Would Taiwan be able to produce most of the equipment that it is supplied to make chips with?
Chinese semiconductor industry
- Thread starter Hendrik_2000
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Nikon and Canon all produce DUV, or at least at one time they produced them. The Japanese can certainly resume DUV production if they stopped. Tokyo Electron also produces equipment and substances necessary for chip making lithography.@Annihilation98 and @ansy1968
Apart from ASML and SMEE who else produces DUV lithography? any US companies or other EU companies?
The think is, it is not about how hard to make it, but there is/was no need for others to pour huge $ and resources to build one
But now China has waken up and will do it, thanks to Trump
Technically, I have no doubt that the big five plus Japan, perhaps SK can develop one, even EUV .. take time and big $ though
Hendrik_2000
Lieutenant General
Via vincent
Not sure if this have been posted before. A little old
CMP equipment for 200nm production line from CETC are being used by SMIC, Huahong, TSMC, UMC, etc.
1.2w
Source: Aijiwei
#电科设备#
#中电科#
07-09 11:43
According to the news from the micro-net, at the Beijing Yizhuang Innovation Conference held on July 8, CEC Electronic Equipment Group Co., Ltd. (hereinafter referred to as: Electrical Equipment) announced that the ion implanter, chemical mechanical polishing equipment (CMP), Technological breakthroughs such as wet process equipment.
Picture source: Beijing Yizhuang
The ion implanter is the key equipment in the pre-process of integrated circuit manufacturing, and the difficulty is second only to the photoetching machine. It causes changes in the surface composition, structure and performance of the material by doping the area near the surface of the semiconductor.
Li Jin, director of the electrical equipment strategic planning department, revealed that electrical equipment has realized the localization of the full spectrum of ion implanters, which can provide chip manufacturers with a one-stop solution for ion implanters.
According to Beijing Yizhuang News, China Electronics Technology Group also released domestically produced chemical mechanical polishing equipment. As one of the core equipment for integrated circuit manufacturing, chemical mechanical polishing equipment is an indispensable equipment for the copper interconnection process.
Among them, 200mm polishing equipment has entered domestic major lines such as SMIC, Huahong Hongli, TSMC, UMC, etc., and has been hailed as "the only domestic equipment supplier with a replacement rate of 100%" by SMIC.
In addition, according to Chinanews.com, Li Jin introduced that the 8-inch chemical mechanical polishing equipment for electrical equipment has a market share of 70%, and the 12-inch CMP has entered customer verification and has excellent performance. The electrical equipment wet process equipment has entered the field of 8-inch integrated circuit epitaxial wafer processing and chip manufacturing. (Proofreading/Ruobing)
Not sure if this have been posted before. A little old
CMP equipment for 200nm production line from CETC are being used by SMIC, Huahong, TSMC, UMC, etc.
CLP's 200mm polishing equipment has entered domestic major lines such as SMIC, Huahong Hongli, TSMC, UMC, etc.
1.2w
Source: Aijiwei
#电科设备#
#中电科#
07-09 11:43
According to the news from the micro-net, at the Beijing Yizhuang Innovation Conference held on July 8, CEC Electronic Equipment Group Co., Ltd. (hereinafter referred to as: Electrical Equipment) announced that the ion implanter, chemical mechanical polishing equipment (CMP), Technological breakthroughs such as wet process equipment.
Picture source: Beijing Yizhuang
The ion implanter is the key equipment in the pre-process of integrated circuit manufacturing, and the difficulty is second only to the photoetching machine. It causes changes in the surface composition, structure and performance of the material by doping the area near the surface of the semiconductor.
Li Jin, director of the electrical equipment strategic planning department, revealed that electrical equipment has realized the localization of the full spectrum of ion implanters, which can provide chip manufacturers with a one-stop solution for ion implanters.
According to Beijing Yizhuang News, China Electronics Technology Group also released domestically produced chemical mechanical polishing equipment. As one of the core equipment for integrated circuit manufacturing, chemical mechanical polishing equipment is an indispensable equipment for the copper interconnection process.
Among them, 200mm polishing equipment has entered domestic major lines such as SMIC, Huahong Hongli, TSMC, UMC, etc., and has been hailed as "the only domestic equipment supplier with a replacement rate of 100%" by SMIC.
In addition, according to Chinanews.com, Li Jin introduced that the 8-inch chemical mechanical polishing equipment for electrical equipment has a market share of 70%, and the 12-inch CMP has entered customer verification and has excellent performance. The electrical equipment wet process equipment has entered the field of 8-inch integrated circuit epitaxial wafer processing and chip manufacturing. (Proofreading/Ruobing)
Canon doesn't produce Arf DUV Lithography. Only Nikon, ASML and SMEE produce those, they compete with SMEE in the packaging arena.
antiterror13
Brigadier
Absolutely NOT
antiterror13
Brigadier
well, Nikon used to produce DUV, not anymore. So currently only ASML and SMEE do that
None of US, other EU or Japanese company make DUV .... currently
When did Nikon give up?
coolieno99
Junior Member
My argument is even simpler. Normally Intel is the leader in semiconductor chip production. But Intel fell behind TSMC advance chip production (being 1 or 2 node behind). What happened? Intel hired a bunch of Indian engineers to run their wafer fab operations. The Indian head of Intel wafer fab operations hired his own fellow Indian engineers. Even though Intel and TSMC were using basically identical wafer fab tools, the Indian engineers were unable to get the Intel wafer fab line to run right. And that's how Intel fell 1 year behind TSMC in the wafer fab race.
antiterror13
Brigadier
I think more like at least 3 yrs behind TSMC. TSMC already produced 7nm in 2018 while Intel so far hasn't managed it yet (2021)
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. One thing I noticed is that the image claims China has 14.8% of the world's 8mn wafer capacity (8" equiv., 3.55mn in 12" equiv.) on the 20-10nm nodes. This number has to be wrong, SMIC has only about 15k/month wafer capacity on 14nm (34k/month in 8" equiv.), and Shanghai Huali should only be in the early stages of 14nm production (close to 0k/month). That should make China's share of 20-10nm less than 1%.
Am I missing a huge amount of capacity somewhere else at a Chinese fab, or is this just a clear mistake from ICInsights?
Also, simplifying a takeover of Taiwan as China only wanting to gain advanced node technology seems to oversimplify the situation.
Am I missing a huge amount of capacity somewhere else at a Chinese fab, or is this just a clear mistake from ICInsights?
Also, simplifying a takeover of Taiwan as China only wanting to gain advanced node technology seems to oversimplify the situation.
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