Chinese semiconductor industry
- Thread starter Hendrik_2000
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the above two statements seem contradictory.
Is SMIC approved for 14nm or No?
That can buy sometimes as smee won't ready for 14nm till near end of next year.
Chinese companies should stock up as much materials as possible
none of their policies really game changer so far! A bunch of failed semiconductor startups recently, people trying reel in government and private fundings.
I have proposed two policies that may change things. I think government should have policies focusing mostly on both ends of the spectrum because ends tend be neglected, Industrial players mostly focused on middle area. government shouldn't promoting redundant things as industrial players.
For leading edge stuff like EUV, provide ample funding and coalition. Forming of "CHina EUV Alliance" of government, academics and industrial players and speed up the research and construction of industrial grade equipments.
For legacy stuffs such as analog chips that China has a hole to fill in, reverse engineering by many universities as research projects can be utilized.
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Not key 14nm semiconductor equipment have been approved. Some key 14nm semiconductor equipment have not been approved yet.
then 14nm is a No go as it only takes 1 item to be a show stopper.
most likely wait till end of next year for domestic solution.
A lot of Chinese in the forefront of semiconductor microchip production:
Stephen Y. Chou invented NanoImprint Lithography (NIL). Chou is now a Professor Engineering at Princeton University, but he . The university is in Hebei, Anhui province. So Chou is probably a mainland Chinese.
Hu Chenming (from Taiwan) , used in all the most advanced semiconductor processes.
Burn J. Lin (from Taiwan), , which allows the printing of a feature smaller than the wavelength of the light source.
Alexander Chao (from Taiwan) invented SSMB (Steady-State MicroBunching).
My guess is, the US sees that China's domestic semiconductor equipment manufacturers are rising fast. Hoping to destroy impending Chinese competition, the Department of Commerce is giving SMIC some licenses for American gear. Too late, I think. SMIC now knows that the Americans can't be trusted, and the company will be replacing the American stuff with local gear as soon as practical.
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2019 IC product award
一、 技术创新奖
1、长江存储科技有限责任公司、中国科学院微电子研究所
64层三维存储器集成工艺及芯片设计技术
2、北京北方华创微电子装备有限公司
12英寸双脉冲刻蚀机NMC612D产品
3、上海贝岭股份有限公司
多通道高速高精度16位125兆ADC芯片（BLAD16Q125）
4、北京兆易创新科技股份有限公司
SPI NAND FLASH
5、华进半导体封装先导技术研发中心有限公司
以硅通孔为核心的三维系统集成技术及应用
6、上海兆芯集成电路有限公司
兆芯开先KX-6000系列处理器
7、北京紫光展锐科技有限公司
内置自研CPU处理器 LTE SOC（SC9850KH）芯片
8、沈阳拓荆科技有限公司
12英寸生产型PECVD设备（PF-300T）量产应用
9、深圳市中兴微电子技术有限公司
100G高集成网络处理器芯片
1. Technology Innovation Award 1. Yangtze River Storage Technology Co., Ltd., Institute of Microelectronics, Chinese Academy of Sciences 64-layer 3D memory integration process and chip design technology
2. Beijing North Huachuang Microelectronics Equipment Co., Ltd. 12 inch double pulse etching machine NMC612D product
3. Shanghai Belling Co., Ltd. Multi-channel high-speed and high-precision 16-bit 125M ADC chip (BLAD16Q125)
4. Beijing Zhaoyi Innovation Technology Co., Ltd. SPI NAND FLASH
5. Huajin Semiconductor Packaging Pilot Technology R&D Center Co., Ltd. Three-dimensional system integration technology and application with TSV as the core
6. Shanghai Zhaoxin Integrated Circuit Co., Ltd. Zhaoxin Kaixian KX-6000 series processors
7. Beijing Ziguang Zhanrui Technology Co., Ltd. Built-in self-developed CPU processor LTE SOC (SC9850KH) chip
8. Shenyang Tuojing Technology Co., Ltd. 12-inch production PECVD equipment (PF-300T) mass production application
9. Shenzhen Zhongxing Microelectronics Technology Co., Ltd. 100G highly integrated network processor chip
一、 技术创新奖
1、长江存储科技有限责任公司、中国科学院微电子研究所
64层三维存储器集成工艺及芯片设计技术
2、北京北方华创微电子装备有限公司
12英寸双脉冲刻蚀机NMC612D产品
3、上海贝岭股份有限公司
多通道高速高精度16位125兆ADC芯片（BLAD16Q125）
4、北京兆易创新科技股份有限公司
SPI NAND FLASH
5、华进半导体封装先导技术研发中心有限公司
以硅通孔为核心的三维系统集成技术及应用
6、上海兆芯集成电路有限公司
兆芯开先KX-6000系列处理器
7、北京紫光展锐科技有限公司
内置自研CPU处理器 LTE SOC（SC9850KH）芯片
8、沈阳拓荆科技有限公司
12英寸生产型PECVD设备（PF-300T）量产应用
9、深圳市中兴微电子技术有限公司
100G高集成网络处理器芯片
1. Technology Innovation Award 1. Yangtze River Storage Technology Co., Ltd., Institute of Microelectronics, Chinese Academy of Sciences 64-layer 3D memory integration process and chip design technology
2. Beijing North Huachuang Microelectronics Equipment Co., Ltd. 12 inch double pulse etching machine NMC612D product
3. Shanghai Belling Co., Ltd. Multi-channel high-speed and high-precision 16-bit 125M ADC chip (BLAD16Q125)
4. Beijing Zhaoyi Innovation Technology Co., Ltd. SPI NAND FLASH
5. Huajin Semiconductor Packaging Pilot Technology R&D Center Co., Ltd. Three-dimensional system integration technology and application with TSV as the core
6. Shanghai Zhaoxin Integrated Circuit Co., Ltd. Zhaoxin Kaixian KX-6000 series processors
7. Beijing Ziguang Zhanrui Technology Co., Ltd. Built-in self-developed CPU processor LTE SOC (SC9850KH) chip
8. Shenyang Tuojing Technology Co., Ltd. 12-inch production PECVD equipment (PF-300T) mass production application
9. Shenzhen Zhongxing Microelectronics Technology Co., Ltd. 100G highly integrated network processor chip
This is a repost of retweet but seems like US is indeed going by this roadmap
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