Chinese semiconductor industry

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Oldschool

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Among the wave of collapsed domestic startup fabs such as hsmc, jinhua..etc a new hope is born sienidm.

[Headed by SMIC original founder Richard Chang, starts a new model, cidm. Communal IDM model, meaning it's both a foundry but also a standard product producer.

The 8 inch BJT fab will make analog chips and the 12 inch cmos 45nm to 28nm fab will make both digital and RF chip.
Also it has a photomask shop .

爛尾潮曙光 芯恩共享晶圓廠投產
2021-01-08 02:15 記者林宸誼/綜合報導
中國半導體爛尾潮中也有完工的案例。在山東青島市政府大力支持下,前中芯國際創辦人張汝京所創辦的青島芯恩積體電路有了新進展,投資額81億元人民幣(約12.6億美元),包括廠房和研發設計中心等一期項目已投入使用。

青島財經網報導,芯恩專案8吋、12吋、動力廠房和研發、設計、辦公樓六棟建築,已經全部完工,該項目是由張汝京領
銜,是中國首個CIDM(Commune Integrated Device Manufacturer,共享晶圓廠)專案。並已遞交基礎專利申請248項,取得台灣及美國申請號22項,獲中國國家專利授權76項,搬入設備139台。

根據芯恩官網資料,該專案總投資約218億元人民幣(約34億美元),其中一期總投資約81億元人民幣(約12.6億美元),新建8吋高階功率及數模混合晶片產品生產線一條、12吋40到28奈米超低功耗邏輯與嵌入式以及RF-SOI先進晶片產品生產線一條、180到14奈光掩膜板生產線一條,約50家的晶片設計合作夥伴加盟CIDM合作圈。

中國產業經濟信息網報導,成立於2018年4月18日的青島芯恩,由張汝京創辦,但融資發展並不順利,起初由青島國資委旗下澳柯瑪集團的子公司澳柯瑪創新,和張汝京團隊的寧波芯恩半導體共同出資設立,分別認繳出資額7.5億元、5億元人民幣(約1.1億美元、0.7億美元)。

2019年上半年,青島西海岸區設立的基金出資入股,隨後上海興橙資本新設立的青島興橙集電也入主,成為青島芯恩新進的大股東,然而同年11月,青島興橙集電退出,改由青島國資委旗下澳柯瑪集團的子公司青島澳柯瑪雲聯,認繳出資28.55億元人民幣(約4.45億美元)入股,持股比率達57.10%,也就是說,青島市政府是最大股東。

集微網、齊魯晚報報導,其實山東早已出現,或存在多條12吋積體電路產線,最早在2002年就簽下華慧2億美元晶圓廠的項目,然而後期卻頻發爛尾潮,因此2019年4月青島市國資委等五部門印發實施「市屬企業加快布局『新基建』。」
The dawn of the unfinished tide, Xinen Shared fab puts into production 2021-01-08 02:15 Reporter Lin Chenyi / Comprehensive report There are also completed cases in the unfinished tide of Chinese semiconductors. With the strong support of the Qingdao Municipal Government, Shandong, the former SMIC founder Zhang Rujing has made new progress in Qingdao Xinen Integrated Circuits, with an investment of 8.1 billion yuan (approximately US$1.26 billion), including factories and R&D and design centers. The first phase of the project has been put into use. Qingdao Finance Network reported that the core project of 8 inches, 12 inches, power plant and six buildings of R&D, design, and office have been completed. The project was led by Zhang Rujing. It is China’s first CIDM (Commune Integrated Device Manufacturer, Shared Fab) project. It has submitted 248 basic patent applications, obtained 22 Taiwan and U.S. application numbers, obtained 76 national patent authorizations from China, and moved in 139 equipment.

