Tsinghua launches its first 12-inch ultra-precision wafer thinning machine
Versatile-GP300 is a 12-inch wafer thinning and polishing machine newly developed by the company for 3D IC manufacturing. It integrates ultra-precision grinding, CMP and post-cleaning processes through a new machine layout, and is equipped with advanced thickness deviation and surface defect control. Technology, provides a variety of system function expansion options, has the advantages of high precision, high rigidity, and flexible process development. It can expand and develop a variety of configurations based on Versatile-GP300 to meet the needs of wafer thinning technology in 3D IC manufacturing, advanced packaging and other fields.
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CMP machinery is very important to developing any semiconductor device based on Cu interconnects (basically all logic devices with process nodes 10-130 nm node). It also doesn't change too much based on specific device. Overall a good achievement.