Semi-conductor Equipment and Core Component Supporting New Progress Forum: Domestic manufacturers are making gratifying progress.
Zheng Guangwen, chairman of Fuchuang Precision, pointed out in his speech report "Opportunities and Challenges of Domestic Components" that in terms of complete machines, China's domestic equipment will reach 30 billion yuan in 2022, and it is expected to double in 2025; according to 60% According to the theory of the proportion of parts and components, the demand for parts and components on the equipment side is 36 billion yuan. In terms of production line operation and maintenance, at the Fab end, the production capacity is 50,000 pieces per month, and the annual maintenance cost of parts is 600 million.
Lin Jian, founder and executive president of Honghu (Suzhou) Semiconductor Technology Co., Ltd., introduced in his speech that a new capacity of a fab will have a demand for transmission equipment. According to preliminary calculations, it has been disclosed that all new wafer capacity corresponds to the demand for Sorter. There are 1,600 sets, and the estimated quantities of EFEM and VTM are about 46,000 sets and 20,000 sets respectively. Among them, the core of the transmission system is a large-scale cleaning robot.
Wu Bingwen, deputy general manager of Zhuhai Chengfeng Electronic Technology Co., Ltd., gave an example. In 2022, manufacturers in mainland China will directly purchase parts and components worth more than US$1 billion. Among them, major local manufacturers, such as SMIC, Hua Hong Group, Yangtze River Storage, Hefei Changxin, etc. The amount of direct procurement of components is about 430 million US dollars.
Xu Meng, sales director of Aante (Changzhou) Precision Technology Co., Ltd., introduced that Aante has become a one-stop service platform since it started as an agent. The company's parts can be localized, and now it has a lot of experience and corresponding models .
Li Wei, sales director of the semiconductor industry of Huizhuan Technology Group Co., Ltd., introduced that the company mainly uses ultrasonic machine tools and ultrasonic tools in the semiconductor industry, and the processed products are the fixtures used for etching, coating, and oxidation of wafers. and consumable processing.
Wei Min, deputy general manager of Beijing Tongjia Hongrui Technology Co., Ltd., introduced that in the field of semiconductor vacuum pumps, the company's current four series of products fully cover all applications in the pan-semiconductor industry.
According to Li Zeyuan, deputy general manager of technology of Googol Technology Co., Ltd., Googol Technology not only provides products of domestic brands, but also has many layouts in the core chips of motion control, from IGBT, to encoder, display, motion control, and current control bus. Protocols and other fields have their own corresponding solutions.
Dr. Ye Lezhi, deputy secretary-general of China Electronics Special Equipment Industry Association, introduced that in the field of ultrasonic testing, Suzhou Glodon's ultrasonic testing system has basically replaced localization. In terms of wafer thinning, CETC, Huahai Qingke, Shenyang Heyan and Suzhou Jingchuang all have wafer thinning machine products.
According to Yan Peng, executive director of Ami Precision Control Technology (Shandong) Co., Ltd., Ami Precision Control has undertaken
the first domestic extreme ultraviolet free electron laser kb mirror cross-scale alignment stabilization system this year.
Yang Yuxin, Manager of Particle Beam Etching Technology of Jiangsu Leuven Instruments Co., Ltd., introduced that Leuven Instruments is currently
the only domestic manufacturer capable of mass production of ion beams. In 2 years, a single client also had a shipment volume of more than 90,000 pieces.
Zheng Guangwen, chairman of Futron Precision, introduced that at present, Futron Precision has achieved that, in a wafer production line, in addition to heating and annealing equipment, there are parts from Futron in other links.
Wu Bingwen, deputy general manager of Zhuhai Chengfeng Electronic Technology Co., Ltd., introduced that his company is committed to providing customers with more professional and high-performance domestic semiconductor testing equipment. The company's CF980 Wafer six-sided inspection AOI equipment can achieve inspections with an accuracy of 1-3 microns, and the inspection time is less than 0.5 seconds. It is the industry's first AI rapid training and modeling method.
According to Xu Jingrui, vice president of China Conductor Optoelectronics Co., Ltd., China Conductor Optoelectronics is committed to the research and development of sub-micron/nano-scale front-end automated optical inspection equipment, and has shipped a total of 350 units, all of which have been continuously used in the fab.
Zhao Shike, Director of the Functional Ceramics Center of the 12th Research Institute of China Electronics Technology Group Corporation, introduced that the 12th Research Institute has developed a variety of 4/5/8/12-inch electrostatic chuck products, and passed the verification of the user's upper cavity. The product dielectric material system covers Coulomb type and JR type products such as glass ceramics, alumina, aluminum nitride, etc., the application products cover thin film, deposition, etching, measurement and other fields. Last year, the No. 12 Institute launched research on ceramic heaters. At present, breakthroughs have been made in the research and development of material systems, and the resistivity index meets the requirements for use under the condition of 600 degrees Celsius.