Honghu Semiconductor completed the A+ round of strategic equity financing and is committed to the localization of wafer transfer equipment
Recently, Honghu (Suzhou) Semiconductor Technology Co., Ltd. (hereinafter referred to as "Honghu Semiconductor"), as a leading supplier of semiconductor wafer transfer equipment in the industry, has completed hundreds of millions of yuan in A+ round of strategic equity financing. Investment Ventures led the investment, Shenzhen High-tech Investment, Yuanhe Yuandian, Zhidao Capital, Yongxin Ark and other joint investments, and the old shareholder TEDA Technology Investment continued to invest. The funds raised in this round of financing will be used to accelerate product research and development, expand the scale of operations, strengthen the development and layout of international and domestic sales markets, etc., to consolidate and continuously improve the comprehensive competitiveness of Honghu Semiconductor in the field of global semiconductor equipment components.
Honghu Semiconductor was established in Suzhou. It is a national high-tech enterprise specializing in the R&D and manufacturing of semiconductor wafer transfer automation equipment, and is committed to the localization of wafer transfer equipment and core components. The main products include equipment front-end modules (EFEM), wafer Film transfer machine (Sorter), vacuum transfer platform (VTM), semiconductor core precision transfer components, etc. For a long time, Honghu Semiconductor has been based on independent research and development, and wafer transfer equipment has been used in the front, middle and back-end processes of semiconductor equipment.