up to 30 million yuan! Beijing rewards and subsidizes the first round of chip production, EDA procurement, and auto chip insurance
On February 17 , the Beijing Municipal Bureau of Economy and Information Technology and the Beijing Municipal Bureau of Finance released the " 2023 Guidelines for the Implementation of Beijing 's High-tech Industry Development Funds (First Batch)" for comments, and the comments were solicited on February 21 . due.
The purpose of this document is to clarify the areas and directions of annual key support for Beijing's high-tech industry development funds, increase financial support for inclusive industries, and improve the efficiency of capital cashing. The first batch of key support directions for high-tech funds in 2023, including the first round of silicon chip rewards for integrated circuit design products, EDA procurement rewards for integrated circuit companies, insurance subsidies for automotive chips, etc.
According to the document, in the direction of rewarding the first round of integrated circuits, high-tech funds will focus on supporting integrated circuit design companies to carry out multi-project wafers ( MPW ) or engineering products for the first round of wafers (full mask). A certain percentage of film costs will be rewarded, and the maximum reward amount for a single enterprise shall not exceed 30 million yuan.
In the direction of EDA procurement incentives for integrated circuit companies, high-end funds will support integrated circuit companies conducting research and development in Beijing to purchase qualified EDA design tool software (including software upgrade fees), and rewards will be given based on the fact that the actual procurement costs do not exceed 50% . The maximum reward amount for a single enterprise shall not exceed 5 million yuan.
In the direction of insurance subsidies for high-end innovative products, subsidy will be given to eligible insured companies in the fields of automotive chips, intelligent connected vehicles, etc. at a rate not exceeding 50 % of the relevant insurance premiums. Among them, the maximum subsidy amount for a single insurance policy for auto chips shall not exceed 5 million yuan, and the maximum annual subsidy amount for a single enterprise shall not exceed 10 million yuan. It is worth noting that, according to the document, in addition to applying to automotive chip companies, this article also covers upstream and downstream companies (parts and vehicle companies) in the industrial chain that purchase, use, and verify related automotive chips.
In terms of application conditions and requirements, enterprises applying for high-tech funds in any direction must be registered in Beijing, have independent legal personality and have no serious dishonesty records in the past three years. In principle, the same company can only apply for one direction, and companies that apply for the first round of integrated circuit production, EDA procurement incentives, and commercial insurance subsidies for automotive chips must be recommended by the economic and information authorities in their districts.
In 2023 , high-tech funds will adopt the "exposure declaration method", and the declaration time for this batch is from the date of publication to April 15 , 2023 . Eligible reporting units can log in to the "Beijing Tongqiu Service Edition APP- Integrated Application Platform - Beijing Municipal Bureau of Economy and Information Technology and Beijing Municipal Bureau of Finance regarding the release of the " 2023 Implementation Guidelines for Beijing's High-tech Industry Development Funds (First Batch) "Notice - Immediate Declaration" entry to fill in, and submit relevant information and materials for declaration according to the filling guidelines.
On February 17 , the Beijing Municipal Bureau of Economy and Information Technology and the Beijing Municipal Bureau of Finance released the " 2023 Guidelines for the Implementation of Beijing 's High-tech Industry Development Funds (First Batch)" for comments, and the comments were solicited on February 21 . due.
The purpose of this document is to clarify the areas and directions of annual key support for Beijing's high-tech industry development funds, increase financial support for inclusive industries, and improve the efficiency of capital cashing. The first batch of key support directions for high-tech funds in 2023, including the first round of silicon chip rewards for integrated circuit design products, EDA procurement rewards for integrated circuit companies, insurance subsidies for automotive chips, etc.
According to the document, in the direction of rewarding the first round of integrated circuits, high-tech funds will focus on supporting integrated circuit design companies to carry out multi-project wafers ( MPW ) or engineering products for the first round of wafers (full mask). A certain percentage of film costs will be rewarded, and the maximum reward amount for a single enterprise shall not exceed 30 million yuan.
In the direction of EDA procurement incentives for integrated circuit companies, high-end funds will support integrated circuit companies conducting research and development in Beijing to purchase qualified EDA design tool software (including software upgrade fees), and rewards will be given based on the fact that the actual procurement costs do not exceed 50% . The maximum reward amount for a single enterprise shall not exceed 5 million yuan.
In the direction of insurance subsidies for high-end innovative products, subsidy will be given to eligible insured companies in the fields of automotive chips, intelligent connected vehicles, etc. at a rate not exceeding 50 % of the relevant insurance premiums. Among them, the maximum subsidy amount for a single insurance policy for auto chips shall not exceed 5 million yuan, and the maximum annual subsidy amount for a single enterprise shall not exceed 10 million yuan. It is worth noting that, according to the document, in addition to applying to automotive chip companies, this article also covers upstream and downstream companies (parts and vehicle companies) in the industrial chain that purchase, use, and verify related automotive chips.
In terms of application conditions and requirements, enterprises applying for high-tech funds in any direction must be registered in Beijing, have independent legal personality and have no serious dishonesty records in the past three years. In principle, the same company can only apply for one direction, and companies that apply for the first round of integrated circuit production, EDA procurement incentives, and commercial insurance subsidies for automotive chips must be recommended by the economic and information authorities in their districts.
In 2023 , high-tech funds will adopt the "exposure declaration method", and the declaration time for this batch is from the date of publication to April 15 , 2023 . Eligible reporting units can log in to the "Beijing Tongqiu Service Edition APP- Integrated Application Platform - Beijing Municipal Bureau of Economy and Information Technology and Beijing Municipal Bureau of Finance regarding the release of the " 2023 Implementation Guidelines for Beijing's High-tech Industry Development Funds (First Batch) "Notice - Immediate Declaration" entry to fill in, and submit relevant information and materials for declaration according to the filling guidelines.