According to the information on Xinen's official website, the total investment of the project is about 21.8 billion yuan (about 3.4 billion US dollars), of which the total investment of the first phase is about 8.1 billion yuan (about 1.26 billion US dollars) to build a new 8-inch high-end power and digital-analog hybrid chip product One production line, one 12-inch 40 to 28 nanometer ultra-low power logic and embedded and RF-SOI advanced chip production line, one 180 to 14 nanometer photomask production line, about 50 chip design partners joined CIDM for cooperation ring. China Industrial Economic Information Network reported that Qingdao Xinen, which was established on April 18, 2018, was founded by Zhang Rujing, but the financing development was not smooth. Initially, Aucma Innovation, a subsidiary of Aucma Group under Qingdao SASAC, and Ningbo Zhang Rujing’s team Xin En Semiconductor was jointly funded and established, respectively subscribed for capital contributions of 750 million yuan and 500 million yuan (approximately US$110 million and US$70 million). In the first half of 2019, the fund established in Qingdao West Coast District invested in shares, and then the newly established Qingdao Xingcheng Group of Shanghai Xingcheng Capital also became the main shareholder of Qingdao Xinen’s new major shareholder. However, in November of the same year, Qingdao Xingcheng Group Withdrew, it was replaced by Qingdao Aucma Cloud Alliance, a subsidiary of Aucma Group under the Qingdao State-owned Assets Supervision and Administration Commission, and subscribed to invest 2.855 billion yuan (approximately US$445 million) into shares, with a shareholding ratio of 57.10%, which means that the Qingdao Municipal Government is the largest shareholder .
 

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Oldschool

Junior Member
Registered Member
Among the wave of collapsed domestic startup fabs such as hsmc, jinhua..etc a new hope is born sienidm.

[Headed by SMIC original founder Richard Chang, starts a new model, cidm. Communal IDM model, meaning it's both a foundry but also a standard product producer.

The 8 inch BJT fab will make analog chips and the 12 inch cmos 45nm to 28nm fab will make both digital and RF chip.
Also it has a photomask shop .

爛尾潮曙光 芯恩共享晶圓廠投產
2021-01-08 02:15 記者林宸誼/綜合報導
中國半導體爛尾潮中也有完工的案例。在山東青島市政府大力支持下,前中芯國際創辦人張汝京所創辦的青島芯恩積體電路有了新進展,投資額81億元人民幣(約12.6億美元),包括廠房和研發設計中心等一期項目已投入使用。

青島財經網報導,芯恩專案8吋、12吋、動力廠房和研發、設計、辦公樓六棟建築,已經全部完工,該項目是由張汝京領
銜,是中國首個CIDM(Commune Integrated Device Manufacturer,共享晶圓廠)專案。並已遞交基礎專利申請248項,取得台灣及美國申請號22項,獲中國國家專利授權76項,搬入設備139台。

根據芯恩官網資料,該專案總投資約218億元人民幣(約34億美元),其中一期總投資約81億元人民幣(約12.6億美元),新建8吋高階功率及數模混合晶片產品生產線一條、12吋40到28奈米超低功耗邏輯與嵌入式以及RF-SOI先進晶片產品生產線一條、180到14奈光掩膜板生產線一條,約50家的晶片設計合作夥伴加盟CIDM合作圈。

中國產業經濟信息網報導,成立於2018年4月18日的青島芯恩,由張汝京創辦,但融資發展並不順利,起初由青島國資委旗下澳柯瑪集團的子公司澳柯瑪創新,和張汝京團隊的寧波芯恩半導體共同出資設立,分別認繳出資額7.5億元、5億元人民幣(約1.1億美元、0.7億美元)。

2019年上半年,青島西海岸區設立的基金出資入股,隨後上海興橙資本新設立的青島興橙集電也入主,成為青島芯恩新進的大股東,然而同年11月,青島興橙集電退出,改由青島國資委旗下澳柯瑪集團的子公司青島澳柯瑪雲聯,認繳出資28.55億元人民幣(約4.45億美元)入股,持股比率達57.10%,也就是說,青島市政府是最大股東。

