Chinese semiconductor thread II

[tokenanalyst]

Breakthrough in diamond bonding process achieved! Chemical electrolytic wafer fabrication!​

Diamond, with its highest known thermal conductivity, is an ideal choice for heat dissipation substrates in wafer bonding of materials such as GaN and Si, significantly reducing thermal resistance and overcoming traditional heat dissipation bottlenecks. Surface roughness is crucial for bonding yield, with Ra < 1nm being a core technical indicator. Through technological breakthroughs, Huahe Semiconductor offers customized diamond solutions: single-crystal diamond with a surface roughness of Ra ≤ 0.5nm, and 1-2 inch polycrystalline diamond achieving Ra < 1nm, providing highly reliable material support and technical assurance for wafer bonding.​

Chemically synthesized diamond employs a three-in-one process of laser finishing, machining, and chemical mechanical polishing (CMP) to achieve efficient, low-damage, and high-precision processing of single-crystal diamond. It has achieved stable mass production of single-crystal diamond with a surface roughness Ra < 1 nm, and customized surface roughness Ra ≤ 0.5 nm. Simultaneously, it precisely controls the total thickness deviation (TTV) within 10 μm and strictly controls the wafer warpage index to match the stringent interface standards of advanced wafer bonding.​

Employing a unique polishing process, the surface roughness Ra of 1-2 inch polycrystalline diamond can be stably achieved at <1nm, with a minimum of 0.5nm; the surface roughness Ra of 3-4 inch polycrystalline diamond can be stably achieved at <2nm, and the warpage of 2-inch polycrystalline diamond can be optimally controlled within 10μm, matching the diamond requirements for large-size wafer bonding and providing solid and reliable material support for semiconductor applications.​

With materials breakthroughs at its core, Huahe Semiconductor focuses on the research and development of diamond materials for fourth-generation semiconductors, continuously tackling the technologies for preparing and processing high-quality, large-size diamonds. In the future, Huahe Semiconductor will always be customer-oriented, providing more targeted material support for technological breakthroughs in the semiconductor industry through process iteration and product innovation, accelerating technological leaps in key areas!​

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[Phead128]

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China's Zhejiang province is investing for 3nm-5nm node AI chip breakthroughs, which means if multi-7nm chips with high speed optical interconnects racks can rival or exceed 4nm chips racks, then imagine what 5nm chips in same configuration rack can do. I think 3nm may require EUV.

 

[tphuang]

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China's Zhejiang province is investing for 3nm-5nm node AI chip breakthroughs, which means if multi-7nm chips with high speed optical interconnects racks can rival or exceed 4nm chips racks, then imagine what 5nm chips in same configuration rack can do. I think 3nm may require EUV

all the data center now use high speed optical interconnects. In fact, almost all of the largest optical transceiver makers are Chinese. But they supply Google & Meta also.

the reason that Atlas-950/960 works is because Huawei uses an advanced OXC architecture in its all optical network.

 

[Michael90]

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They are not scared of getting put on the entity list???

That was hilarious. Thanks for the good laugh. I needed it today . lol

 

[tokenanalyst]

Nanochip and United Power jointly develop a new generation of automotive electric drive platform chip solutions​

Nanochip (Naxin Microelectronics) and Inovance Automotive (United Power) have jointly developed and launched a new generation of highly integrated automotive electric drive platform chip solutions, now in mass production. This collaboration marks a major step toward the miniaturization, high performance, and enhanced functional safety of electric vehicle (EV) power systems.

The solution features two custom-designed chips:​

1. Isolated Sampling Chip: Integrates a high-voltage LDO, isolated amplifier, and comparator into a single chip—reducing external components, enabling precise voltage monitoring, fast over/under-voltage protection, and compact design.​
2. Logic ASC Chip: Combines multiple logic functions and frequency detection capabilities, simplifying interface design, improving integration, cutting BOM costs, and supporting safer, more efficient system architecture.​

This shift from traditional discrete components to integrated "chip-based" designs brings significant benefits:
​

• Quality Leap: Fewer components mean lower failure rates and higher reliability.​
• Size Optimization: Reduced PCB footprint enables smaller, denser electronic controls with higher power density.​
• Faster Development: Standardized chips accelerate R&D, shorten time-to-market, and streamline design.​

Zheng Chao (R&D Director, United Power) emphasized that this partnership represents a strategic advancement—moving beyond just developing control products to co-defining core chip architectures. Ye Jian (Product Line Director, Nanochip) highlighted the deep technical synergy and affirmed Nanochip’s leadership in isolation and interface technologies.

With over 2 billion units shipped under its “Isolation+” ecosystem by October 2025, Nanochip offers a full suite of automotive-grade isolation and interface chips—including CAN, LIN, SerDes, logic ICs, and level shifters—supporting EV applications like inverters, OBCs, and BMS. The company has partnered with nearly 100 suppliers, reinforcing its role as a key enabler in next-generation EV electric drive systems.

