Chinese semiconductor industry
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Guangli Technology: Net profit is expected to increase by 10% to 30% year-on-year in the first three quarters, and orders continue to increase steadily.
Guangli Technology released a performance forecast, predicting that the company’s net profit attributable to shareholders in the first three quarters would be 70.5528 million yuan to 83.3806 million yuan, a year-on-year increase of 10% to 30%.
Guangli Technology said that in the first three quarters, despite the current weak recovery momentum of the semiconductor industry, it benefited from the company's semiconductor equipment performance comparable to world-class products, customers' high recognition of product cost-effectiveness, optimization of marketing and service support systems, customer response and on-site Due to improvements in service capabilities, etc., the domestic semiconductor dicing machine business has grown rapidly, with orders continuing to grow in the first three quarters, while overseas subsidiaries have maintained stable development.
In addition, after the equity sale of Changshu Yabang Marine Electrical Co., Ltd. (hereinafter referred to as "Changshu Yabang"), the original wholly-owned subsidiary of Guangli Technology, it will no longer be included in the consolidated statements since December 2022, but the Internet of Things safety production equipment business It has developed well, complementing Changshu Yabang's performance in the same period last year and maintaining stable growth.
Guangli Technology mainly develops, produces and sells precision processing equipment, high-performance and high-precision air spindles and other core components and consumables (blades, etc.) used in semiconductor device packaging and testing. The products are mainly used in the field of semiconductor back-end packaging and testing. The company's holding subsidiary ADT is the third largest manufacturer of semiconductor cutting and dicing equipment in the world, with customers all over the world. It has many years of industrial experience and extensive market brand awareness in the field of semiconductor back-end packaging equipment. The company has the rare ability in the industry to meet customer needs. Providing customized blades and fine-tuned engineering resources, technology accumulation and service capabilities, we can provide customers with customized overall cutting and scribing solutions. ADT Soft Knife is also in a leading position in the world and has high customer awareness.
Guangli Technology also disclosed that the company's current annual production capacity of overseas semiconductor dicing machines is more than 200 units, and the company's dicing machine expansion plan is mainly based on the domestic Zhengzhou Airport Zone production base. It is expected that domestic semiconductor cutting and dicing machines will reach an annual production capacity of 500 units by the end of 2023. After the domestic airport zone factory is put into operation, the production capacity of the high-tech zone factory will be stopped, and the factory will be upgraded and repurposed for other production purposes.
This article is highly misleading. The TSMC facility at Nanjing was designed from the outset to produce chips at 16 nm. The original plan by TSMC was to expand 16 nm capacity, but with the US sanctions they switched the plan to expand 28 nm capacity.
The fab allegedly can produce 20,000 wafers per month at 16 nm and another 20,000 wafers per month at 28 nm.
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List of projects going on in Nankai.
1. The Ministry of Science and Technology's key research and development project "Synchrotron radiation characterization technology and application for core devices of Sub-7nm advanced process node integrated circuits", 2022-2026.
3. Funding Committee’s major project "Structure and Activity Control of Unconventional Excited Dyes and Scientific Basis of Product Engineering", 2021-2024, 1 million, participating in the EUV photoresist project.
1. The Ministry of Science and Technology's key research and development project "Synchrotron radiation characterization technology and application for core devices of Sub-7nm advanced process node integrated circuits", 2022-2026.
3. Funding Committee’s major project "Structure and Activity Control of Unconventional Excited Dyes and Scientific Basis of Product Engineering", 2021-2024, 1 million, participating in the EUV photoresist project.
Challenges and opportunities of semiconductor analysis and testing equipment in IC process nodes below 3nm
Focusing on research and development is the only way to achieve independent control of my country's chips. Materials, processing techniques and equipment are the biggest bottlenecks, and corresponding testing and inspection equipment are necessary means to test the reliability of equipment performance and guidance to improve its performance. tool. Then he shared the relevant research and representative results of his team around key IC processes and equipment for process nodes below 3nm, including the development of 4D electricity and ultrafast cathode fluorescence systems, research on metal oxygen cluster EUV lithography materials, Research and develop desktop high-energy free electron lasers, self-developed atomic layer deposition/etching technology and equipment, integrated circuit surface analysis and surface treatment equipment development, etc.
How long would you guys say it's gonna take for China to build up a fully domestic 3/5nm supply chain? From what I've gathered, domestic equipment currently can cover the 28nm supply chain and some parts of the 14nm supply chain.
According to the prevailing opinion here, a Chinese EUV can enter production probably by 2026-27. Lets say this comes to fruition. But is it possible to develop the rest of 3/5nm supply chain within 3 to 4 years in order to actually produce those chips given that all other high end equipment will be blockaded by the west as well?
According to the prevailing opinion here, a Chinese EUV can enter production probably by 2026-27. Lets say this comes to fruition. But is it possible to develop the rest of 3/5nm supply chain within 3 to 4 years in order to actually produce those chips given that all other high end equipment will be blockaded by the west as well?
With the speed indigenization is occurring, I would expect so. The only significant roadblock/question mark is EUV. And even on that end, we are seeing hints of progress via patents and studies.
In Chip design SMIC aside from having mastered the production of 7nm using ASML DUVi may well on their way to mass produce their N+3 5nm Chip using NXT 2050i next year. Its a natural progression since Liang Mong Song of SMIC had stated in his aborted resignation letter that they had finish the development of both 5nm and 3nm tech and needed the necessary equipment to produced it.
You're right, the Chinese is doing a two prong approach by using ASML for advance process with parallel domestic equipment on mature nodes. As SMIC graduated from 7nm to 5nm to 3nm (2026), the domestic option will be available for the 7nm next year and 5nm in 2025, a 2 year window until an viable Chinese EUVi appear. As we learned from this forum SMEE originally bench mark their SSA 800 to NXT 1980i, with verification, testing and improvement the final product is able to match the performance of NXT 2000i. In 2 years time with collaboration with major domestic FAB we may see an improve unit SSA900 that is comparable to NXT 2050i.
So the SMEE and ASML DUVi will do the heavy lifting until 2026 and its safe to say by that year, the Chinese (Beijing and Taipei) will be able to produce both 3nm and 2nm chip.
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You know what brother ansy1968, Huawei might really do own its own fab.
In this very thread, there was discussion on how Huawei was collaborating with others to build their own fab. Then that story went dark. Rarely was a word spoken about it for over a 1½ year.
Huawei is one of the biggest companies in China. It's revenue is kind of like 10x to 15x times of SMIC.
Suppose SMIC builds a fab, or someone builds a fab, then Huawei with the encouragement of the government, licenses that fab with exclusive rights to only produce Huawei chips. Essentially a vertical integration for Huawei, like a mini-takeover of a single fab, built by someone else.
Then, of course, Huawei denies everything. That company will still not confirm that the Mate 60 Pro is a 5G phone with a 7nm chip.
Nothing to see here folks, keep moving along!
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