I don't think or understand why "water free environment" is a concern. Siloxane is just a solvent in the process according to the paper. The final coating is kind of chemical mix of Fluorine and Silicon. It is baked in the oven for hours during the making, so there isn't any water left, nor experiencing any water loose reaction.
The English version is only an abstract which gives the impression by "The hybrid coating with MTMS/SiO2 mass ratio of 1.3:1". The detail of processing can be found in the Chinese version.
I did not read the article outside the intro due to being on phone but in general a fluorinated siloxane coating is for reduction of chemical adhesion. This is because the fluorinated costing is both hydrophobic (no free hydrogen bonds) and oleophobic (very low induced dipole polarizability of C-F bonds).
Mars dust, to my knowledge, is adhesive due to electrostatic attraction generated by triboelectric and photoelectric charging of dust grains (see here):
Otherwise Mars dust is fully oxidized, hard, mineral dust. It not likely to have chemical adhesion.
The other possibility is mechanical adhesion which this does solve through providing a hard, smooth, nonwearing surface.
Large scale electrostatic charging is only possible in very low water environments. on Earth in wet environments the water quickly neutralizes such static charges. Intuitively, this is why humidity cannot be too LOW in semiconductor fabs due to ESD risk.
I would have expected an anti-Mars dust system to focus on grounding and removal of electrostatic and mechanical adhesion.