Chinese semiconductor industry

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tphuang

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interesting article, we have winbond here looking to maintain its DDR3 and DDR4 production (including 46nm production) until close to 2030, because it believes Samsung will move on from this market and there will still be demand for DDR3.

Interesting way to look at things. So I guess there will be the low end DRAM market for the Chinese fabs for a while. I think @hvpc was saying that Fujian Jinhua is stuck at 25nm. Looks like still plenty of demand there. IIRC, Samsung's production cut is concentrated on the lower end
 

tphuang

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Shengmei Shanghai's revenue in the first quarter increased by 74.09% year-on-year, and Shengmei Korea will build a semiconductor equipment R&D and manufacturing center.

According to news from Jiwei.com, on April 27, Shengmei Shanghai released its first quarterly report, achieving revenue of 616 million yuan, an increase of 74.09% compared with the same period last year; net profit attributable to the parent was 131 million yuan, a year-on-year increase of 2937.19%; 109 million yuan, a year-on-year increase of 360.26%.
Shengmei Shanghai pointed out in the first quarter report that the main reason for the increase in revenue is to benefit from the increasing demand for equipment in the domestic semiconductor downstream industry and the competitive advantages of the company's products. New customer expansion, new market development have achieved remarkable results, and new products have won customers. It is recognized that the order volume continues to grow, and the company's revenue maintains a high growth rate. The growth of near profit attributable to the parent company and non-net profit after deduction benefited from the growth of revenue and gross profit margin.
According to Shengmei official news, it plans to invest 245 million yuan to build a new Shengmei Korea semiconductor equipment R&D and manufacturing center, of which, the construction investment is 190 million yuan, and the research and development investment is 55 million yuan.

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not a surprise at all that Chinese tool makers will try to sell to Korean fabs.
 

PopularScience

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Phytium 5000c adopts domestic 14nm process to make 64 cores, which is of great significance

Phytium S5000 originally planned to use the overseas 7nm process for mass production. The original plan was 80 cores. After being included in the list by the United States, it was changed to domestic 14nm process mass production and became 64-core S5000C. The multi-core score was slightly lower, but still higher than 1000 points , still achieve double the growth of the previous generation S2500.
The main highlights of the S5000C are:
1. The use of domestic 14nm to make 64-core server products proves that domestic technology is fully capable of making server CPUs that meet high-end needs such as cloud computing. Considering that some domestic GPU and AI chip design companies have also been sanctioned by the United States recently, these companies can also switch back to domestic sanctions in the future.
2. Using the chiplet method, four dies are packaged to achieve 64 cores, which shows that domestic companies can also play with the chiplet design.
3. DDR5-4400 is realized by using 14nm technology, which is only slightly lower than the originally planned DDR5-4800 frequency. Internationally, CPUs using DDR5 generally need to be implemented with a process below 7nm because of power consumption constraints. Domestic companies can use 14nm to make DDR5-4400, which shows that the design capability is quite good.
4. Equipped with 96 lanes PCIE 5.0, the expansion IO is very rich, 32 lanes more than the originally planned S5000, more suitable for cloud computing hosts, higher IO bandwidth, and can be used with various computing cards to achieve a higher overall machine performance.
5. Single CPU SPEC06>1000 points, which is only 200 points less than the original S5000, and this score has already surpassed the latest Hygon 3 server CPU that introduced AMD X86 technology, indicating that independent innovation technology can completely surpass the introduction of foreign technology .
 

tphuang

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Phytium 5000c adopts domestic 14nm process to make 64 cores, which is of great significance

