As long as China has equivalent indigenous technology I doubt US will sanction them.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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As long as China has equivalent indigenous technology I doubt US will sanction them.
Hendrik_2000
Lieutenant General
Via xyz like they say there is many way to skin a cat . a new emerging Litho technology and china is in it
What’s This Nano-Imprint Litho that Toshiba and SK hynix are Co-Developing?
--
Nanoimprint lithography startup
AMISNIL
*ttp://www.amisnano.com/
上海埃眸科技有限公司总部坐落于上海市杨浦区，毗邻五角场，背靠复旦大学微电子学院，是公司的研发中心。涵盖纳米压印光刻机设备开发、设计与集成，以及基于NIL设备的相关元器件的开发与设计。目前公司拥有三十多名研发人员，均是拥有本领域头部公司三年以上工作经验且本科以上学历的研究人员，其中来自国内Top.10和国际Top.100高校的博士占50%以上。同时，公司与复旦大学、南京大学、中国科学院等国内知名学府深度合作，拥有国内顶级的科研资源。
埃眸科技的生产中心坐落于江苏省苏州市常熟市高新区，占地5000平方米，由常熟市政府与埃眸科技公司共同建设开发，拥有整套生产、装配能力以及元器件的制备能力，为上海研发中心的设计产品以及合作方的需求提供全方位的生产保障。
Shanghai Aimo Technology Co., Ltd. is headquartered in Yangpu District, Shanghai, adjacent to Wujiaochang and backed by the School of Microelectronics of Fudan University. It is the company's R&D center. Covers the development, design and integration of nanoimprint lithography equipment, as well as the development and design of related components based on NIL equipment. At present, the company has more than 30 R&D personnel, all of whom have more than three years of work experience in leading companies in this field and have a bachelor degree or above. Among them, more than 50% are doctors from domestic Top.10 and international Top.100 universities. At the same time, the company has in-depth cooperation with well-known domestic institutions such as Fudan University, Nanjing University, and Chinese Academy of Sciences, and has top domestic scientific research resources.
The production center of Aimo Technology is located in the High-tech Zone, Changshu City, Suzhou City, Jiangsu Province. It covers an area of 5,000 square meters. It is jointly constructed and developed by the Changshu Municipal Government and Aimo Technology. It has a complete set of production, assembly and component preparation capabilities. The design products of the Shanghai R&D Center and the needs of partners provide a full range of production guarantees.
AM200全自动Roll to plate纳米压印设备
AM200纳米压印系统是用于批量量产的全自动化高产能、高精度的纳米压印的光刻设备。该设备从放片、压印、脱膜、取片均是全自动完成，它能实现全类型晶圆的稳定压印，同一片不同区域、同模板压印的不同片之间一致性优异。产品最低分辨率可达10nm。无论是批量制造和项目研发均适合。
性能介绍：
采用UV固化，固化速率快，最快单片固化时间低于5s,有利于提高产能；
采用UV固化，材料形变小（体积收缩率<5%）且稳定可控；
分辨率高，最低能实现 10 nm线条分辨率；
可在透明及非透明基底压印，基底最薄达80um
压印整体均匀性好
图形深宽比可达5:1
设备灵活度高，可支持4inch，6inch，8inch不同大小基底的压印
AM200 automatic Roll to plate nano imprinting equipment
The AM200 nanoimprint system is a fully automated, high-capacity, high-precision nanoimprint lithography equipment for mass production. The equipment is fully automatic from placing, imprinting, stripping, and taking out. It can realize stable imprinting of all types of wafers, and the consistency between different plates imprinted on the same template in different areas of the same piece is excellent. The minimum resolution of the product can reach 10nm. Both batch manufacturing and project research and development are suitable.
Performance introduction:
Using UV curing, the curing rate is fast, and the fastest single-chip curing time is less than 5s, which is beneficial to increase production capacity;
Using UV curing, the material deformation is small (volume shrinkage rate <5%) and stable and controllable;
High resolution, minimum 10 nm line resolution can be achieved;
Can be embossed on transparent and non-transparent substrates, the thinnest substrate is 80um
Good overall uniformity of imprinting
Graphic aspect ratio up to 5:1
The equipment is highly flexible and can support the imprinting of 4inch, 6inch and 8inch substrates of different sizes
What’s This Nano-Imprint Litho that Toshiba and SK hynix are Co-Developing?
