@WTAN Sir the report that @Oldschool provide is from SEPT this year, so if we surmised the delivery of the machine it will be in the 1st quarter with trial production taking place in the 2nd quarter with July as the date of the actual mass production just as you, @foofy and @Oldschool had predicted. Sir of the 4 machine I think 2 of those are inside the SMIC Chengdu FABS ( for faster verification and comparison? ) and the other pair is inside the YMTC. Next year Huawei will get its DUVL machine maybe a pair as its Shanghai FAB is schedule for completion.SMIC is building many FABs across China usually in partnerships with Provincial Governments.
Local Governments provide funds and SMIC provides expertise.
This DUVL was probably one of the prototypes delivered to SMIC for testing and evaluation early this year.
3 other prototype units went to other customers
This SMIC 28nm FAB should be using all domestic equipment.
China Semiconductor Industry has already sucessfully developed a completely localised production line for 28nm.
The completely localised production line for 14nm should be ready in 2022.
"Approved license applications do not represent actual shipments and around half of all licenses are used, the Commerce Department said. It also said the items may not be provided in the authorized quantities."Key quote from the article:
Everything is getting de-americanised now. Number 1 is IC but other hitch tech industries are also.ripping out US-made/IP-owned componentsI hope they take notes and de-americanize their supply chains if they don't want their business to be controlled by US bureaucrats
Not bad at all for a SMEE newly released machine.
Resolution 38nm.
Produces 28nm Chips using a single exposure.
200 Wafers per Hour.
This is quite competitive with current ASML DUVL.
The DUVL will be gradually improved over time.
I believe Huawei and its Shanghai based technical partner got one unit as well.@WTAN Sir the report that @Oldschool provide is from SEPT this year, so if we surmised the delivery of the machine it will be in the 1st quarter with trial production taking place in the 2nd quarter with July as the date of the actual mass production just as you, @foofy and @Oldschool had predicted. Sir of the 4 machine I think 2 of those are inside the SMIC Chengdu FABS ( for faster verification and comparison? ) and the other pair is inside the YMTC. Next year Huawei will get its DUVL machine maybe a pair as its Shanghai FAB is schedule for completion.
Sir I based my opinion that both SMIC and YMTC had the expertise to evaluate and improve upon the performance of the machine (end user) with technical feedbacks to hasten its development, just like the partnership between TSMC and ASML or Samsung with ASML.
Believe it or not, the only way to save the Japanese Semiconductor Industry from irrelevance is to produce equipment without US IP and to ignore American sanctions on China.Japanese minister is saying that Japan should built capability that world cannot survive without Japan.
@Annihilation98 bro please re read the thread, but for you here is an article from 3 months ago for your perusal. It will used SMEE 28NM DUVL using double pattern technique and in the future 7nm by multiple pattern just like what TSMC did with their first generation 7nm DUVL, Hope this help.Any news on SMEE 28nm DUV that can produce 14nm?
I know, right? It's been like a week since you last asked (and people actually answered but you probably didn't read). What's the update??!! What have they been doing these few days, just sitting around no breakthroughs?? That's like 168 hours already; they should have had EUV ready yesterday, come on!! LOLAny news on SMEE 28nm DUV that can produce 14nm?