Chinese semiconductor thread II

[tokenanalyst]

Nantong's 12 billion yuan advanced packaging and testing project makes new progress.​

Tongfu Tongke held the launch ceremony for Plant No. 3 and the arrival of the first piece of equipment in Nantong North High-tech Zone, marking key progress in the Tongfu North Advanced Packaging and Testing Production Base project, a provincial-level major initiative with a total investment of 12 billion yuan.

The project includes two sub-projects: Tongfu Tongke and Tongfu Tongda. Since its establishment in October 2021, Tongfu Tongke has invested over 3 billion yuan, equipped with more than 4,800 sets of equipment and employing over 2,500 people. It now operates three core production lines memory, power devices, and high-performance computing (HPC) and achieved a taxable sales revenue of 3.2 billion yuan in 2025, up 93.4% year-on-year.



Starting in the second half of 2025, Tongfu Tongke will renovate Plant No. 3 to add 16,000 square meters of cleanroom space for a new Testing Center project, with an investment of approximately 900 million yuan. The center will feature over 700 testing machines and, upon full operation, deliver 350 million units of testing capacity and generate over 1 billion yuan in output value, significantly boosting Nantong’s high-end IC packaging and testing capabilities.

Tongfu Tongke has seen an average annual growth rate of over 310% in taxable sales since 2021, becoming a leading industrial player. The Tongfu Tongke portion of the project accounts for 4.5 billion yuan of the total investment.

Chairman Shi Lei stated that the renovation marks a critical step toward achieving vertical integration, extending the industrial chain, strengthening value chains, and enhancing core competitiveness in advanced packaging and testing.
​

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Shengmei Shanghai's operating revenue reached 6.786 billion yuan in 2025, consolidating its competitive advantages in cleaning equipment, electroplating equipment and other fields.​

Shengmei Shanghai reported a strong performance in 2025, achieving operating revenue of RMB 6.786 billion up 20.80% year-on-year—and net profit of RMB 1.396 billion, an increase of 21.05%. The company maintained a leading gross profit margin of 47.48%, fueled by high margins in electroplating equipment (60.04%) and supported by continuous technological advancements. Nearly all revenue came from mainland China (99.55%), where demand grew by 19.68%, while overseas sales remained modest but stable.

Semiconductor cleaning equipment remained the core revenue driver, contributing RMB 4.506 billion or 69.28% of total income with year-on-year growth of 11.06%. The company’s proprietary SAPS and TEBO megasonic technologies achieved significant breakthroughs in advanced processes such as FinFET and 3D NAND, with world-leading particle control performance (fewer than 10 particles per 26nm chip). Its Tahoe combined cleaning system reduced sulfuric acid consumption by 75%, helping customers meet environmental standards.

Electroplating equipment, a key differentiator, generated RMB 1.661 billion (25.54%) and grew sharply by 46.05%. The company’s multi-anode local electroplating and 3D stacked technologies enable void-free plating for ultra-thin layers and high-aspect-ratio applications at nodes down to 28nm. Its advanced packaging electroplating technology achieves 2μm ultra-fine line coverage, while its rubber ring sealing patent enhances performance in mass production.

Innovation continued with the launch of new products like UltraLith™ Track (front-end coating/developing), KrF process equipment for a leading Chinese wafer manufacturer, and PECVD and vertical furnace systems that have entered mass production or client testing. The company’s Lingang R&D and verification platform has improved internal iteration speed and shortened customer validation timelines.

While the overall gross margin slightly declined due to shifts in product mix—cleaning equipment margins dropped by 1.63 percentage points the growth in high-margin electroplating helped maintain profitability. Looking ahead, Shengmei Shanghai plans to expand R&D investment, accelerate platformization of its product line, and strengthen both domestic dominance and global outreach. It will also enhance supply chain resilience through key component localization, reinforcing its long-term competitiveness in the semiconductor equipment industry.

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Unisplendour UNIS PC terminals based on Zhaoxin CPUs win a large share of a major pharmaceutical state-owned enterprise's annual centralized procurement project.​