--
Nanoimprint lithography startup
AMISNIL
*ttp://www.amisnano.com/
上海埃眸科技有限公司总部坐落于上海市杨浦区，毗邻五角场，背靠复旦大学微电子学院，是公司的研发中心。涵盖纳米压印光刻机设备开发、设计与集成，以及基于NIL设备的相关元器件的开发与设计。目前公司拥有三十多名研发人员，均是拥有本领域头部公司三年以上工作经验且本科以上学历的研究人员，其中来自国内Top.10和国际Top.100高校的博士占50%以上。同时，公司与复旦大学、南京大学、中国科学院等国内知名学府深度合作，拥有国内顶级的科研资源。
埃眸科技的生产中心坐落于江苏省苏州市常熟市高新区，占地5000平方米，由常熟市政府与埃眸科技公司共同建设开发，拥有整套生产、装配能力以及元器件的制备能力，为上海研发中心的设计产品以及合作方的需求提供全方位的生产保障。
Shanghai Aimo Technology Co., Ltd. is headquartered in Yangpu District, Shanghai, adjacent to Wujiaochang and backed by the School of Microelectronics of Fudan University. It is the company's R&D center. Covers the development, design and integration of nanoimprint lithography equipment, as well as the development and design of related components based on NIL equipment. At present, the company has more than 30 R&D personnel, all of whom have more than three years of work experience in leading companies in this field and have a bachelor degree or above. Among them, more than 50% are doctors from domestic Top.10 and international Top.100 universities. At the same time, the company has in-depth cooperation with well-known domestic institutions such as Fudan University, Nanjing University, and Chinese Academy of Sciences, and has top domestic scientific research resources.
The production center of Aimo Technology is located in the High-tech Zone, Changshu City, Suzhou City, Jiangsu Province. It covers an area of 5,000 square meters. It is jointly constructed and developed by the Changshu Municipal Government and Aimo Technology. It has a complete set of production, assembly and component preparation capabilities. The design products of the Shanghai R&D Center and the needs of partners provide a full range of production guarantees.
AM200全自动Roll to plate纳米压印设备
AM200纳米压印系统是用于批量量产的全自动化高产能、高精度的纳米压印的光刻设备。该设备从放片、压印、脱膜、取片均是全自动完成，它能实现全类型晶圆的稳定压印，同一片不同区域、同模板压印的不同片之间一致性优异。产品最低分辨率可达10nm。无论是批量制造和项目研发均适合。
性能介绍：
采用UV固化，固化速率快，最快单片固化时间低于5s,有利于提高产能；
采用UV固化，材料形变小（体积收缩率<5%）且稳定可控；
分辨率高，最低能实现 10 nm线条分辨率；
可在透明及非透明基底压印，基底最薄达80um
压印整体均匀性好
图形深宽比可达5:1
设备灵活度高，可支持4inch，6inch，8inch不同大小基底的压印
AM200 automatic Roll to plate nano imprinting equipment
The AM200 nanoimprint system is a fully automated, high-capacity, high-precision nanoimprint lithography equipment for mass production. The equipment is fully automatic from placing, imprinting, stripping, and taking out. It can realize stable imprinting of all types of wafers, and the consistency between different plates imprinted on the same template in different areas of the same piece is excellent. The minimum resolution of the product can reach 10nm. Both batch manufacturing and project research and development are suitable.
Performance introduction:
Using UV curing, the curing rate is fast, and the fastest single-chip curing time is less than 5s, which is beneficial to increase production capacity;
Using UV curing, the material deformation is small (volume shrinkage rate <5%) and stable and controllable;
High resolution, minimum 10 nm line resolution can be achieved;
Can be embossed on transparent and non-transparent substrates, the thinnest substrate is 80um
Good overall uniformity of imprinting
Graphic aspect ratio up to 5:1
The equipment is highly flexible and can support the imprinting of 4inch, 6inch and 8inch substrates of different sizes
Hendrik_2000
Lieutenant General
I am no semi expert but here is the primer on nano technology
Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market.
Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separate substrate is coated with a resist. Like a stamping process, the patterned template is pressed against the substrate, forming a pattern on the substrate at feature sizes down to 5nm and beyond.
