help improve the company's market influence. Make a positive impact.
It further stated that the company will recognize revenue in the corresponding accounting period in accordance with contract requirements and revenue recognition principles. The performance of the contract will help increase the company's production and sales scale, and there is still uncertainty about the impact on the company's profits.
Probably better suited for the Chinese Sci & Tech thread, but anyway -
Another outfit has been set up in Wuhan (previous one in the above-quoted was in Guangdong) which utilises the more streamlined and cost-saving 'inkjet printing' systems for OLED fabrication, as opposed to the current 'vacuum deposition' technique which requires importation of foreign equipment.
Just a small note on the fact that 'inkjet OLED printing' itself isn't particularly an 'indigenous' approach as the same/similar process is also being explored . What's notable, of course, is that Chinese labs are now able to self-develop the necessary systems that can be put into commercial application (the company where lab is based has already accrued sales of 100M RMB to-date) hence cutting back on reliance from overseas while eventually being able to achieve much higher yields (>85% vs <15% currently) and lower costs on OLED panels industrially at the same time.
Xinyuan Micro (KingSemi): Plans to release front-end single-chip chemical cleaning machine and fully automatic SiC dicing and splitting machine
Xinyuan Micro announced that the company plans to release the new front-end single-chip chemical cleaning machine KSCM300 on March 19, 2024 at the completion ceremony of the company's Shanghai Lingang factory. From the 22nd to the 22nd, the new fully automatic SiC dicing and splitting machine KS-S200-2S1B was released during the SEMICON China 2024 Shanghai International Semiconductor Exhibition.
It is reported that this front-end single-chip chemical cleaning machine was independently developed by Xinyuan Micro's Shanghai Lingang subsidiary. It has multiple advantages such as high process coverage, high stability, high cleanliness, high productivity, and high intelligence, and is suitable for thin film applications. Various cleaning processes such as pre- and post-dry etching cleaning, post-ion implantation ashing cleaning, and post-CMP cleaning can meet customers' stringent requirements for stability indicators such as UP Time and etching consistency.
At the same time, the machine also fully draws on the company's mature technologies in the fields of front track and scrubber. By continuously optimizing the internal unit and overall machine design, it can effectively ensure a uniform and stable micro-environment inside the machine and compress the chamber space to the greatest extent. Launched The high-capacity architecture can help customers achieve significant improvements in cleaning efficiency. In addition, the machine will be equipped with a number of intelligent functions to achieve AI empowerment.
The fully automatic SiC dicing and splitting all-in-one machine was jointly developed by the Japanese subsidiary of Coresource Micro and its partners. It is mainly suitable for the cutting and splitting process of 6/8-inch SiC wafers. At the same time, the application scope can be expanded to other III-V compounds, Special materials such as ceramics and sapphire. This machine has the characteristics of compact design, flexible configuration, high productivity, dry cutting, flat section, and no incision loss. It is committed to providing downstream customers with more economical and efficient special material cutting solutions.
Domestic semiconductor CIM leader "Saimete" completed the C+ round of financing and officially launched the listing process
According to news on March 18, Saimet, the leading domestic semiconductor CIM company , announced that it has recently completed several hundred million yuan in C+ round financing.
It is understood that this round of financing was led by Chengdu Ceyuan Capital, and was followed by Yuntai Capital, Shenwan Hongyuan, Blue Ocean Fund, Industrial Bank and others. Financing funds will be mainly used for investment in production and research and talent reserve, and to accelerate overseas market expansion and promote domestic intelligent manufacturing software solutions to enter more factories around the world.
It is worth mentioning that in the context of the continued downturn in the capital market, the acquisition of hundreds of millions of yuan in financing once again demonstrates the technological advantages and huge value of Saimate in the field of domestic semiconductor CIM, and also reflects that investors are optimistic about the development of Saimate Prospects, continued to increase confidence.
After completing the C+ round of financing, Saimet has nearly 1 billion in cash. In addition, the company's main business income has increased year by year , it has continued to make profits, and its product market share has increased significantly. Saimet has officially launched the listing process and completed the listing guidance and filing process with the Shanghai Securities Regulatory Bureau.
Hexagonal all-round enterprise, overseas layout achieves leapfrog development
As the leader of domestic semiconductor CIM, Saimet has embarked on an unusual development path. With the primary principle of improving the product matrix and improving service capabilities, the company continues to recruit outstanding teams and polish the fully automated CIM solution for domestic semiconductors.
In 2023, Saimet integrated and launched the main software brand PlantU series (Plant to You to create smart factories for you). The products cover operation management, production management, quality management, scheduling planning, logistics automation, equipment automation, general tools, etc., CIM The solution matrix has been further improved and upgraded.
While achieving remarkable results in the domestic market, Saimet has also achieved leapfrog development in overseas markets. Its business covers Singapore, Malaysia, Japan, Southeast Asia and other countries and regions, and its products have been widely recognized.
Thanks to its forward-looking business development model, Saimet has developed into a "hexagonal" all-round enterprise, far ahead of the industry in terms of "products, technology, team, cases, profitability, and valuation". With its outstanding performance, Saimet has won the trust and favor of investors and has been continuously "increased".
The added value of China integrated circuit manufacturing industry increased by 21.6% from January to February.
On March 18, the State Council Information Office held a press conference on the performance of the national economy from January to February 2024. Liu Aihua, spokesperson, chief economist and director of the National Economic Comprehensive Statistics Department of the National Bureau of Statistics, believes that developing new productive forces is an intrinsic requirement and important focus to promote high-quality development, and is an inevitable choice to promote iterative upgrading of productivity and achieve modernization. It will also help promote the national economy to achieve a virtuous cycle and consolidate and enhance the positive economic recovery trend.
She introduced that in the first two months of this year, new momentum and new advantages continued to grow and new progress was made in all aspects. The first is the development of industries characterized by high technology, high efficiency and high quality. From January to February, the added value of the equipment manufacturing industry above designated size increased by 8.6% year-on-year, 1.6 percentage points higher than the average level of all industrial enterprises above designated size; the added value of high-tech manufacturing increased by 7.5%, of which the added value of the semiconductor device special equipment manufacturing industry increased by 41.2% %, integrated circuit manufacturing increased by 21.6%, and intelligent unmanned aerial vehicle manufacturing increased by 18.2% . From the perspective of product fields, intelligent and green products have grown rapidly. From January to February, the output of intelligent products such as service robots and 3D printing equipment increased by 22.2% and 49.5% year-on-year respectively. The output of new energy vehicle products increased by 25.6%, charging piles increased by 41.8%, ultra-white glass for solar industry increased by 89.8%, and the output of green and low-carbon products continued to grow rapidly. From the perspective of investment fields, investment in emerging industries has maintained rapid growth. From January to February, investment in high-tech industries increased by 9.4%, and investment in manufacturing technological transformation increased by double digits. From the perspective of new business formats, new business formats remain active. New consumption models such as live streaming and instant delivery are booming. From January to February, online retail sales of physical goods grew 9.8 percentage points faster than the same period last year.