"2022 has sufficient orders and breakthroughs in new products", how does Shengmei Shanghai maintain its leading position in cleaning equipment?
Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "Shengmei Shanghai") released the 2022 annual report, and the "results" are outstanding.
Benefiting from the increasing demand for equipment in the domestic semiconductor industry, certain achievements in new customer expansion and new market development, and new products being recognized by customers, Shengmei Shanghai will see explosive growth in operating income in 2022, and its performance will hit a new high.
In 2022, the operating income will be 2.873 billion yuan, a year-on-year increase of 77.25%; the net profit attributable to shareholders of listed companies will be 668 million yuan, a year-on-year increase of 151.08%. Among them, the revenue of semiconductor cleaning equipment was 2.078 billion yuan, the revenue of other semiconductor equipment (electroplating, vertical furnace tubes, stress-free copper throwing and other equipment) was 518 million yuan, and the revenue of advanced packaging wet equipment was 160 million yuan.
2022 is another big year for Shengmei Shanghai's product platform development strategy.
In the past year, Shengmei Shanghai has repeatedly announced that it has obtained multiple equipment purchase orders such as wet cleaning, electroplating, and glue development.
In February 2022, Shengmei Shanghai received a bulk purchase order for 29 sets of Ultra C wb tank type wet cleaning equipment, which can be applied to process 300mm wafers; obtained 13 sets of Ultra ECP map front-end copper interconnection electroplating equipment and Multiple purchase orders for 8 sets of Ultra ECP ap back-end advanced packaging plating equipment. In August, the 500th electroplating chamber of the electrochemical plating (ECP) equipment series was produced and successfully delivered to customers. In December, Ultra LITH, the gluing and developing Track equipment, was launched successfully, and the first front-end ArF process gluing and developing Track equipment was successfully delivered to domestic customers, which was an important step for Shengmei in the field of gluing and developing.
At the same time, Jiwei.com compiled statistics based on the data of the bidding platform. In
2022, Shengmei Shanghai won the bids for Hua Hong Semiconductor, Fujian Jinhua, Fudan University and other enterprise unit projects, with a total of 18 semiconductor equipment, including wet cleaning equipment, wafer Level electroplating system, front-end photoresist stripping monolithic equipment, aluminum wire and through hole cleaning equipment, etc.
