Chinese semiconductor industry

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tokenanalyst

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Nominally, market share is based on revenue and not unit. If you look at typical semiconductor industry analysis, the market share is always based on revenue because revenue number are most readily available via financial reports, whereas exact number of chips require some assumptions and extrapolation.

The motivation of MIC2025 was based on the large trade deficit in semiconductors based on revenue. Even though MIC2025's 70% sefl-sufficiency target is a bit vague, it's widely accepted that it's based on revenue, at least by the semiconductor industry & by US government.

I highly doubt the Chinese government was aiming for 70% unit share by 2025. The emphasis was getting domestic fabs to invest in advanced nodes. If unit share was the target, we woudn't have seen so many fabs making 14nm and below as the target. It is this massive activity towards advanced, higher revenue chips that triggered the U.S.'s reaction. Furthermore, if 70% unit share is the true target, then 'radio silence' toward the west's interpretation of 70% revenue share screwed us over. I don't think the U.S. would've imposed the current sanction if they think China is after 70% unit share.
MIC2025 was heavily misunderstood by Western analysts since 2015, as far as I know the 70% by market share has always been quoted by Western IC insiders, inside China all commentary has always been by units fabricated, in fact if you enter in the National Bureau of Statistics which is the guide that the Chinese goverment use for their policies, the output of Chips is measured in billion of units rather than in currency and makes sense because you just measure market share you are not seeing the full picture.

I don't think they are many fabs pursuing less than 14nm, except for SMIC and they are doing it on their own because is the logical step after mastering 28nm, they may have received subsides, apart from private money, but I can bet money with anyone that was a decision made by their own executives. Also given that fact that SMIC has a very heavy Taiwanese influence in their DNA, pursuing harder to make nodes comes natural to them. The other attempt I can think of was the delusional intentions of a mad guy who thought that he could make 14nm logic chips in a first attempt, of course he burn out money at match 25 before he could build anything.

The goverment has been investing heavily in HSR networks, Ultra High Voltage Networks, NEV networks, so a lot of "mature" semiconductors are needed to sustain those efforts. The critical infrastructure for China development. The goverment has invested heavily power semiconductors, optoelectronics, MEMS, Silicon Carbide, GaN and so on. Probably even more money than they have put in memory. They don't want to be dependent on this critical infrastructure chips on hostile countries.

The cut-off point latest US sanction is also a clear indication the U.S. is not interested in expanding the likes of 28nm logic since it's not as profitable. U.S. is clearly going after, while depriving China access to, the higher revenue advanced nodes.
Taking out the fact that most American politicians don't know even the ass is located, is possible that they could ban even mature nodes.

Ok, China as country do not made revenue making chips, companies like SMIC do and they will find a way, be sure about that.

28nm is often quoted in China because mark the boundary between advanced nodes and mature nodes, so will allow China equipment industry to evolve into more advanced node, create a positive feedback loop, that is probably much better than making 7nm borrowing tools subject to the will of hostile politicians. That is why SMEE immersion dual stage scanner is marketed for 28nm.

For all the talk about "national security" different from chips needed for the infrastructure, that need to be made in high volume, the Chinese military and for Chinese supercomputing efforts they dont need a lot of chips and those high end chips will be made even if the have to pattern them at 1WPH with a lab made EUV machine.
 

Topazchen

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China is a growing threat to national security, U.S. companies and American workers, U.S. Commerce Secretary Raimondo says​

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"Raimondo said the U.S. government seeks to outcompete China in shaping the global economy"

How do you outcompete China and shape the global economy when there's this reality ?
images (1).jpeg
 

tokenanalyst

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China is a growing threat to national security, U.S. companies and American workers, U.S. Commerce Secretary Raimondo says​

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"Commerce Secretary Gina Raimondo says China has prioritized its national security over economic growth and trade with other nations."

A bit of a correction:

"Commerce Secretary Gina Raimondo says United States of America has prioritized its national security over economic growth and trade with other nations."

1669862507515.png
His quote.
 

tphuang

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No. IC Insight was comparing how much wafers in terms of revenue versus how much semiconductor consumed in China. The are saying, if all chips made by Chinese fabs (excluding foreign fabs like tsmc, Samsung, Hynix...) is consumed by China, this would only make up 6.6% of what China actually consumes.

You need to include Foundry, Memory, and other IDM as the baseline. Chinese foundries have about 10% total foundries revenue share, buy Chinese DRAM & 3DNAND revenue share are both <3%.
That still sounds iffy right? 10% total global foundary revenue is going to be a lot more when just focused on the China market. Even NAND, I remember recently reading that YMTC is at 5% global revenue. 6.6% of domestic demand seems really under counting things.
Let's do a quick estimate, China consumes 60% of semiconductor (sized at ~$550B in 2021), so we are looking at ~$330B demand. Domestic fab making up 6.6% of that would mean roughly $22B worth of wafers produced. Add up the Chinese foundry revenue (SMIC $6B = 5.5%....) so 10% total foundry share would mean $10B). CXMT & YMTC would add no more than $3B each (assuming 1.2M wafers each in 202). That leaves ~$6B chips by other IDM.
SMIC revenue has been about $1.9 billion a quarter this year. Huahong without counting HLMC is at around $600 million a quarter. With HLMC, it's probably at a $1 billion a quarter. With those 2 alone, you are going to hit $12 billion this year. The thing is that China has so many IDMs that make a few hundred million here or a billion there a year. This is significantly undercounting things.