集微網、齊魯晚報報導,其實山東早已出現,或存在多條12吋積體電路產線,最早在2002年就簽下華慧2億美元晶圓廠的項目,然而後期卻頻發爛尾潮,因此2019年4月青島市國資委等五部門印發實施「市屬企業加快布局『新基建』。」
The dawn of the unfinished tide, Xinen Shared fab puts into production 2021-01-08 02:15 Reporter Lin Chenyi / Comprehensive report There are also completed cases in the unfinished tide of Chinese semiconductors. With the strong support of the Qingdao Municipal Government, Shandong, the former SMIC founder Zhang Rujing has made new progress in Qingdao Xinen Integrated Circuits, with an investment of 8.1 billion yuan (approximately US$1.26 billion), including factories and R&D and design centers. The first phase of the project has been put into use. Qingdao Finance Network reported that the core project of 8 inches, 12 inches, power plant and six buildings of R&D, design, and office have been completed. The project was led by Zhang Rujing. It is China’s first CIDM (Commune Integrated Device Manufacturer, Shared Fab) project. It has submitted 248 basic patent applications, obtained 22 Taiwan and U.S. application numbers, obtained 76 national patent authorizations from China, and moved in 139 equipment.

According to the information on Xinen's official website, the total investment of the project is about 21.8 billion yuan (about 3.4 billion US dollars), of which the total investment of the first phase is about 8.1 billion yuan (about 1.26 billion US dollars) to build a new 8-inch high-end power and digital-analog hybrid chip product One production line, one 12-inch 40 to 28 nanometer ultra-low power logic and embedded and RF-SOI advanced chip production line, one 180 to 14 nanometer photomask production line, about 50 chip design partners joined CIDM for cooperation ring. China Industrial Economic Information Network reported that Qingdao Xinen, which was established on April 18, 2018, was founded by Zhang Rujing, but the financing development was not smooth. Initially, Aucma Innovation, a subsidiary of Aucma Group under Qingdao SASAC, and Ningbo Zhang Rujing’s team Xin En Semiconductor was jointly funded and established, respectively subscribed for capital contributions of 750 million yuan and 500 million yuan (approximately US$110 million and US$70 million). In the first half of 2019, the fund established in Qingdao West Coast District invested in shares, and then the newly established Qingdao Xingcheng Group of Shanghai Xingcheng Capital also became the main shareholder of Qingdao Xinen’s new major shareholder. However, in November of the same year, Qingdao Xingcheng Group Withdrew, it was replaced by Qingdao Aucma Cloud Alliance, a subsidiary of Aucma Group under the Qingdao State-owned Assets Supervision and Administration Commission, and subscribed to invest 2.855 billion yuan (approximately US$445 million) into shares, with a shareholding ratio of 57.10%, which means that the Qingdao Municipal Government is the largest shareholder .
Unlike SMIC , Sienidm will have alot of its own products in the market.

It reckons that over the next two or three years the company will be making almost every type of electronic circuit on a variety of manufacturing process nodes from 180-micron down to 28nm CMOS.

These circuits could include: logic ICs, DSP, FPGAs, SoCs, MCUs, embedded MCUs, PMICs, driver ICs, specialty memory, power MOSFETs and IGBTs, analog ICs, MEMS and CMOS image sensors.
 

ansy1968

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Registered Member
Huawei now drastically reduced the number of phone being shipped. They have limited stock of Kirin chips. So basically they sell their phones as "limited edition" to fetch higher price per phone.


They trying maximizing each phone profit through "limited edition" and also stretch out to buy time.

