Chinese semiconductor industry

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tokenanalyst

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Xiamen Xinyang Microelectronics R & D and intelligent manufacturing project started, and 12 semi-automatic production lines are planned to be built, etc.​


Xinyang technology news shows that the project has a total land area of 37,000 square meters and a total construction area of 110,000 square meters. It is planned to build 2 comprehensive workshops, 1 office building, 1 dormitory building and 12 semi-automatic production lines. At the same time, it will introduce advanced automation equipment such as AOI, SMT placement machines, plug-in machines, and wave soldering. After the project is put into use as a whole and reaches stable operation, it is estimated that the new production capacity will increase by 570 million sets of microelectronic controllers.
Wang Yueping, secretary of the Tongan District Party Committee of Xiamen City , said that the construction of Xinyang Microelectronics R&D and intelligent manufacturing projects will further help Tongxiang High-tech City to "strengthen the chain, extend the chain and supplement the chain", and build a more competitive chip industry for our district. chain and supply chain system, and promote the high-quality development of the digital economy to play an important role in promoting.

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hvpc

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Is it physically possible to create a 5nm chip using only DUV?
It's possible but not realistic.
Some online sources say it's more expensive. If so, how much more? Twice as expensive?
Too many variables impacting the final economic penalty from using DUV to build 5nm. No one had succeeded in using DUV to build 5nm chips. All the claim on social media that DUV can be used to make 5nm are all theoretical (on paper).

We can calculate the CapEx delta between using DUV vs. EUV for 5nm. We'll find cost behind using EUV would be cheaper than DUV. But the biggest economic delta between DUV & EUV will come from wafer yield or good-dies-per-wafer performance between the two. Since no one had succeeded thus far in commercializing 5nm using only DUV far, there's really no point in making the comparison.

These questions are akin to asking if it is possible to swim (instead of via airplane) across the Pacific from the US to China & how much more expensive it would it be.
 

hvpc

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You know what brother ansy1968, I just thought of something.

We are too interested in the tech ku fung fighting, that we forget about the business side of things, and the geopolitics of it.

1. As that analyst in that article said, Huawei will no longer buy SoC from Qualcomm. And this is a lot of orders. Over time, Hisilicone will eat away at Qualcomm business, potentially lowering Qualcomm's orders even more.

2. Qualcomm places their orders at TSMC!? Cue the dramatic music! This Mate 60 Pro, is an attack on the entire system!

3. As of today, everyone is adding capacity, including TSMC. Looks to be certain, since China is doing the internal circulation, that there will be excess capacity. Will the mainland China ask TSMC, hey, want to do some business?

4. That is going to happen, they will make inquiries. During the discussions, it will be implied, that if we cannot help each other out with DUV production, the we cannot proceed to a same understanding with EUV production. Man, the Chinese are not easy to deal with.

5. That EUV machine inside China they working on, it is going to shock, and probably soon.

Like, holy shit.

I know comrade tphuang kind of talks about this all the time, but we too interested in the kung fu fighting, lol.

:D:p
this would be true if SMIC have enough capacity to support all the domestic advanced IC needs & displace the need for existing+additional wafer capacity at tsmc.

folks, celebrate the Kirin9000s breakthrough, but we got to stop counting the chicken before they hatch. China still has long way to go before catching up to the western controlled ecosystem supply chain.
 

tphuang

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Huawei Hisilicon V811 chip has been unveiled 4K display

Don't have the nm process or anything like that. But in this day & age, SMIC growth is tied to Huawei growth in some ways, since Huawei just can't make its own advanced chips in the near future. As Huawei & Hisilicon grab back more of its market share in different space, SMIC will gain market share also

Actually, looks like it's an improved version of 鸿鹄818 https://baike.baidu.com/item/鸿鹄818/23665699
which is made up of A73+A53双架构4核CPU和4核G51 GPU

So looks like this is actually going to require at least FinFET process.
still not clear what process this uses, but Huawei will have its product unveiling party next week

and there are more smart screens
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So a lot more V811 is needed. At the pace this is going, HW is going to need 50% of SMIC's 14nm production also (on top of the 99% 7nm production)
 

tphuang

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I mean I've done the math here for you all. This kind of article really is kind of meaningless. We don't need the internet to tell us something when we can figure it out ourselves.

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anyways, this is kind of interesting just talking about teardown of RF for Mate 60, which is really good. Offers really high speed even in areas with weak RF signals. Interesting how they are able to do this. Have to be some kind of combination of having really good LNA, PA, filters & great algo/modem to do this

btw, the source of BAW filter for Mate 60 is still a mystery. some had expected Memsonics due to the timing, but I think maybe Huawei found someone else or designed it themselves and are getting SMEC to fab it.
 
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