Without hitting an acceptable reliability, throughput, and yield would make fab operation a nightmare. Low reliability would take up too much resource; amount of time required to fix, requalify the tool, and effort to manage the WIP (work in progress) by moving wafers to a different equipment with different fingerprint is complex. If too many tool breaks down, too often, you'd end up with so many unique combination of tool-sets fingerpint to manage.
Nobody said this is ideal. The cost were using domestic tools for some of these process is probably quite high. But SMIC has no choice in this case.

Low throughput means more equipment and fab space needed than baseline. Low yield not only impacts the bottom line (profit), but the extra work required to troubleshoot the yield issue would make a fab quite chaotic.

You just can't run a fab efficiently when basic reliability, yield, and throughput couldn't ne reached.
btw, I agree with all of what you are saying here. You are looking at this from a commercial point of view. The rest of us are looking at it from a national security point of view. When Shanghai gov't is ponying up the money for capex and giving SMIC free land at Lingang and Pudong, SMIC can run an operation that is far from optimal since much of its risk has already been taken away by the local gov't.

SMSC itself rarely gets talked about. SMIC just mysterious have $1.6 billion additional capex from somewhere. SMIC doesn't talk about where the money comes from and makes up unbelievable tale about how it gets used. But geopolitical climate is such that SMIC will be expected to run lower yielding and more wasteful production lines.

Anyhow, those comment about needing improvement on reliability, throughput, yield, is not mine. It's assessments I heard directly from domestic fabs. It's compilation & paraphrasing of what I heard...the few feedbacks I received are consistent that domestic tools meet a certain node in DRAM/3D-NAND/Logic, and they always come with the same comment on the "need improvement" areas.
That's a good thing. The fact that the domestic fabs are working with domestic tools means they will be able to improve faster.

btw, I also see the current American strong arming of TSMC/Samsung as great for Chinese tools makers, since these 2 companies will be more willing to give Chinese tool makers a look. Nobody wants to get strong armed by monopolies.
A number I keep hearing is 20K wpm. Without divulging which company's tool is the bottleneck, the bottleneck at one of the process step (etch, deposition) must be at around 20K wpm.
And I definitely don't expect you to know everything about the one fab that SMIC is trying to keep secret, lol.

American laws didn't allow export of sub-14nm tools to China. Lam employee stated they had very few staff at SMSC. I think they've been struggling for 2 years in trying to raise production at SN1 without American tools.

I agree the additional 1.6B is mostly going to the scanners. I just disagree they are for NXT2050/2100. SN1 doesn't need anymore scanners. SN2 will not take on tools until 2024 & without domestic equipment that could support 7nm, there won't be much need for NXT2050/2100. Even if SMIC do invest in 35K worth of 7nm, probably only need 2-3 NXT2050.
That's where this gets interesting. I agree that 35k worth of 7 nm probably only needs a few NXT2050/2100. I also agree that SN1 doesn't need anymore scanners. Yet, ASML has invested a bunch of money into developing them with China seeming to be the primary market. As such, it probably only looking to sell more than 2 or 3 of these machines to SMIC and HLMC. We also know that SMIC should be concerned about getting cut off, so it would fast tracked orders to stock up on machines.

Here is some math for you. SN1 capex for 35k was supposed to be $9 billion. Let's say it spent most of that from 2018 to 2021, since we both agree that they should be close to 35k wpm by this year. We also know that they averaged probably $4 billion a year in total capex during those years. As such, it would reason that half of the SMIC capex from 2018 to 2021 went to its SMSC fab! We also know that SN2 fab was in the midst of construction for this year. As such, tools they take in this year should be going to SN2 fab. Now, if they stopped taking tools for SMSC, then we should see their capex drop to about $3 billion in 2022 (which would still be a lot more than what they spent on other fabs in previous years), but it has actually gone up to $6.6 billion. That means, they are probably spending over $3 billion on SN2 tools this year + some accelerated deliveries for their new production lines in Beijing and Lingang.

That doesn't mean SN2 production will necessarily start in 1H of next year. Their SN1 production increase has been very slow. I'm not convinced they are actually at peak capacity at SN1. As they will inevitably be looking to increase 7 nm production, they will need more time to work out non-American tools to make sure they can raise yield to acceptable levels. That might take a while. It doesn't change the overall plan/trajectory they have here.

