Chinese semiconductor industry
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Let see what happens. Looks like things are only going to get more stupid and Chinese companies in general need to be prepare.
Nonchemically Amplified Molecular Resists Based on Sulfonium-Functionalized Sulfone Derivatives for Sub-13 nm Nanolithography
Abstract
In this study, a series of molecular resists based on a bis(4-butoxyphenyl) sulfone core attached to a varying number of radiation-sensitive triphenylsulfonium units (BPSSn, where n = 2, 3, and 4) were designed and synthesized. We evaluated the physical properties of these resists, including solubility, film-forming ability, and thermal stability, to assess their viability as photoresist materials. The materials allowed for negative patterning through organic development in both e-beam and extreme ultraviolet (EUV) lithography. Through manipulating the average number of triphenylsulfonium units in the molecule and optimizing the developing agents, BPSS4 resists demonstrated high resolution (16/13 nm) and low line edge roughness (2.5/2.5 nm) in e-beam and EUV dense line patterning, respectively. We further explored the EUV and e-beam exposure mechanisms of BPSS4 resist using X-ray photoelectron spectroscopy. We also investigated the outgassing behavior of the film during EUV irradiation via in situ mass spectroscopy. Remarkably, this nonchemically amplified resist exhibited high etch resistance and accurate pattern transfer capabilities. The etch durability of BPSS4 (under SF6/O2 plasma chemistry) with respect to the Si wafer was 21:1, highlighting its significant potential for practical applications in high-resolution lithography.
The total investment is 21 billion yuan! Jinghe integrated 12-inch wafer manufacturing project starts
According to Xinhua News Agency, on October 7, Anhui Province held a mobilization meeting to start the fourth batch of major projects in the province in 2023. A total of 1,089 projects have been mobilized this time, with a total investment of 707.46 billion yuan.
Among them, there are 670 manufacturing projects with a total investment of 415.28 billion yuan. There are 22 newly started manufacturing projects worth more than 5 billion yuan, including the Hefei Jinghe Integrated Circuit 12-inch wafer manufacturing project with a total investment of 21 billion yuan.
It is understood that Jinghe Integration is located in the Hefei Xinzhan Comprehensive Bonded Zone and is mainly engaged in 12-inch wafer foundry business. It is the first 12-inch wafer foundry company in Anhui and the first tens of billions-level integrated circuit project in Hefei. In May this year, the Shanghai Stock Exchange officially accepted the IPO application of Hefei Jinghe Integrated Circuit Co., Ltd. for the Science and Technology Innovation Board.
The prospectus disclosed at the time showed that Jinghe Integration planned to raise 12 billion yuan to invest in the second 12-inch wafer manufacturing plant project.
It is reported that the total investment in the project is approximately 16.5 billion yuan. It will use the main body of the 12-inch integrated circuit chip manufacturing plant II built in the first plant construction project to build a 12-inch wafer foundry production line with a production capacity of 40,000 pieces/month. , the main products include power management chips (PMIC), display driver integrated chips (DDIC), and CMOS image sensor chips (CIS). In addition, a micro-production line will be built for OLED display driver and logic process technology development and trial production.
saw that here also
I'm a little surprised they need 16.5B capex for just 40k wpm of production. I guess they will have a fair amount of immersive capacity here. Maybe more 40/55nm than 90nm from them.
What's the status of gate all around transistors in China? Can they be made with DUVi or do they need EUV?
That is 16.5 billion Yuan. Which is like 2.26 billion USD. That is a normal price for a non-immersion DUV fab with 40k wpm.
both SMIC Tianjin and Jingcheng are $7.5B for 100k wpm equivalent to $3B for 40k wpm. And they are supposedly mostly for 55 to 28nm nodes
I'd think the capex difference between immersion and non-immersion is more than 30%
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