Fig. 1: Nanoimprint process vs. traditional optical lithography. Source: Canon
is a cost-effective, single-exposure technique that doesn’t require expensive optics and multiple patterning. But the technology has some issues in terms of defectivity, overlay and throughput, preventing it from becoming a more mainstream lithographic technology. Today, NIL is mainly used for non-semiconductor applications.
It has been promised many times before, but nanoimprint may finally crack the mainstream semiconductor arena. Last year, Toshiba installed Canon’s latest NIL system in a fab in Japan. If all goes well, Toshiba plans to use Canon’s system to pattern some of the features for its devices, as well as next-generation memory types in the future. Production is slated for later this year. “We hope nanoimprint will be ready for production soon,” said Tatsuhiko Higashiki, senior fellow for the Process Technology Research & Development Center at Toshiba Memory. “It is making good progress. However, nanoimprint needs special processes.”
Nanoimprint always had potential, but it must overcome several challenges to get a bigger foothold in the overall lithography market. “We know it is still small compared to mainstream optical lithography,” said Martin Eibelhuber, deputy head of business development at EV Group, a supplier of NIL systems and other products. “However, the use cases for nanoimprinting are increasing rapidly and the CAGR is estimated to be greater than 20%. If new applications for NIL, mainly related to photonics and biotechnology, are accepted by the market, the overall NIL market might even grow to a billion dollars within the next 5 to 10 years.”
NGL shakeout
NIL was originally introduced in 1996, when Princeton Professor Stephen Chou invented the technology and coined the phrase “nanoimprint lithography.” Three years later, Chou founded Nanonex, a pioneer developer of NIL tools. “During the first five years of nanoimprint, most people thought nanoimprint was either impossible or useless, and there were very few people working on it,” Chou said. “The field of nanoimprint has advanced enormously, making significant impact on nanotechnologies and on a broad range of industries.”
In the early 2000s, EV Group, Molecular Imprints (MII), Nanonex, Obducat and other companies began to purse NIL.
Starting in the 2000s, NIL began to move into production, mainly for non-semiconductor applications as well as for some niche-oriented IC products. Over time, the NIL market split into two camps. MII pursued the mainstream lithography market, while others focused on non-semiconductor applications.
Then, with MII in mind, NIL in 2003 landed as a next-generation lithography (NGL) candidate on the old International Roadmap for Semiconductors (ITRS). At the time, 157nm optical lithography, extreme ultraviolet () lithography, electron projection lithography (EPL) and NIL were listed as NGLs. Later, direct self-assembly (DSA) and multi-beam e-beam landed on the ITRS roadmap.
Originally, MII’s NIL technology was slated for production at the 32nm logic node in 2009. MII’s goal was to compete against EUV lithography or give lithographers another NGL option.
That never happened. The company’s tools were promising in terms of resolution, but they were slow and prone to defects. Funding was (and still is) another issue. Generally, NIL technology had some backing, but it paled in comparison to the billions of dollars spent on EUV lithography.
Over time, several NGL candidates fell by the wayside. 157nm lithography was scrapped. EPL, a technology being developed by IBM and Nikon, was dropped.
DSA, EUV, NIL and multi-beam direct-write survived in the NGL shakeout. But as it turned out, the NGLs took longer to develop and were (and still are) delayed. And thanks to multiple patterning, optical lithography extended further than expected, pushing out the need for the NGLs.
Today, 193nm immersion lithography with multiple patterning remains the workhorse technology at advanced nodes. But it’s becoming more difficult to pattern certain features at 10nm/7nm and beyond.
For logic, the industry is banking on EUV lithography as a means to pattern the most difficult features in chips. EUV is moving closer to production at 7nm and/or 5nm, but there are still several challenges to insert the oft-delayed technology.
The other NGLs, DSA and multi-beam, are targeted for logic. Each lithographic technology will likely find a place at one time or another.
Is NIL ready?
Today, NIL remains viable and is once again divided into two camps—semiconductors and non-semiconductors. Over the years, EV Group, Nanonex and Suss have shown success in the non-semiconductor markets. For example, Nanonex says that it has installed nearly 100 tools in 11 countries since its inception.
And MII continues to pursue the semiconductor market but under a different name. In 2014, Japan’s Canon acquired MII, a move that gave the company some financial backing and technology. MII is now called Canon Nanotechnologies. At present, Canon is focusing its NIL efforts on flash memory with DRAM and other memory types in the future. NIL is ideal for memory, which has built-in redundancy and is more tolerant for defects.