What I got out of this is that SN2 will require more capex and generate more revenue than SN1 (whether from higher wpm or from more advanced processes). Other projects simply do not justify this level of capex. Think about it, total capex between Beijing/Tianjian/Shenzhen/Lingang is $26 billion. that's to mostly spent over 7 years from 2021 until 2027, which is under $4 billion a year. And that number is likely to be higher when we get to 2024 to 2026 timeframe when Beijing/Shenzhen/Lingang are all adding capacity at the same time. If we continue to see total capex in 2023 to 2025 at $6 to 8 billion a year, then 2 to 3 billion of that are going to SN2.

First, first few systems of a new model are essentially beta systems and need to be tested in production setting to help WFE supplier like ASML validate their new system. Under this limitation, you would already expect this first system to go to leading edge logic or DRAM fab.
And, 'yes', the new functionalities on NXT2100 are needed, mores o, outside of China. SMIC's N+2 nor any 7nm process in the world could bring out the new advanced capabilities of NXT2100
ASML's own words
Continued developments for the next generation of scanners, NXT:2100i for the most critical DUV layers,
I'm sure you know more than I do, but it sounds like something you'd really need in order to have advanced process without EUV. Does TSMC really need 2100i for 5 to 7 nm process when its most critical layers are already done by EUVs?
 

tphuang

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It's certainly preemptive measure. But not sure what the purpose it serves.

This was pre-payment or down payment for future scanner purchase. Any future US sanction on immersion scanners would certainly trump any down payment or an existing PO. SMIC had an outstanding EUV PO with ASML and also down payment, but they still weren't able to take delivery of the EUV system.

So not sure why it would be different this time around with the immersion systems. If US could coerce the Dutch government to block shipment of immersion scanner, even the $1.6B pre-payment will not guarantee SMIC could get ASML to honor the immersion POs.

I'm sure the $1.6B serves some purpose, I just personally don't quite understand what that purpose is.
We've gone through this several times already. Other fabs cut orders, so slots opened up. Now, SMIC can take earlier slots than it otherwise had access to. We've already seen October sales double from ASML.

And it's quite likely that any possible Dutch action would provide a grace period. Dutch gov't have already made it clear that they don't consider EUV and DUVs to be the same case.
 

ansy1968

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MIC2025 was heavily misunderstood by Western analysts since 2015, as far as I know the 70% by market share has always been quoted by Western IC insiders, inside China all commentary has always been by units fabricated, in fact if you enter in the National Bureau of Statistics which is the guide that the Chinese goverment use for their policies, the output of Chips is measured in billion of units rather than in currency and makes sense because you just measure market share you are not seeing the full picture.

I don't think they are many fabs pursuing less than 14nm, except for SMIC and they are doing it on their own because is the logical step after mastering 28nm, they may have received subsides, apart from private money, but I can bet money with anyone that was a decision made by their own executives. Also given that fact that SMIC has a very heavy Taiwanese influence in their DNA, pursuing harder to make nodes comes natural to them. The other attempt I can think of was the delusional intentions of a mad guy who thought that he could make 14nm logic chips in a first attempt, of course he burn out money at match 25 before he could build anything.

The goverment has been investing heavily in HSR networks, Ultra High Voltage Networks, NEV networks, so a lot of "mature" semiconductors are needed to sustain those efforts. The critical infrastructure for China development. The goverment has invested heavily power semiconductors, optoelectronics, MEMS, Silicon Carbide, GaN and so on. Probably even more money than they have put in memory. They don't want to be dependent on this critical infrastructure chips on hostile countries.


Taking out the fact that most American politicians don't know even the ass is located, is possible that they could ban even mature nodes.

Ok, China as country do not made revenue making chips, companies like SMIC do and they will find a way, be sure about that.

28nm is often quoted in China because mark the boundary between advanced nodes and mature nodes, so will allow China equipment industry to evolve into more advanced node, create a positive feedback loop, that is probably much better than making 7nm borrowing tools subject to the will of hostile politicians. That is why SMEE immersion dual stage scanner is marketed for 28nm.

For all the talk about "national security" different from chips needed for the infrastructure, that need to be made in high volume, the Chinese military and for Chinese supercomputing efforts they dont need a lot of chips and those high end chips will be made even if the have to pattern them at 1WPH with a lab made EUV machine.
Nicely done Bro, without mature chip, those EUVL and DUVL won't function, from what I read one of the reason for the ASML supply chain problem.
 

tphuang

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Q&A with Hygon
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On if future US sanctions could affect them. They answered that they've mastered x86 architecture and independently developed 3rd generation chips. Seems like they are confident here

On whether or not they will be affected by the sanctions in Q4. They said minimally.

When asked about status of Hygon 3 (海光3). They said it is for sale right now and will be their main product in 2023.

Asked in the event of AMD stop licensing technology to them. They said that the company has completed the digestion of licensed technology and possess the ability to independently complete subsequent technical iterations and product upgrades

Here is a product guide for Hygon as of Nov 2022
HygonProducts-Nov2022.jpg
You will notice that Hygon 4 is coming out in 2024 and uses 7nm process. Not clear to me if Hygon 3 is produced by TSMC and SMIC. I think I read that it's supposed to be TSMC, but they may have a SMIC version also.
 
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