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Chinese semiconductor industry
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it will be interesting to know how common is this sentiment among US semiconductor suppliers in China.
Adhering to the localization strategy, the proportion of US sources has fallen below 3%
Since October last year, the United States has introduced export restrictions on advanced semiconductor equipment to China, and Japan and the Netherlands have subsequently introduced corresponding restrictions. This not only makes it difficult for domestic chip manufacturers to obtain advanced semiconductor equipment, but also has an adverse impact on the business development of semiconductor equipment manufacturers in the United States, Japan and the Netherlands in China.
So, as a US semiconductor equipment manufacturer, how does Teradyne view this impact?
In this regard, Felix Huang believes: "The current restrictions are more on chips with advanced processes related to artificial intelligence and large computing power, while consumer chips and automotive chips currently have no signs of restrictions. I don't think these chips will be restricted in the future (there is zero guarantee). The current restrictions are also on the front-end advanced process manufacturing equipment (Still). Our Teradyne equipment is a back-end manufacturing equipment, so it has no impact. The biggest source of worry is still the doubts of customers. "
Felix Huang emphasized that since he started leading the team in 2019, more and more customers have eliminated some doubts (still the export controls wall has only got closer and closer). After all, customers still hope to have healthy competition in the testing field. From the perspective of Teradyne's business in China, automobiles are the most important direction, and there are currently not many worries about being restricted in this regard. "I hope everyone will not wear colored glasses and beat Teradyne to death with a stick just because it is an American company."
"Teradyne has been rooted in China for more than 20 years (this year is its 23rd anniversary), and most of our parts have already been made. Arrived non-U.S. supply.”
According to Xinzhixun, Teradyne has been continuously promoting localization since it entered the Chinese market 23 years ago. Not only has its domestic team reached more than 100 people, but the proportion of equipment sold domestically from the United States has also been less than 3 %. (Full product import or fabrication parts?)
Regarding whether there is anxiety about being "replaced by domestic products", Felix Huang said frankly that there will definitely be such concerns.
For example, Teradyne's SoC test platforms range from J750 to UltraFLEXplus, including the Power platform. Many of them are test platforms that are more than ten or twenty years old, or test platforms that have less complex chip testing requirements. Felix Huang believes that if the current iteration speed of domestic competitors is followed, in 3-5 years, these domestic test equipment should be able to enter a stage of competition with Teradyne. Of course, in most fields, Teradyne is still confident of continuing to expand, especially in the automotive field, which has very high requirements for stability and repeatability, and domestic testing equipment cannot currently meet this requirement.
Felix Huang told Xinzhixun: "A major domestic mobile phone chip manufacturer is stuck. The return of self-developed mobile phone chips this year is also inseparable from the support of our Ultra platform or the platforms of Japanese friends, because currently domestically produced mobile phone chips are used. Test equipment cannot test this type of chip. In the future, Teradyne will play a role in healthy competition in the Chinese market. In the mid-to-high-end field, in addition to machines from Japanese friends, our UltraFLEXplus and ETS-800 will still It is an optional solution, so our presence will keep the market in a state of healthy competition.”
Adhering to the localization strategy, the proportion of US sources has fallen below 3%
Since October last year, the United States has introduced export restrictions on advanced semiconductor equipment to China, and Japan and the Netherlands have subsequently introduced corresponding restrictions. This not only makes it difficult for domestic chip manufacturers to obtain advanced semiconductor equipment, but also has an adverse impact on the business development of semiconductor equipment manufacturers in the United States, Japan and the Netherlands in China.
So, as a US semiconductor equipment manufacturer, how does Teradyne view this impact?
In this regard, Felix Huang believes: "The current restrictions are more on chips with advanced processes related to artificial intelligence and large computing power, while consumer chips and automotive chips currently have no signs of restrictions. I don't think these chips will be restricted in the future (there is zero guarantee). The current restrictions are also on the front-end advanced process manufacturing equipment (Still). Our Teradyne equipment is a back-end manufacturing equipment, so it has no impact. The biggest source of worry is still the doubts of customers. "
Felix Huang emphasized that since he started leading the team in 2019, more and more customers have eliminated some doubts (still the export controls wall has only got closer and closer). After all, customers still hope to have healthy competition in the testing field. From the perspective of Teradyne's business in China, automobiles are the most important direction, and there are currently not many worries about being restricted in this regard. "I hope everyone will not wear colored glasses and beat Teradyne to death with a stick just because it is an American company."
"Teradyne has been rooted in China for more than 20 years (this year is its 23rd anniversary), and most of our parts have already been made. Arrived non-U.S. supply.”
According to Xinzhixun, Teradyne has been continuously promoting localization since it entered the Chinese market 23 years ago. Not only has its domestic team reached more than 100 people, but the proportion of equipment sold domestically from the United States has also been less than 3 %. (Full product import or fabrication parts?)
