Chinese semiconductor thread II

Maikeru

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tokenanalyst

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A company advantage and most value asset is not their technology, that is just math, physics and research money. Is not their market share, that is just how much they are going to lose when their competition catch up. Is not their stock valuation, that is just speculative money. Is customers trust, that is what think tank stooges don't understand when they tell D.C. clowns that they should force US companies to treat decades long customers in China like s*it
 

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Sinlink Integrated's "WAT Test Structure and WAT Test Method" patent published​



Tianyancha shows that the patent of "WAT test structure and WAT test method" of Xinlian Integrated Circuit Manufacturing Co., Ltd. has been announced. The application publication date is March 18, 2025, and the application publication number is CN119650549A.

The present invention provides a WAT test structure and a WAT test method. The WAT test structure comprises: a first metal layer, a second metal layer, and a contact hole structure. The first metal layer and the second metal layer are stacked and spaced apart, and are electrically connected to each other through the contact hole structure. The first metal layer includes a common component and multiple test components electrically connected to the common component, with different test components having different areas. In the WAT test structure provided by the present invention, since different test components in the first metal layer have different areas, when different test components are electrically connected to the contact hole structure and electrically conductive to the second metal layer, monitoring the WAT structure will result in different test resistances. Based on the magnitude of the test resistance, the specific test component electrically connected to the contact hole structure can be determined, and the offset state of the first metal layer can be further determined.

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Allwinner Technology's net profit in the first half of the year increased by 35.36% year-on-year, with significant results achieved in its multi-sector intelligent deployment.​


Allwinner Technology released its 2025 semi-annual performance report. During the reporting period, the company achieved operating revenue of 1.337 billion yuan, a year-on-year increase of 25.82%, and net profit attributable to shareholders of the listed company was 161 million yuan, a year-on-year increase of 35.36%, demonstrating strong profitability and growth potential.

The company said that the performance growth was mainly due to the recovery of market demand and the company's active layout and product launch in multiple sub-sectors such as sweeping robots, smart automotive electronics, and smart vision, which drove rapid growth in operating income.

With the rapid development of artificial intelligence technology, terminal devices are increasingly demanding high computing power, heterogeneous computing, and high energy efficiency. Allwinner Technology is actively building a serialized, general-purpose heterogeneous computing platform to promote intelligent upgrades in various fields.

The report shows that the company has continuously optimized system scheduling algorithms on mass-produced platforms such as the A527, A537, and A733, improving scenario performance and energy efficiency, further enhancing product competitiveness. The A527 entered industry-leading mass production last year, and the T527V automotive product has completed solution development and entered pilot production. The high-end A733 octa-core platform chip is not only in mass production in the tablet market, but has also been successfully expanded into multiple application scenarios, including commercial displays, cash registers, and educational tablets, signaling the maturity of the company's high-end products.

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Xingji Micro-Equipment's direct-write lithography equipment has been mass-produced and imported into several leading domestic packaging and testing companies.​


According to the official Weibo account of Xingci Micro-Equipment, Hefei Xingci Microelectronics Equipment Co., Ltd. announced that its series of wafer-level and panel-level direct-write lithography equipment for the mid-range field has achieved a major market breakthrough.
The company has signed purchase orders with several leading domestic packaging and testing companies. Its products are primarily used in large-scale chip packaging applications, such as SoW, CIS, and CoWoS-L-like chips. The first batch of equipment is expected to be deployed in customer production lines by the end of this year. This will strongly support the domestic packaging and testing industry in meeting the growing demand for high-performance, large-scale AI chip packaging and accelerate the localization of high-end packaging technology.
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It is reported that the equipment solution launched by Xingji Micro-Equipment can efficiently meet the packaging process's intelligent deflection correction requirements for RDL and PI layers, significantly improving overall packaging yield. This recognition from several leading domestic packaging and testing companies signifies that the product's performance and reliability have reached industry-leading levels. Based on this, combined with current market feedback and business plans, Xingji Micro-Equipment anticipates continued order growth from the end of this year into next year, potentially reaching a new level of scale.

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Foshan Semiconductor Industrial Park will welcome the first batch of companies to settle in and start trial operation​


Located in the Nanhai Park of Foshan High-tech Zone, this industrial park, developed by the Guangdong Zhongke Semiconductor Micro-Nano Manufacturing Technology Research Institute, will begin construction in 2023. It has a planned construction area of 60,000 square meters, including 32,000 square meters of cleanroom facilities and 19,000 square meters of office and incubation buildings. Its strategic positioning is clear: to create a specialized semiconductor industrial park, a rare example in South China, dedicated to chip manufacturers. This will foster the clustering of chip manufacturers, establish a core engine attracting upstream and downstream players in the semiconductor industry chain, and ultimately form a closed-loop industrial ecosystem.

Guangdong Zhongke Semiconductor Micro-Nano Manufacturing Technology Research Institute has built two major concept verification and product pilot platforms: "semiconductor micro-nano processing, semiconductor material epitaxy and characterization".

Serving as a solid foundation for the development of the industrial park, the Guangdong Micro-Nano Institute, a provincial-level public institution jointly established by the Foshan Municipal and Nanhai District governments and supported by the Suzhou Institute of Nanotechnology, Chinese Academy of Sciences, has established two proof-of-concept and product pilot platforms: semiconductor micro-nano fabrication and semiconductor material epitaxy and characterization. These platforms are complemented by key facilities such as hazardous chemical storage and a specialty gas station. Addressing the challenges commonly faced by small and medium-sized enterprises and talent teams, such as high fixed asset investment and long product verification cycles, the platform has served over 250 organizations in 23 provinces and municipalities nationwide, significantly accelerating the commercialization of scientific and technological achievements.

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