Phytium S5000 originally planned to use the overseas 7nm process for mass production. The original plan was 80 cores. After being included in the list by the United States, it was changed to domestic 14nm process mass production and became 64-core S5000C. The multi-core score was slightly lower, but still higher than 1000 points , still achieve double the growth of the previous generation S2500.
The main highlights of the S5000C are:
1. The use of domestic 14nm to make 64-core server products proves that domestic technology is fully capable of making server CPUs that meet high-end needs such as cloud computing. Considering that some domestic GPU and AI chip design companies have also been sanctioned by the United States recently, these companies can also switch back to domestic sanctions in the future.
2. Using the chiplet method, four dies are packaged to achieve 64 cores, which shows that domestic companies can also play with the chiplet design.
3. DDR5-4400 is realized by using 14nm technology, which is only slightly lower than the originally planned DDR5-4800 frequency. Internationally, CPUs using DDR5 generally need to be implemented with a process below 7nm because of power consumption constraints. Domestic companies can use 14nm to make DDR5-4400, which shows that the design capability is quite good.
4. Equipped with 96 lanes PCIE 5.0, the expansion IO is very rich, 32 lanes more than the originally planned S5000, more suitable for cloud computing hosts, higher IO bandwidth, and can be used with various computing cards to achieve a higher overall machine performance.
5. Single CPU SPEC06>1000 points, which is only 200 points less than the original S5000, and this score has already surpassed the latest Hygon 3 server CPU that introduced AMD X86 technology, indicating that independent innovation technology can completely surpass the introduction of foreign technology .
I thought I read about this somewhere too, but looks like foofy posted it
飞腾S5000原计划采用境外7nm工艺量产,原计划为80核,因为被美国列入清单后,改成境内14nm工艺量产,变为64核S5000C,多核分数略为降低,但仍旧高于1000分,仍旧实现比上一代S2500翻倍的增长。
S5000C主要亮点有:
1.采用境内14nm做出64核服务器产品,证明国内工艺是完全可以做出满足云计算等高端需求的服务器CPU。考虑到近期一些国产GPU,AI芯片设计公司也受了美国的制裁,这些公司以后也可以切换回国内制裁。
2.采用chiplet方式,四个die合封实现64核,说明国内公司也可以玩转chiplet设计。
3.采用14nm工艺实现了DDR5-4400,只比原来计划的DDR5-4800频率略低。国际上采用DDR5的CPU,一般需要搭配7nm以下的工艺来实现,原因是功耗限制。国内公司能采用14nm做出DDR5-4400,说明设计能力是相当不错的。
4.搭配了96 lane PCIE 5.0,扩展IO非常丰富,比原来计划的S5000还多32 lane,更适合用作云计算主机,更高的IO带宽,能搭配各种计算卡实现更高的整机性能。
5.单CPU SPEC06>1000分,只比原来的S5000少了200分,而且这个分数已经超过了引进AMD X86技术的海光服务器CPU最新型的海光3号,说明自主创新技术完全可以超过引进国外技术。
下面是原来计划使用境外7nm工艺的S5000的规格:【图片】【图片】改为14nm工艺实现的S5000C规格,80核心变64核心,性能略为缩水,其他方面基本不变。
腾云S5000C计划在2023年内发布,同时还会有新一代桌面级腾锐D3000,一开始就准备采用14m工艺,所以不受影响,号称单核性能提升一倍。
I assume this is with SMIC improved 14nm process (aka 12nm). It's going to be a problem for Phytium that its new server chip is going to be worse than Loongson's 3D5000 CPU (I think that one was 1800 score on specint 2006)
But let's wait for this and D3000 to be released. I don't see how it can be competitive with Loongson's 6000 series.

Also, this tells me Huawei has good chunk of SMICs 7nm capacity since these CPU makers are stuck with SMIC's 14nm process
 