This milestone underscores the industry’s move toward intelligent, integrated, and safe electric drivetrains, driven by close collaboration between chipmakers and EV component leaders.

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[tokenanalyst]

Gallium Core Semiconductor has been recognized as a high-tech enterprise, adding a new chapter to its innovation journey in the field of gallium oxide.​

Hangzhou Gallium Core Semiconductor Co., Ltd. has been officially certified as a High-Tech Enterprise by the Zhejiang Provincial Department of Economy and Information Technology, Finance, and the State Taxation Administration — a prestigious recognition of its cutting-edge innovation, R&D intensity, and commercialization success in ultra-wide bandgap semiconductors.

The company has emerged as a global leader in gallium oxide (Ga₂O₃) technology, a critical fourth-generation semiconductor material with superior properties for high-power, high-efficiency applications. Key achievements include:
​

• World’s First 8-inch Gallium Oxide Substrates via proprietary casting technology, enabling low-cost, scalable production and breaking foreign monopolies.​
• Advanced Vertical Bridgeman (VB) Method: Successfully grown 4-, 6-, and 8-inch single crystals with industry-leading uniformity; 8-inch crystals now reach 20mm constant diameter, and 6-inch (010) crystals exceed 40mm.​
• Full-Chain Capabilities: From crystal growth equipment (“SCIENCE Series”) to substrates and homoepitaxial layers — including novel (011) plane wafers — establishing a complete Ga₂O₃ ecosystem.​
• Intellectual Property Strength: 13 granted patents (China and abroad), 50+ pending, underscoring deep R&D moat.​
• Industry Recognition: Honored with “Top 10 Advances in China’s 3rd Gen Semiconductors 2025,” Zhejiang Provincial Sci-Tech Achievements, and Semiconductor Materials Industry Contribution Award (2024–2025).​

Its 8-inch substrates have been validated by top-tier third-party labs (Shenzhen Pinghu Lab, Malvern Panaco), confirming quality suitable for industrial deployment.

Gallium oxide enables next-gen applications in electric vehicles, high-voltage power grids, 5G infrastructure, and UV detection, supporting energy efficiency and China’s “dual carbon” goals. This certification accelerates Gallium Core’s path to industrial scale-up and global competitiveness, marking a pivotal milestone in China’s semiconductor self-reliance journey.​

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[tokenanalyst]

STORM 5000 mask defect inspection equipment passes commercial acceptance!​

VIP's new tool, STORM 5000, has successfully passed commercial acceptance testing!
Recently, VIP Semiconductor delivered a successful report card for the year, with its new generation STORM 5000 mask defect inspection equipment successfully passing commercial acceptance by a leading domestic customer! The next STORM 5000 device has completed pre-shipment testing and will be delivered to another key domestic customer by the end of this month.

STORM 5000 lives up to expectations

The STORM 5000 is VIP 's fourth-generation mask pattern defect inspection equipment. Building upon the technological accumulation and successful experience of the STORM 3000, and after nearly three years of iterative development, the STORM 5000 has further improved in optical imaging, algorithms, and computing power, meeting the needs of higher-level mask manufacturing processes. It supports PSM and binary mask inspection, is compatible with ArF and KrF technology nodes, and its key performance indicators meet expectations , making it a viable alternative to imported equipment.



STORM 3000 continues to be a top seller

VIP's previous generation of mature photomask defect inspection equipment, the STORM 3000, has consistently received repeat orders from major domestic and international manufacturers since its launch in 2022. To date, the STORM series has achieved nearly 70 sales orders, with major customers including domestic companies such as SMIC, DSI Microelectronics, AMEC, Luwei Optoelectronics, Luxin Semiconductor, Qingyi Optoelectronics, Longtu Photomask, and Ruijing Semiconductor, as well as leading international clients such as Photronics and Tekscend Photomask (part of Toppan Holdings). In 2025, the STORM 3000 product underwent continuous software algorithm upgrades, introducing the new SDB mode and combining it with the traditional DB, DD, and SL modes for flexible application, further enhancing the inspection capabilities of the STORM 3000 equipment. With its increasing market share, the STORM 3000's supporting services and delivery capabilities have also been further improved, shortening the time from equipment installation to trial operation to 15-20 days. The product's stability and performance indicators have been widely praised by customers.

The STORM 3000 has passed the rigorous testing of leading customers. Starting from Q4 2025, VIP began to deliver the equipment in batches to the overseas sites of leading customers, and has become an important partner among their testing equipment suppliers.

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[tphuang]

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Novosense has announced partnership with Inovance Automotive for deep cooperation on 2 highly integrated chip logic ASC chip for next generation electric drive platform.

Will be using more tightly integrated packaging.

As of October 2025, Novosense has accumulated 2B in isolated chip delivery.

 

[tphuang]

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Innoscience announces 4 type of new SolidGaN product using InnoGaN tech for smaller consumer electronics, high power industrial power source and auto grade usage.