I'm interested in knowing what semiconductor processor chips are China using for this big bet on AI. Sure, military processors need not be as cost conscious or power conscious as consumer ones but still, it'd need to be competent to drive growth.
We know that US military has started to fund 5nm technology of Intel (Intel 18A that uses an improved ASML EUV).
That is a very complicated question without an easy answer, I guess. Not only cost is a less consideration for military, but for reliability in strong EM working environment, a less dense (advanced) chip is preferable over high density chip if performance is acceptable.
I think a easy but rough way to compare with US and China is to compare their current production technology level regardless civilian or military application. In this way we are comparing the foundations.
According to this article
Cannon Lake, the first 10nm product, found its way into Intel’s Crimson Canyon NUC mini-PCs and was a hot mess: two cores only, disabled integrated graphics, and although it shipped for revenue in 2017, Intel was right to consign it to history very quickly.
Ice Lake was Intel’s proper launch vehicle for 10nm, offering four cores and a lot of Gen11 graphics within 15 watts. It has found its way into over 50 laptop designs, but as mentioned on the previous page, despite its 15-20% increase in raw performance clock-for-clock, that 10-20% decrease in frequency balances it out for a minimal CPU improvement over 14nm. The graphics on Ice Lake are still a lot better than on 14nm, and support for Thunderbolt 3 as well as 512-bit vector instructions means that Ice Lake still has a few plus points.
Intel's current level is Intel-10SF (10nm). However, Intel's 10nm processor in 2017 (code name Cannon Lake) was handicapped and soon stopped production. It's proper 10nm processor Ice Lake was only delivered in 2019. Ice Lake although is 10nm, but its performance is only slightly better than a 17nm because its performance increase was offset by decrease of clock.
SMIC is currently offering 17nm since 2019.
So roughly speaking, US and China are on the same footing right now. That does not take into consideration of China's road map because of lack of information and also the embargo of ASML machine and the progress of domestic machines.
Another hint can be taken from Beidou chip. According to this artile
. 80% GPS chips are made of 40nm. Beidou-3's chip was 28nm in 2020, and should be 22nm now.
To summarize, in civilian application US may be slightly advanced than China, but in military application, I don't think there is anything to worry.
Note, I only talk about domestic capability, so the real champions in the sector Samsung and TSMC are not considered as US capability. Are they involved in US military contract of high value?