Chinese semiconductor thread II

sunnymaxi

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Research on PPB-Level Ultra-Low Linear Expansion Coefficient Measurement Based on Fizeau Interference and Dynamic Refractive Index Compensation​

Abstract​

As extreme ultraviolet (EUV) lithography enters the sub-nanometer precision era, the demand for characterizing ultra-low expansion materials has reached the 10-9 (PPB) level. At this resolution, even minute airflow disturbances or transient temperature gradients become dominant noise sources. To mitigate these effects, this study employs a high-vacuum thermal control chamber to maintain pressure below 100Pa and limits temperature fluctuations to within 0.1℃. We further enhanced the Fizeau interferometry system by developing a dynamic compensation model based on optical path drift. The model captures real-time atmospheric pressure and thermal field conditions via a sensor array in a vacuum chamber. And after integrating Ciddor's semi-empirical air refractive index formula, we precisely invert the optical path length change caused by residual air. Experimental results show that this compensation model significantly improves isothermal phase repeatability to 0.3nm. Based on this precision compensation system, we measured a microcrystalline sample over a 5-50℃ range, obtaining a CTE of 4.72*10-9/℃. Following the integrated evaluation, the system's expanded uncertainty was significantly reduced to 1.01*10-9. This achievement enables reliable characterization of ultra-low CTE materials at the PPB level, significantly enhancing the system's ability to suppress interference from complex thermal vacuum environments. This provides high-precision metrology support for material selection and validation in the next generation of high-end semiconductor lithography equipment.​

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seeing all these research papers looks like work has already started on next generation Lithography/EUV.
 

tokenanalyst

Lieutenant General
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seeing all these research papers looks like work has already started on next generation Lithography/EUV.
Yes a lot of work on ultra precise high end metrology for Low Thermal Expansion Lithography Components.

Measurement of coefficient of thermal expansion in fused quartz using Fizeau interference technology​

Abstract​

The rapid advancement in the EUV field demands the thermal stability of optical systems. Because EUV performance is highly sensitive, materials must exhibit an exceptionally low Coefficient of Thermal Expansion (CTE). However, the precision of traditional CTE measurement methods is no longer sufficient for current ultra-low expansion materials. This paper proposes an improved Fizeau interference CTE measurement method and establishes an integrated CTE detection system. First, we created a combined mirror structure comprising a test mirror and a reference mirror. We used cryogenic chemical bonding technology to bond the combined mirror directly, ensuring sample stability. Second, we optimized the phase compensation method. This eliminates the phase ambiguity caused by the measurement mirror length. Third, we designed a vacuum cavity structure with phase-shifting capabilities to significantly reduce environmental interference. In our experiments, we guaranteed a stable environment: temperature fluctuations in the vacuum chamber were ≤ 0.05°C, and pressure was around 100 Pa. Using this setup, we measured the CTE of fused quartz between 15°C and 63°C. Single-temperature phase testing showed a fluctuation ≤ 0.75 nm, proving the system’s exceptional stability. To verify the system’s reliability, we compared our results against the push-rod. The results show our method achieves a maximum measurement error of 3.8% and an equipment uncertainty of 2.4 × 10-9. These experiments fully demonstrate the high precision and reliability of our proposed method. The technique provides a new, robust pathway for the precise detection of CTE in ultra-low expansion materials.​

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Kalum Pupeter

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Wrought

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Exact same story was already posted earlier today.


Well, can’t blame micron, as a private business entity their priority is keeping and expanding their market share . So if they can impede their competitor by getting them sanctioned, then so be it. I don’t find anything surprising here.

Can't blame them, sure, but can respond by squeezing their business in the domestic market. If they want government involvement to tip the scales, well, that blade cuts both ways. Micron evidently hasn't learned its lesson from 2023.

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zbb

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Can't blame them, sure, but can respond by squeezing their business in the domestic market. If they want government involvement to tip the scales, well, that blade cuts both ways. Micron evidently hasn't learned its lesson from 2023.

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Or maybe it's time for rare earth restrictions on Micron and Micron's suppliers and customers?
 

interestedseal

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One could guesstimate status of DUV and EUV by looking at tool suppliers for major litho components. HCVAC’s latest PVD optics coater update implies aggressive capacity expansion of DUV and EUV optics suppliers like Guowang/Leiwang, CIOMP, SiCarrier. IBD’s ion beam optics coaters are showing the same trend.
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Confirmation IBD’s IBS coater used for Mo/Si multilayer EUV mirrors.
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Improving of interfacial quality of extreme ultraviolet multilayer reflective film based on process optimization of dual ion beam sputtering
 

european_guy

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Well, can’t blame micron, as a private business entity their priority is keeping and expanding their market share . So if they can impede their competitor by getting them sanctioned, then so be it. I don’t find anything surprising here.

Well, it should be blamed instead.

The "MATCH Act" aims to ban post-sale maintenance for ASML machines already sold in China.

If the average American thinks this is fine, then the US has already lost the long game. Normalising the use of lawfare to cripple competitor's equipment means American firms stop competing and start begging for bans. That's not leadership, that's a slow, ugly decline.

I understand this is a tech war, not normal competition, but a private firm like Micron should keep away from geopolitics and warfare. It is sad to see an important, big tech firm like Micron, to play the Tonya Harding card.
 
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Phead128

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Well, can’t blame micron, as a private business entity their priority is keeping and expanding their market share . So if they can impede their competitor by getting them sanctioned, then so be it. I don’t find anything surprising here.
First, Micron is a public traded company, not a private business entity.

Second, R&D, innovation, investment is how you maintain leadership, not knee-capping competitors using national security as an excuse. Esp. since Chinese memory has negligible sales in US market.

Third, Micron can enjoy the same treatment when China puts them on unreliable entity list and nation security review, so what goes around comes around.

Finally, it's already too little, too late for these measures as China has all the ASML DUV it needs for next few years until EUV ramps up. Maybe if it was implemented in 2018, it would have impacted China, now it's too late.

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So China doesn’t really want to buy it and the US doesn’t really want to sell it either.
Lutnick was the one who said H200 sale is okay because it's third rate tech, and now pretends it's too advanced, so US doesn't really want to sell it. You can't reason with these people.
 

tphuang

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SouthChip unveils its 48V high performance voltage changing DC-DC chip SC8707Q/8709Q. Can support 80V/60V also.

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国民技术 develops new control chip for 800G/1.6T optical transceiver modules, supporting QSFP and OSFP type of structure.
 
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