Unisoc's UNIS PC terminal, a subsidiary of Unisoc, achieved another success. Leveraging the superior performance of Zhaoxin CPUs, Unisoc UNIS's robust hardware configuration, mature full-scenario solutions, extensive experience serving central and state-owned enterprises, and comprehensive after-sales support system, Unisoc UNIS achieved a significant breakthrough in a major biopharmaceutical company's 2025-2026 centralized procurement project for computer terminals, winning a large share of the bid. This successful bid not only demonstrates Unisoc's core competitiveness and high industry recognition in the field of domestically developed PC terminals, but also highlights the technical strength, mature adaptability, and stable operation of Zhaoxin CPUs in key industry office scenarios.
Currently, digital transformation has become a core direction for the high-quality development of government and enterprises. As the fundamental carrier of digital office work, the self-controllability, security, and efficiency of office terminals directly affect the stable operation of core business. The winning central enterprise in this bid is a key player in China's pharmaceutical industry, with business covering crucial aspects such as pharmaceutical technology research and development and pharmaceutical manufacturing. It has set stringent standards for the stability, efficiency, security, and compliance of terminal equipment. Zhaoxin CPU, with its secure and reliable independent technology, superior performance, high-level security protection, and excellent software and hardware compatibility, became the core technological support for Tsinghua Unigroup's UNIS terminal to break through the competition and successfully win the bid.
This time, four models equipped with Zhaoxin CPUs from Unisoc successfully won the bid, covering both desktop and laptop categories, comprehensively covering various office scenarios for enterprises.​

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

A Chinese team has successfully verified that significant progress has been made in the research of a "star material" for semiconductors.​

A Chinese research team led by Professor Wu Zhenping from Beijing University of Posts and Telecommunications, in collaboration with Hong Kong Polytechnic University and Nankai University, has successfully demonstrated intrinsic ferroelectricity in gallium oxide (Ga₂O₃) a next-generation wide-bandgap semiconductor at room temperature.

Gallium oxide, with a bandgap of ~4.8 eV, is highly promising for high-power electronics and solar-blind detection but lacked memory capabilities like USB flash drives until now. The team developed pure-phase κ-Ga₂O₃ thin films using industrial-scale MOCVD technology and proved their ferroelectric properties through stable polarization reversal, achieving a high on/off ratio (>10⁵) and durable cycling (>10⁷ cycles).

Using first-principles calculations and atomic imaging, they discovered that the ferroelectricity arises from synergistic structural distortions between GaO₄ tetrahedra and GaO₆ octahedra without breaking chemical bonds. This confirms that wide-bandgap semiconductors can naturally exhibit ferroelectric behavior via phase transitions.

This breakthrough resolves a long-standing scientific debate, enabling coexistence of high-power performance and non-volatile memory in one material. It paves the way for multifunctional, high-performance semiconductor devices suitable for extreme environments, advancing both fundamental science and future technologies in integrated circuits and electronics.

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

 

[bsdnf]

The first domestic large-scale production line for 8-inch diamond heat sink films was officially put into operation

The products achieve a thermal conductivity of 2000–2200 W/(m·K), five times that of traditional copper materials and ten times that of aluminum, effectively addressing heat dissipation challenges in AI chips, high-power devices, lasers, RF applications, and other fields.

With a total investment of 1.2 billion yuan and an initial phase investment of 360 million yuan, the production line will have an annual capacity of 20,000 pieces of 8-inch diamond heat sink films upon completion.

Please, Log in or Register to view URLs content!

 

[huemens]

US reportedly mulls capping Nvidia H200 sales to Chinese buyers;
move shows rising anxiety over lack of sales: expert

Please, Log in or Register to view URLs content!

US officials are considering caps on the number of artificial intelligence (AI) accelerators Nvidia Corp can export to any one Chinese company, Bloomberg reported on Tuesday. The reported move may be a "hunger marketing" tactic, reflecting rising anxiety over lack of sales of relevant Nvidia chips in the Chinese market despite US approval, a Chinese expert said.

Citing people familiar with the matter, the Bloomberg report said the US administration has talked about limiting Chinese firms to buying 75,000 of Nvidia's H200 chips each and the report added the move would further constrain the chipmaker's reentry into a crucial market. Shipments of Advanced Micro Devices Inc's MI325 chips, which have similar capabilities, would also count toward a customer's cap, the people said, per report.

 

[european_guy]

Please, Log in or Register to view URLs content!

I cannot wait for when all this farce will be moot. 2027 cannot came soon enough.

...maybe even 2026 H2

Edit: I modify this post instead of replying in a new one. The problem is wafer capacity not chip performance. Performance would be already more then enough, see for instance

Please, Log in or Register to view URLs content!

.

 

[Tomboy]

I cannot wait for when all this farce will be moot. 2027 cannot came soon enough.

...maybe even 2026 H2

Well, according to Huawei's roadmap, to get something that can actually be competitive chip to chip with the latest Nvidia product and hopefully power draw as well is going to take until atleast Q4 2028 with the Ascend 970.

 

[siegecrossbow]

Please, Log in or Register to view URLs content!

Stick with having no memory then… How they hell do you add spying devices in memory???