Prior to the acquisition, MII shipped a nanoimprint tool to Toshiba, the biggest proponent of NIL. Originally, Toshiba planned to use MII’s tool for planar NAND flash.
Planar NAND is based on a floating gate transistor structure. Thanks to 193nm wavelength lithography and multiple patterning, vendors have scaled the NAND cell size from 120nm to the 1xnm node regime today, enabling 100 times more capacity.
At 1xnm, though, it is becoming difficult to scale the memory cell and floating gate in planar NAND. So, the technology is running out of steam at the 1xnm nodes.
Planar NAND remains a viable market. But given planar NAND is no longer shrinking, Toshiba decided not to change its lithographic process from immersion/multi-patterning to the NIL tool from Canon in the fab.
Instead, Toshiba now plans to use Canon’s NIL system for the follow-on to planar NAND—3D NAND. “The requirements in lithography for nonvolatile memory devices have been changing from higher resolution technology to a reduction of process cost,” Toshiba’s Higashiki said. “We are planning to apply NIL for 3D NAND at first. Then, we will apply NIL for the next memory such as storage-class memory.”
Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market.
Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separate substrate is coated with a resist. Like a stamping process, the patterned template is pressed against the substrate, forming a pattern on the substrate at feature sizes down to 5nm and beyond.
Fig. 1: Nanoimprint process vs. traditional optical lithography. Source: Canon
is a cost-effective, single-exposure technique that doesn’t require expensive optics and multiple patterning. But the technology has some issues in terms of defectivity, overlay and throughput, preventing it from becoming a more mainstream lithographic technology. Today, NIL is mainly used for non-semiconductor applications.
It has been promised many times before, but nanoimprint may finally crack the mainstream semiconductor arena. Last year, Toshiba installed Canon’s latest NIL system in a fab in Japan. If all goes well, Toshiba plans to use Canon’s system to pattern some of the features for its devices, as well as next-generation memory types in the future. Production is slated for later this year. “We hope nanoimprint will be ready for production soon,” said Tatsuhiko Higashiki, senior fellow for the Process Technology Research & Development Center at Toshiba Memory. “It is making good progress. However, nanoimprint needs special processes.”
Nanoimprint always had potential, but it must overcome several challenges to get a bigger foothold in the overall lithography market. “We know it is still small compared to mainstream optical lithography,” said Martin Eibelhuber, deputy head of business development at EV Group, a supplier of NIL systems and other products. “However, the use cases for nanoimprinting are increasing rapidly and the CAGR is estimated to be greater than 20%. If new applications for NIL, mainly related to photonics and biotechnology, are accepted by the market, the overall NIL market might even grow to a billion dollars within the next 5 to 10 years.”
NGL shakeout
NIL was originally introduced in 1996, when Princeton Professor Stephen Chou invented the technology and coined the phrase “nanoimprint lithography.” Three years later, Chou founded Nanonex, a pioneer developer of NIL tools. “During the first five years of nanoimprint, most people thought nanoimprint was either impossible or useless, and there were very few people working on it,” Chou said. “The field of nanoimprint has advanced enormously, making significant impact on nanotechnologies and on a broad range of industries.”
In the early 2000s, EV Group, Molecular Imprints (MII), Nanonex, Obducat and other companies began to purse NIL.
Starting in the 2000s, NIL began to move into production, mainly for non-semiconductor applications as well as for some niche-oriented IC products. Over time, the NIL market split into two camps. MII pursued the mainstream lithography market, while others focused on non-semiconductor applications.
Then, with MII in mind, NIL in 2003 landed as a next-generation lithography (NGL) candidate on the old International Roadmap for Semiconductors (ITRS). At the time, 157nm optical lithography, extreme ultraviolet () lithography, electron projection lithography (EPL) and NIL were listed as NGLs. Later, direct self-assembly (DSA) and multi-beam e-beam landed on the ITRS roadmap.
Originally, MII’s NIL technology was slated for production at the 32nm logic node in 2009. MII’s goal was to compete against EUV lithography or give lithographers another NGL option.
That never happened. The company’s tools were promising in terms of resolution, but they were slow and prone to defects. Funding was (and still is) another issue. Generally, NIL technology had some backing, but it paled in comparison to the billions of dollars spent on EUV lithography.