If they really stretching out maybe could last till 2023, lol.
@Oldschool You're right it gonna cost you an arm and a leg to get one...LOL ;)

From CnTechPost

Huawei unveils Mate X2 foldable phone, priced from about $2,785​

Please, Log in or Register to view URLs content!
February 22, 2021
Huawei unveiled its new foldable phone Mate X2 on February 22, priced from RMB 17,999 ($2,785).
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

The Mate X2 features an 8:7.1 flexible internal screen with a resolution of 2480*2200 and a PPI of 413.
The Mate X2 has a 6.45-inch external screen with a resolution of 2710*1160 and a PPI of 456.


Both the inner and outer screens are equipped with a 90Hz refresh rate and P3 color gamut, with a 180Hz touch sampling rate for the inner screen and 240Hz for the outer screen.
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

When the Mate X2 is folded, the flexible screen is stored in a teardrop shape, instead of the hard folding method of Samsung Fold and Flip series models. This avoids folding marks and increases screen life.
The Mate X2 has a complex double helix teardrop hinge that uses carbon fiber composites as well as high-strength steel.
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

The hinge uses a zirconium-based liquid metal material with a strength of 2100MPa, which is 50 percent stronger than the steel used in automotive B-pillars.

Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

The thinnest part of the phone is only 4.4mm thick when unfolded, with a double-wedge unequal thickness design to meet the thickness of the camera module.
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

In terms of multi-screen operation, Mate X2 supports preview floating window, single-application multitasking, drag-and-drop sharing, and hover storage.
The rear camera module of the Mate X2 features a 50MP primary camera, 16MP ultra-wide-angle lens, 12MP telephoto lens, and 8MP periscopic telephoto lens. The device supports a 20x hybrid zoom.
The Mate X2 comes with a Kirin 9000 processor and a 4500mAh battery and supports 55W Huawei Super Fast Charging.
In addition, Huawei's flagship phones can be upgraded to HarmonyOS starting in April, and the Mate X2 will be among the first to do so.

The Mate X2 is priced at RMB 17,999 for the 256GB version and RMB 18,999 for the 512GB version and will be available starting February 25.
 

quantumlight

Junior Member
Registered Member
@Oldschool You're right it gonna cost you an arm and a leg to get one...LOL ;)

From CnTechPost

Huawei unveils Mate X2 foldable phone, priced from about $2,785​

Please, Log in or Register to view URLs content!
February 22, 2021
Huawei unveiled its new foldable phone Mate X2 on February 22, priced from RMB 17,999 ($2,785).
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

The Mate X2 features an 8:7.1 flexible internal screen with a resolution of 2480*2200 and a PPI of 413.
The Mate X2 has a 6.45-inch external screen with a resolution of 2710*1160 and a PPI of 456.


Both the inner and outer screens are equipped with a 90Hz refresh rate and P3 color gamut, with a 180Hz touch sampling rate for the inner screen and 240Hz for the outer screen.
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

When the Mate X2 is folded, the flexible screen is stored in a teardrop shape, instead of the hard folding method of Samsung Fold and Flip series models. This avoids folding marks and increases screen life.
The Mate X2 has a complex double helix teardrop hinge that uses carbon fiber composites as well as high-strength steel.
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

The hinge uses a zirconium-based liquid metal material with a strength of 2100MPa, which is 50 percent stronger than the steel used in automotive B-pillars.

Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

The thinnest part of the phone is only 4.4mm thick when unfolded, with a double-wedge unequal thickness design to meet the thickness of the camera module.
Huawei unveils Mate X2 foldable phone, priced from about $2,785-CnTechPost

In terms of multi-screen operation, Mate X2 supports preview floating window, single-application multitasking, drag-and-drop sharing, and hover storage.
The rear camera module of the Mate X2 features a 50MP primary camera, 16MP ultra-wide-angle lens, 12MP telephoto lens, and 8MP periscopic telephoto lens. The device supports a 20x hybrid zoom.
The Mate X2 comes with a Kirin 9000 processor and a 4500mAh battery and supports 55W Huawei Super Fast Charging.
In addition, Huawei's flagship phones can be upgraded to HarmonyOS starting in April, and the Mate X2 will be among the first to do so.

