Chinese semiconductor thread II

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VeriSilicon NPU IP VIP9000NanoOi-FS receives ISO 26262 ASIL B certification​


VeriSilicon’s neural network processor IP, VIP9000 NanoOi-FS, has achieved ISO 26262 ASIL B certification, a critical automotive functional safety standard, marking a significant milestone in AI chip reliability. The IP, part of VeriSilicon’s VIP9000 series, is designed for automotive and edge AI applications, offering high-performance neural network processing with low power consumption, compact design, and real-time capabilities for tasks like object detection, ADAS, robotics, and augmented reality. Certified by SGS-TÜV Saar, it features a streamlined architecture, hardware-accelerated inference, and programmable SIMD vision pipelines, ensuring deterministic latency to meet ASIL B safety requirements. Its support for large language models, CNNs, and multiple data types underscores its versatility for safety-critical AI applications.

The VIP9000 NanoOi-FS also provides hardware support for OpenVX, OpenCL, and other APIs, ensuring compatibility with a robust software stack and development tools. With over 200 million units shipped across 91 customers, the IP has proven its reliability and performance in global markets. VeriSilicon’s Chief Strategy Officer, Weijin Dai, emphasized the importance of functional safety in autonomous driving and edge AI, stating the certification reinforces the company’s commitment to delivering safe, compliant IP for critical applications. By expanding its functional safety portfolio, VeriSilicon aims to enable customers to deploy AI solutions confidently in safety-sensitive environments, driving innovation in autonomous systems and intelligent edge computing.

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Jingsheng end to end solution for square wafers for Silicon Interposers. Open the gates for cheaper wafer scale AI processors.​

Jingsheng Mechanical & Electrical Co., Ltd. releases end-to-end solution for square silicon wafers​


Jingsheng Mechanical & Electrical officially launched its full-process solution for square silicon wafers globally, leading the future of square silicon wafer technology with independent innovation . This solution provides a complete set of independently developed equipment, from crystal growth, squaring, squaring, grinding, slicing, chamfering to polishing, cleaning, and grinding , achieving a comprehensive layout from breakthroughs at specific points to innovation across the entire chain, providing a "Chinese solution" for the global evolution of square silicon wafer technology.
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As AI chips become larger and more complex, the area utilization and packaging efficiency of traditional circular wafers are gradually becoming limited. Therefore, a shift is underway towards " square replacing round , " replacing wafers with panels and arranging chips on rectangular substrates to achieve greater chip integration. Currently, the advanced packaging revolution from CoWoS to CoPoS has begun, which is expected to drive larger-scale end-user demand through the upgrading of supply-side products and greatly alleviate the current problem of insufficient advanced packaging capacity.

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Jingsheng Mechanical & Electrical has always adhered to the values of " pioneering innovation, achieving success for partners, and creating brilliance together . " Through its original core technologies, it has accumulated expertise and is working with global partners to define the future of semiconductor material manufacturing. All key equipment in the newly released square silicon wafer end-to-end solution was independently developed by Jingsheng Mechanical & Electrical . This not only strengthens the safety and controllability of equipment in the large silicon wafer industry chain but also enables optimal matching and synergy between various process stages. It provides customers with a more efficient and cost-effective one-stop solution, helping China's semiconductor industry chain achieve high-level self-reliance and strength.

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In the future, Jingsheng Mechanical & Electrical will uphold its mission of " building a leading enterprise in semiconductor materials and equipment and developing a green, intelligent, and high-tech manufacturing industry , " continuously innovate its own technologies, improve product quality and professional technical services, deeply understand customer needs, and work hand in hand with upstream and downstream partners in the industry chain to strive tirelessly to enhance the core competitiveness of the semiconductor industry.

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