Over time, several NGL candidates fell by the wayside. 157nm lithography was scrapped. EPL, a technology being developed by IBM and Nikon, was dropped.
DSA, EUV, NIL and multi-beam direct-write survived in the NGL shakeout. But as it turned out, the NGLs took longer to develop and were (and still are) delayed. And thanks to multiple patterning, optical lithography extended further than expected, pushing out the need for the NGLs.
Today, 193nm immersion lithography with multiple patterning remains the workhorse technology at advanced nodes. But it’s becoming more difficult to pattern certain features at 10nm/7nm and beyond.
For logic, the industry is banking on EUV lithography as a means to pattern the most difficult features in chips. EUV is moving closer to production at 7nm and/or 5nm, but there are still several challenges to insert the oft-delayed technology.
The other NGLs, DSA and multi-beam, are targeted for logic. Each lithographic technology will likely find a place at one time or another.
Is NIL ready?
Today, NIL remains viable and is once again divided into two camps—semiconductors and non-semiconductors. Over the years, EV Group, Nanonex and Suss have shown success in the non-semiconductor markets. For example, Nanonex says that it has installed nearly 100 tools in 11 countries since its inception.
And MII continues to pursue the semiconductor market but under a different name. In 2014, Japan’s Canon acquired MII, a move that gave the company some financial backing and technology. MII is now called Canon Nanotechnologies. At present, Canon is focusing its NIL efforts on flash memory with DRAM and other memory types in the future. NIL is ideal for memory, which has built-in redundancy and is more tolerant for defects.
Prior to the acquisition, MII shipped a nanoimprint tool to Toshiba, the biggest proponent of NIL. Originally, Toshiba planned to use MII’s tool for planar NAND flash.
Planar NAND is based on a floating gate transistor structure. Thanks to 193nm wavelength lithography and multiple patterning, vendors have scaled the NAND cell size from 120nm to the 1xnm node regime today, enabling 100 times more capacity.
At 1xnm, though, it is becoming difficult to scale the memory cell and floating gate in planar NAND. So, the technology is running out of steam at the 1xnm nodes.
Planar NAND remains a viable market. But given planar NAND is no longer shrinking, Toshiba decided not to change its lithographic process from immersion/multi-patterning to the NIL tool from Canon in the fab.
Instead, Toshiba now plans to use Canon’s NIL system for the follow-on to planar NAND—3D NAND. “The requirements in lithography for nonvolatile memory devices have been changing from higher resolution technology to a reduction of process cost,” Toshiba’s Higashiki said. “We are planning to apply NIL for 3D NAND at first. Then, we will apply NIL for the next memory such as storage-class memory.”
Hendrik_2000
Lieutenant General
Can HUAWEI still survive? Japanese director took a close look inside HUAWEI's headquarter
Japanese director visit HUAWEI's headquarter in Shenzhen. Can HUAWEI still survive? What is the real HUAWEI like? The first episode of 《 Faces Of HUAWEI 》stream on our YouTube channel tomorrow!SHOW LESS
It's humiliating but SMIC had to bear it, eat bitterness my friend within the year hopefully a domestic solution will arrive.
from CnTechPost
SMIC has obtained supply licenses from some US equipment vendors and can resume supply of semiconductor equipment for mature processes such as 14nm and 28nm, according to .
SMIC has been trying to apply for some key equipment for the 14nm process, but it has not been approved.
US equipment suppliers have recently resumed the supply of components and field services to SMIC. After formally receiving a supply license from the US equipment vendor, SMIC will have a promising operational outlook, according to a report issued by Morgan Stanley.
After SMIC was placed on the US’s Entity List last year, suppliers of products or technologies subject to the US Export Control Regulations must first obtain an export license from the Department of Commerce of US before supplying to SMIC.
For products or technologies for 10nm and below (including EUV lithography), the Department of Commerce will adopt the Presumption of Denial policy for review; SMIC's provision of foundry services to some special customers may also be subject to certain restrictions.
From the available news, SMIC's sub-10nm process, especially the future 7nm and 5nm process, still has a long way to go.