The Mate X2 is priced at RMB 17,999 for the 256GB version and RMB 18,999 for the 512GB version and will be available starting February 25.
Price not too bad considering scraplers are charging $2200 USD for a rtx3090 gpu
 

ansy1968

Brigadier
Registered Member
Unlike SMIC , Sienidm will have alot of its own products in the market.

It reckons that over the next two or three years the company will be making almost every type of electronic circuit on a variety of manufacturing process nodes from 180-micron down to 28nm CMOS.

These circuits could include: logic ICs, DSP, FPGAs, SoCs, MCUs, embedded MCUs, PMICs, driver ICs, specialty memory, power MOSFETs and IGBTs, analog ICs, MEMS and CMOS image sensors.
@Oldschool I give respect and appreciation to Richard Chang truly a patriot and hope for his success on his new endeavor, with the lesson from his court battle with TSMC that led to his resignation, hope all his equipment are local base or be a target for US sanction.(with TSMC complicity ).
 
Last edited:

quantumlight

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Registered Member
@Oldschool I give respect to Richard Chang truly a patriot and hope for his success, with the lesson from his court battle with TSMC that led to his resignation, hope all his equipment are local base or be a target for US sanction.(with TSMC complicity ).
China gov should put security on him, watch out for CIA. look what happens to Iran nuclear scientists... Chip independence is China Manhattan and Apollo project combined
 

ansy1968

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Registered Member
China gov should put security on him, watch out for CIA. look what happens to Iran nuclear scientists... Chip independence is China Manhattan and Apollo project combined
@quantumlight I don't want to sound cocky but its game on, let see if they're able operate inside China with impunity. ;) I think the Consul office in Wuhan is closed because of the pandemic, that with Beijing and Shanghai is where most of the Semiconductor FABS is located.
 

quantumlight

Junior Member
Registered Member
@quantumlight I don't want to sound cocky but its game on, let see if they're able operate inside China with impunity. ;) I think the Consul office in Wuhan is closed because of the pandemic, that with Beijing and Shanghai is where most of the Semiconductor FABS is located.
Better safe than sorry... it seems every now and then we hear another Iranian scientists got assassinated by CIA or mossad... As for China its harder but definetly not impossible... And too many coincidences for my liking.... recall last year a Huawei 5G fab mysteriously caught on fire, or that EUV machine China bought and paid for but caught on fire before it could be delivered... or Ray Dalio's firstborn son's Volvo sedan exploding and catching fire inside a Verizon 5G store... these memes write themselves almost
 

Oldschool

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Registered Member
China's neighbor Vietnam cloning all the
induatrial policiess from China, stealing alot of jobs from China. It has fastest GDP growth. A lot of innovations at softwares, cellphone and cars. Do you guys think it can be a developed country by 2030? Can it be a developed country based on internal foreign technology.

vietnam 13th Congress draft has set an agenda to make Vietnam a modern industrialized developing country and elevate it from the lower-middle income group by 2025. The CPV will celebrate its centenary in 2030, when it aims to see Vietnam as a “developed country with modern industry and join the upper-middle income group.”Jan
 

siegecrossbow

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Staff member
Super Moderator
China's neighbor Vietnam cloning all the
induatrial policiess from China, stealing alot of jobs from China. It has fastest GDP growth. A lot of innovations at softwares, cellphone and cars. Do you guys think it can be a developed country by 2030?

vietnam 13th Congress draft has set an agenda to make Vietnam a modern industrialized developing country and elevate it from the lower-middle income group by 2025. The CPV will celebrate its centenary in 2030, when it aims to see Vietnam as a “developed country with modern industry and join the upper-middle income group.”Jan

It depends on what the definition of developed is. If it is high middle income like Thailand then they definitely have a chance of making it. If it is something like Estonia... I don’t think even China has a chance of making it by 2030, let along Vietnam.
 
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