Chinese semiconductor industry
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I think it's OK, because BigMouth 1.0 meets BigMouth 2.0, and the end result should be Truth ...
No Canadian media outlet has reported about Huawei Mate 60 Pro either.
Shanghai Belling: 3Gsps sampling rate ADC product has completed pre-research and is expected to be mass-produced within 1 year
According to Jiwei.com, Shanghai Belling recently stated in an institutional survey that the company has completed pre-research on 3Gsps sampling rate ADC products and is expected to launch mass production products within a year. The company is developing ADC-related products with higher sampling rates.
In terms of R&D, Shanghai Belling said that in recent years, the company has continued to attach importance to R&D team building, expand the scale of the R&D team, and establish new product projects and R&D layout in the fields of industrial control and automotive electronics. In addition, Shanghai Belling said that based on market and customer needs, the company has developed a series of dedicated microcontroller SoC products in the field of optical communications and has achieved mass production. Shanghai Belling optical module SoC chips are actively introduced to multiple customers, involving wireless access, data communications, GPON, Combo PON and other application projects. Shanghai Belling has laid out SoC products dedicated to high-end optical modules for datacom, and will increase R&D investment in the future to develop higher-integrated optical module SoC products.
Shanghai Belling further pointed out that the Chinese market is the world's largest semiconductor market, and "domestic substitution" is an important driving force for the rapid development of the domestic semiconductor industry in recent years. Shanghai Belling's IC products are mainly deployed in analog circuits, and are constantly iterating to higher technical levels. At the same time, Shanghai Belling continues to launch dedicated SOC products for key market areas such as automotive electronics, industrial control energy storage, building intelligence and home appliances, and maintains a good development momentum.
In terms of new energy layout, Shanghai Belling said that the company has deployed all-round product business in the field of automotive electronics in recent years, involving power management, power devices, motor drives, EEPROM memories, isolator products, interface chips, data conversion products and other fields. The R&D layout provides a rich series of products for automotive lighting, automotive ignitions, automotive air conditioning PTC, main drive and other applications for fuel vehicles and new energy vehicles, and continues to expand other automotive electronics segmentation application platforms. At present, the number of products and revenue scale in Shanghai Belling's automotive electronics field are in a stage of rapid growth.
FACING THE DIFFICULTIES, NORTHERN HUACHUANG'S METAL FILM SOLUTIONS HELP ADVANCED PACKAGING TECHNOLOGY BREAK THROUGH BOTTLENECKS
The 24th International Conference on Electronic Packaging Technology (ICEPT 2023) was successfully held at Shihezi University in Xinjiang recently. Northern Huachuang was invited to participate in the conference and met with more than 700 experts, scholars and industry experts in the field of semiconductor packaging from 14 countries and regions around the world. People from all over the world gathered together to have an in-depth discussion on advanced packaging technology innovation, academic exchanges and international cooperation.
ICEPT is one of the flagship conferences of the International Institute of Electrical and Electronics Engineers Electronic Packaging Society (IEEE-EPS) in China. Since its inception in 1994, it has been successfully held for 23 times in Beijing, Shanghai, Shenzhen and other places, and has now become an international electronic packaging conference. One of the four major academic conferences in the field [1].
As the size of transistors continues to approach the atomic scale, Moore's Law is slowing down. Advanced packaging, as an important way to integrate chips, has obvious advantages in reducing process costs and improving device performance. However, it also suffers from wafer warpage (Warpage). , adhesion (Adhesion), contact resistance (Rc) and other aspects have put forward higher requirements and challenges for metal interconnection equipment and processes.
Geng Bo, deputy general manager of Northern Huachuang's PVD business unit, gave a report titled "Integrated Solution for Metal Film Equipment" at the conference. The report starts from the innovative exploration practice of Northern Huachuang and introduces the overall solution of metal film preparation equipment for the advanced packaging field. This solution can help packaging companies break through technical bottlenecks such as warping chip transmission and loading, effectively reduce contact resistance, improve adhesion, optimize particle control capabilities, significantly improve film performance, increase production capacity, and reduce costs.
Northern Huachuang has been deeply involved in the industry for more than 20 years, and has formed a multi-category series of products with advanced technology and reliable performance in the fields of etching, thin film deposition, oxidation/diffusion, and cleaning. Looking forward to the future, Northern Huachuang is willing to work hand in hand with industry colleagues and work together to promote continuous breakthroughs in advanced packaging technology and provide more and better solutions.
Found an interesting info regarding ssmb.
"Tsinghua's so-called SSMB light source results are only to Germany's synchrotron radiation light source for a verification, SSMB-EUV conversion rate of only 1 ‰, is not considered the ultimate "results". Only 1% of the ASML power
Tsinghua has always been unreliable
Looking forward to Tsinghua might as well look forward to the DPP-EUV light source of Harbin Institute of Technology.
That is the real hope of China"
If this is true then we are not seeing ssmb euv anytime soon.
Never take whatever you read in twitter or any social media seriously. Do your own research.
And Cheap too, same price with NXT 3400B at $170 million dollars, which can power dozen of Euv machine.
Construction[]
It has a circumference of 432 metres, and is designed to operate at 3.5 , the highest energy of any synchrotron other than the Big Three facilities in Hyōgo Prefecture, Japan, in Grenoble, France and at Argonne National labs, United States. It will initially have eight beamlines.The particle accelerator cost 1.2 billion (176 million). It is China's biggest light facility. It is located under a building with a futuristic snail-shaped roof.
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DPP is a dead end, can't find A-SET attached post, at most the power rating is at 150w while ASML & Gigaphoton LPP are able to provide 250w, the new generation ASML HI NA at 400w. From the numbers you can see which one is commercially viable cause since 2020 the EUVL with DPP is ready as part of the 13th 5 year plan BUT was forced to reexamine due to the inadequacy of the power unit.
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100%
Agreed 100%. Again, I understand everyone is very excited but we still need to differentiate bw good/probable sources vs everything else. I absolutely do not want this to turn into a thread of pages & pages of wild speculations
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