After the company was included in the entity list, the company and its suppliers both actively apply for permits, said co-CEO Zhao Haijun during SMIC's Q4 2020 earnings call.
from CnTechPost
SMIC reportedly gets supply licenses from US suppliers
March 1, 2021SMIC has obtained supply licenses from some US equipment vendors and can resume supply of semiconductor equipment for mature processes such as 14nm and 28nm, according to .
SMIC has been trying to apply for some key equipment for the 14nm process, but it has not been approved.
US equipment suppliers have recently resumed the supply of components and field services to SMIC. After formally receiving a supply license from the US equipment vendor, SMIC will have a promising operational outlook, according to a report issued by Morgan Stanley.
After SMIC was placed on the US’s Entity List last year, suppliers of products or technologies subject to the US Export Control Regulations must first obtain an export license from the Department of Commerce of US before supplying to SMIC.
For products or technologies for 10nm and below (including EUV lithography), the Department of Commerce will adopt the Presumption of Denial policy for review; SMIC's provision of foundry services to some special customers may also be subject to certain restrictions.
From the available news, SMIC's sub-10nm process, especially the future 7nm and 5nm process, still has a long way to go.
After the company was included in the entity list, the company and its suppliers both actively apply for permits, said co-CEO Zhao Haijun during SMIC's Q4 2020 earnings call.
Yes,
Humiliation aside, why would US grant these licenses in the first place? Something doesnt feel right
Who knows, probably China made some comments and US suppliers wanted money and also theres the chip shortage
manqiangrexue
Brigadier
Actually you're looking at the very short term instead of the long term. In the long term, China can build everything itself. Nobody can innovate and develop like China. In the short term, it may cause difficulties (which will accelerate China's drive) but that's under the assumption that the US can even get these countries to line up for it. There is no such thing as allies, only temporarily allied interests. As the US stuffs its head into containing China to remain the world hegemon, other countries can see the big picture, which is that every time China is banned from something, they make it themselves, and foreigners lose market share. That's their market share that the US wants to throw under the bus doing the same experiment over and over again hoping for a different result.
I don't think you understand the meaning of the word, "focus." Huawei is focused on the telecoms tech it was always focused on. It's now also focused on developing its own chip line. However, it has looked into EV car manufacturing and apparently pig farming as well from a technological standpoint as side-gigs to expand the financial resources it needs to remain the world leader in 5G and 6G. If you see an opportunity to make money, take it.
We'd indeed have to imagine, because the more of them that are sanctioned, the larger the pool and alliance to create a Chinese chain of everything. If American sanctions can unite them for survival from the divided entities they are fighting for money, then that's a goal that even MIC2025 did not imagine. But even without this, Chinese progress on chip manufacturing at the current speed is likely enough for them all to eat free lunches should there come the need.
This is actually the most wildly optimistic outcome imaginable from an American standpoint. What's actually for sure is that in the long term, anything denied to China will be made by China.
To add to that, even "temporarily allied interests." is really just a measure of relative power. I doubt many "allies" would be allied with US were it not for US hard power and the implied military threat
The smaller players are siding with US now as its the safe bet, until China can show them there is an alternative they dont dare jump ship. If China masters semidconductor independence then that means the grip the West has on it is gone, and there is nothing China cannot do on her own, this gives the other proxy and smaller nations the assurance and confidence to jump ship
If you are a small nation and US just tech sanction China, with chips and other things, you are going to wait and make sure China can solve its chip issue first before considering them as viable option as alternative platform, after all no smaller nation can survive the attack US inflicted on China, and they would be imprudent to ally with China if China cannot stand on her own two feet and make her own chips
Once China solves her chip issue its game over for US/West either that or WWIII time
The smaller players are siding with US now as its the safe bet, until China can show them there is an alternative they dont dare jump ship. If China masters semidconductor independence then that means the grip the West has on it is gone, and there is nothing China cannot do on her own, this gives the other proxy and smaller nations the assurance and confidence to jump ship
If you are a small nation and US just tech sanction China, with chips and other things, you are going to wait and make sure China can solve its chip issue first before considering them as viable option as alternative platform, after all no smaller nation can survive the attack US inflicted on China, and they would be imprudent to ally with China if China cannot stand on her own two feet and make her own chips
Once China solves her chip issue its game over for US/West either that or WWIII time
No they will continue to be slaves to the US. Work in a US company earning $60,000 designing chips while the white man takes all the credit, even if they do jack shit.
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