Regarding whether there is anxiety about being "replaced by domestic products", Felix Huang said frankly that there will definitely be such concerns.
For example, Teradyne's SoC test platforms range from J750 to UltraFLEXplus, including the Power platform. Many of them are test platforms that are more than ten or twenty years old, or test platforms that have less complex chip testing requirements. Felix Huang believes that if the current iteration speed of domestic competitors is followed, in 3-5 years, these domestic test equipment should be able to enter a stage of competition with Teradyne. Of course, in most fields, Teradyne is still confident of continuing to expand, especially in the automotive field, which has very high requirements for stability and repeatability, and domestic testing equipment cannot currently meet this requirement.
Felix Huang told Xinzhixun: "A major domestic mobile phone chip manufacturer is stuck. The return of self-developed mobile phone chips this year is also inseparable from the support of our Ultra platform or the platforms of Japanese friends, because currently domestically produced mobile phone chips are used. Test equipment cannot test this type of chip. In the future, Teradyne will play a role in healthy competition in the Chinese market. In the mid-to-high-end field, in addition to machines from Japanese friends, our UltraFLEXplus and ETS-800 will still It is an optional solution, so our presence will keep the market in a state of healthy competition.”
Just question with regards to wafer fabrication processes and equipment. China is decent to good at desposition, ion implantation, and etching, but is still lagging considerably in metrology and lithography, and the former has a huge bearing on the latter with regards to mass production, no?
They are doing pretty good in that area too, lot of advances, but is one of those areas that pretty complex and people usually don't know what they are looking for.but is still lagging considerably in metrology
2022 Metrology situation in China:
part1
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2022 Metrology situation in China:
part2
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It is surprisingly how difficult for Apple to make its own modem chip even after acquisition of intel lab for modem chip and multiple years of R&D and billions dollars of investment. Apple has again delayed the replacement of Qualcomm chips until 2025 or 2026.
It is surprisingly how difficult for Apple to make its own modem chip even after acquisition of intel lab for modem chip and multiple years of R&D and billions dollars of investment. Apple has again delayed the replacement of Qualcomm chips until 2025 or 2026.
Apple is not an innovative company like Huawei or byd. It is just good at marketing.
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Apple is not an innovative company like Huawei or byd. It is just good at marketing.
well, a bit harsh to Apple. Apple's M3 pro and A16 is the most sophisticated CPU for the start
Probably it is true that modem is not Apple strong point and I know that Huawei has managed to design the 5G modem .. but remember that Huawei has to do that while Apple doesn't have to do that .. just nice to have .... "necessity is the mother of invention"
But Software, O/S and Chip design, etc .. Apple is up there in the top
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No it isn't. Does Apple M3 Pro have HyperThreading? It doesn't. It has a single thread per core.
Yet the Kirin 9000S has two threads per core in the big cores.
Only thing about the Apple M3 Pro, is that since it uses TSMC 3nm process, it has higher transistor density. So they can just throw more cores on the die. That does not require particular skill.
The fact that Kirin 9000S is that competitive even when hobbled with a much worse process is quite indicative of good skill by HiSilicon's chip design team.
Apple managed to replace X86 on the Macs with ARM because they were using custom chips made on the latest TSMC process, versus Intel X86 processors made in laggard semiconductor processes, that Apple seldom upgraded with refresh Mac designs even. Also, Intel isn't particularly well known for being savvy in chip design, although they do produce good chip designs on occasion. Intel used to be known for advanced process design and high yield and good manufacture volume. But they started stumbling bad after EUV started being used. They had difficulty justifying the expensive acquisition of these machines and they delayed it as much as possible. AMD has typically had the better chip designers. At least when they are funded properly. Yet Apple doesn't use AMD X86 chips and never did.
Yet the Kirin 9000S has two threads per core in the big cores.
Only thing about the Apple M3 Pro, is that since it uses TSMC 3nm process, it has higher transistor density. So they can just throw more cores on the die. That does not require particular skill.
The fact that Kirin 9000S is that competitive even when hobbled with a much worse process is quite indicative of good skill by HiSilicon's chip design team.
Apple managed to replace X86 on the Macs with ARM because they were using custom chips made on the latest TSMC process, versus Intel X86 processors made in laggard semiconductor processes, that Apple seldom upgraded with refresh Mac designs even. Also, Intel isn't particularly well known for being savvy in chip design, although they do produce good chip designs on occasion. Intel used to be known for advanced process design and high yield and good manufacture volume. But they started stumbling bad after EUV started being used. They had difficulty justifying the expensive acquisition of these machines and they delayed it as much as possible. AMD has typically had the better chip designers. At least when they are funded properly. Yet Apple doesn't use AMD X86 chips and never did.
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