tphuang

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a little update from Biren after nothing important for a while.
They participated in Baidu PaddlePaddle ecosystem events. Was invited by PaddlePaddle as a representative for hardware side of things
壁仞科技将作为AI算力芯片企业的典型代表,依托已经量产的壁砺™系列大算力通用GPU芯片,为联盟科技创新提供算力层面的支持。
The important part here is that it's BR series of GPUs are now in mass production
飞桨AI Studio硬件生态专区则旨在深化百度飞桨与AI算力芯片企业的合作,共同打造在线课程与一站式开发实训平台。硬件生态专区的建立,将有助于提升硬件底层开发体验感,帮助更多开发者低门槛、低成本实现 AI 应用创新。壁仞科技于2022年8月加入由飞桨发起的的“硬件生态共创计划”,于2022年8月壁砺™系列发布会上宣布完成训练场景的适配认证,并在之后的大半年内持续增加适配模型数量,目前正在开展百度文心大模型相关适配工作
PaddlePaddle AI Studio hardware ecosystem refers to cooperation bw Baidu PaddlePaddle & AI chips firms. Biren Tech joined this in Aug 2022 & was certified that month.
In the past few months, it's been increasing number of models that it is "adapted" (or validated) for.
Looks like it's been validated for Baidu's Erniebot

此外,壁仞科技目前已经初步打造了软硬一体的全栈大模型解决方案,包括以大算力芯片为基础的高性能基础设施、智能调度管理数千GPU卡的机器学习平台、高性能算子库和通信库以及兼容适配主流大模型的训练框架。
It's creating a software/hardware solution to intelligently manage thousands of GPUs in machine learning & high performance computing libraries & communication libraries in large model training.

丁云帆补充道:“百度飞桨深度学习平台和文心大模型致力于构筑产业智能化基座,赋能千行百业。我们希望能够与飞桨一起强强联合共同建设大模型产业生态。目前,我们也已经与百度飞桨成功联合申报了多项国家级重大科研项目,围绕AI软硬件生态建设进行联合攻关,未来也将持续与百度飞桨一起共同开展业务落地。”
another comment here about looking to work deeper with Baidu PaddlePaddle deep learning platform and Erniebot large model platform. The point here is that it's already been used for these purposes.

They haven't been doing nothing. Just been really quiet
 
D

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I thought I read about this somewhere too, but looks like foofy posted it

I assume this is with SMIC improved 14nm process (aka 12nm). It's going to be a problem for Phytium that its new server chip is going to be worse than Loongson's 3D5000 CPU (I think that one was 1800 score on specint 2006)
But let's wait for this and D3000 to be released. I don't see how it can be competitive with Loongson's 6000 series.

Also, this tells me Huawei has good chunk of SMICs 7nm capacity since these CPU makers are stuck with SMIC's 14nm process
3D5000 single-server score was 400 points according to sina finance
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hvpc

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That chart is not completely correct. NXT1960B is for 20nm node. I am certain because I was involved in its rollout for 20nm HVM.
And 20nm and 14/16nm should be split into two node families.

other than that, this is chart got it right that NXT1980 is tied to 10nm node and NXT2000 for 7nm node.
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interesting article, we have winbond here looking to maintain its DDR3 and DDR4 production (including 46nm production) until close to 2030, because it believes Samsung will move on from this market and there will still be demand for DDR3.

Interesting way to look at things. So I guess there will be the low end DRAM market for the Chinese fabs for a while. I think @hvpc was saying that Fujian Jinhua is stuck at 25nm. Looks like still plenty of demand there. IIRC, Samsung's production cut is concentrated on the lower end
Winbond is engaged in “specialty application” DRAM. Lots of fine tuning specific to the use case is involved. This is why they are able to secure good margin and maintain some “stickiness” to hold on to their customers. The niche market they play in do not require very large DRAM memory capacity so DDR3 would suffice…their DDR4 also uses older DRAM technology than the mainstream DRAM players. Winbond is also mainly on 25nm node and older DRAM process. And since the big boys focuses more on leading edge, high bit density, high memory capacity space, Winbond has little competition in this niche.


if I recalled correctly, Samsung already stopped making DDR3. Winbond counts Samsung as a customer for their DDR3 and NOR needs.

JHICC’s “off-the-shelf” DRAM are geared toward PC/mobile use. Lot more development is necessary for JHICC to play in the same niche market as Winbond. Not saying they won’t be able to play in this arena, just not as-is. And since JHICC doesn’t really have a real R&D team, I’m not holding my breath on JHICC jumping in to this very specialize and small niche market.
 
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