Please rank these EUV lithography machine components in terms of difficulty of developing:
- Laser light source
- Mirrors
- Photoresist
- Tin pellets producer
Chinese semiconductor industry
- Thread starter Hendrik_2000
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- Laser light source
- Mirrors
- Photoresist
- Tin pellets producer
Eh…this list is missing the forest for the trees if you want to talk about difficulty. The *drive* laser interacts with the tin droplet dispenser to generate the actual EUV light. The biggest challenge is in the interaction between those two components and corresponding control system to get optimal production of photons. This is compounded by the fact that the tin droplets also generate debris which can accumulate on your light collectors which then kill the efficacy of your light source, so the debris *cleaning* system within your light source becomes another point of challenge. The entire light source is easily the biggest challenge, and within the component mechanics of the light source it’s not the individual components but the ways they interact with each other that’s most technically challenging.
This is the research done by Gigaphoton which developed a 27kw MOPA Laser in 2019. The Chinese MOPA C02 Laser would certainly be able to achieve a similar performance.
Now (by the same Harvard Business magazine):
"In March 2014 this magazine published “,” by Regina M. Abrami, William C. Kirby, and F. Warren McFarlan, an article that captured the conventional wisdom. The authors’ arguments were sound and well supported at the time. But just two years later eight of the 10 companies that had reached a $1 billion valuation in the shortest time ever were Chinese—and six of those eight were founded the year that article was published."
"But in the past five years, as an “innovation cold war” has taken shape between world powers, China has achieved a kind of parity with the United States"
"In the short term, China has a clear advantage in terms of output ..... and as a result it is poised to take the lead in the innovation arms race"
And finally, in an amazing crescendo of boldness, he wrote down even the unthinkable: US should now copy China!!!!!
"Up your imitation game. If you’re used to believing in your own exceptionalism, leaning into imitation as a strategy can feel like a declaration of defeat. But innovation has always been about both invention and imitation. We don’t think less of Apple because Steve Jobs got the idea for the mouse from Xerox. Genius steals, and it always has. To compete with China, imitation must be a weapon in the arsenal of global companies—one they’re willing to use."
It is astonishing that the two articles, published by the same Harvard Business magazine and written by different authors but belonging to the same US top elite demographic are just 7 years apart: 2014 and 2021.
My bad, I got confused because in the same paper it mentioned East China Normal University developing a 27kW drive laser. So, both Japan (Gigaphoton) and China have 27kW drive lasers.
As the amplification of CO2 laser system approaches the technical limit, the output power is difficult to be further increased. As such, a novel laser system scheme of multi-fiber coherent synthesis has been proposed and is currently under investigation by our team at East China Normal University, as shown in . Based on the currently realized 130 W single-fiber output power, a 27 kW laser power can be achieved by using 207 synthetic Yb-doped fibers. By optimizing the fiber laser amplifier, the number of fibers can be further reduced.
China is researching a different laser+tin droplet configuration. It mentions that they are working on a fiber laser system with 207 fibers at 130W each. I'm not clear on how this will work, but on the surface, it seems it will accelerate zapping smaller tin droplets with fiber lasers resulting in a more smooth continuous delivery of photons. This seems to be a more efficient method and should result in greater net photon delivery than a CO2 MOPA laser driven system. I'm speculating on this so more informed opinions would shed more light on this.
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The Light Source would be the biggest challenge. The ASML LPP EUVL took almost a decade to develop as they struggled to develop a Light Source with sufficient Source Power for commercial mass production of ICs.
Once the Light Source is successfully developed, things will move quite fast, with the integration of the Light Source with the other components like Optics and Work Bench into a prototype LPP EUVL.
The Patent for a LPP EUVL which was filed in Shanghai a few months ago, which uses a 30KW MOPA C02 Laser, gives us an indication that the Light Source is close to completion and there are plans to develop a LPP EUVL Prototype for testing.
Nvidia can go fuck themselves, I am buying AMD next year
It is heretical in the West and in the United States in particular even admit that imitation is a necessary and good thing, let alone preach it. The Harvard Business Review are apostates that will be excommunicated for even permitting such an article to be written...
If one does not one to be copied don't exist.
China should try to replicate in prototype and even thereafter mass produce the most sophisticated EUV lithography machine that ASML has, including every single component, if it can.
hello olala
are you panda on twitter.
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